Patents by Inventor Junji HOBO

Junji HOBO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11373021
    Abstract: A simulation method includes setting a density of a conversion layer which is formed in a medium which has a thermal expansion layer which expands with heat and converts electromagnetic waves into heat, deriving a temperature of the conversion layer which is obtained in a case where the conversion layer which has the set density is irradiated with the electromagnetic waves, executing a simulation relating to heat conduction which takes place in a direction along a surface of the medium in the medium on the basis of a condition which is defined in accordance with the medium and correcting the derived temperature on the basis of a result of execution of the simulation, and deriving an expansion height up to which the medium expands in a case where the medium is heated at the corrected temperature.
    Type: Grant
    Filed: January 22, 2020
    Date of Patent: June 28, 2022
    Assignee: CASIO COMPUTER CO., LTD.
    Inventors: Takao Semba, Junji Hobo
  • Patent number: 10987943
    Abstract: An expansion device includes: a thermal distension unit configured to thermally distend a thermally-expandable sheet by irradiating the thermally-expandable sheet with predetermined energy; a reading unit configured to read identifiers provided at predetermined positions of the thermally-expandable sheet; and a setting unit configured to set an amount of energy per unit area to be emitted on the thermally-expandable sheet by the thermal distension unit depending on whether (i) a second identifier as well as a first identifier has been read, or (ii) whether a predetermined part of the first identifier has been read but another part has not been read, as a result of reading the identifiers by the reading unit.
    Type: Grant
    Filed: July 9, 2018
    Date of Patent: April 27, 2021
    Assignee: CASIO COMPUTER CO., LTD.
    Inventors: Kouichi Numao, Takao Semba, Koji Tamura, Junji Hobo, Takayuki Fukushima
  • Publication number: 20200250361
    Abstract: A simulation method includes setting a density of a conversion layer which is formed in a medium which has a thermal expansion layer which expands with heat and converts electromagnetic waves into heat, deriving a temperature of the conversion layer which is obtained in a case where the conversion layer which has the set density is irradiated with the electromagnetic waves, executing a simulation relating to heat conduction which takes place in a direction along a surface of the medium in the medium on the basis of a condition which is defined in accordance with the medium and correcting the derived temperature on the basis of a result of execution of the simulation, and deriving an expansion height up to which the medium expands in a case where the medium is heated at the corrected temperature.
    Type: Application
    Filed: January 22, 2020
    Publication date: August 6, 2020
    Applicant: CASIO COMPUTER CO., LTD.
    Inventors: Takao SEMBA, Junji HOBO
  • Publication number: 20190023026
    Abstract: An expansion device includes: a thermal distension unit configured to thermally distend a thermally-expandable sheet by irradiating the thermally-expandable sheet with predetermined energy; a reading unit configured to read identifiers provided at predetermined positions of the thermally-expandable sheet; and a setting unit configured to set an amount of energy per unit area to be emitted on the thermally-expandable sheet by the thermal distension unit depending on whether (i) a second identifier as well as a first identifier has been read, or (ii) whether a predetermined part of the first identifier has been read but another part has not been read, as a result of reading the identifiers by the reading unit.
    Type: Application
    Filed: July 9, 2018
    Publication date: January 24, 2019
    Applicant: CASIO COMPUTER CO., LTD.
    Inventors: Kouichi NUMAO, Takao SEMBA, Koji TAMURA, Junji HOBO, Takayuki FUKUSHIMA