Abstract: A units of red {u1-uA}, B units of green {v1-vB} and C units of blue {w1-wC} are sampled and measurements are performed, and an interpolation equation is found from the A×B×C units of data in three-dimensions (L*, a*, b*) that are obtained. Firstly, A units of point sequence data in 3×B×C dimensions are least squares approximated for the parameters u, and Mu control points in 3×B×C dimensions are found. Then, B units of point sequence data in 3×C×Mu dimensions are least squares approximated for the parameters v, and Mv control points in 3×C×Mu dimensions are found. Next, C units of point sequence data in 3×Mu×Mv dimensions are least squares approximated for the parameters w, and Mw control points in 3×Mu×Mv dimensions are found. Then, output values (L*,a*,b*) corresponding to arbitrary input values (Red,Green,Blue) can be obtained by an interpolation equation according to Mu×Mv×Mw final control points in three dimensions and basis functions used in the least squares approximations.

Abstract: A three-dimensional model modification system for modifying a three-dimensional model, defined by a plurality of surfaces and representing an arbitrary object is disclosed.

Abstract: A units of red {u1-uA}, B units of green {v1-vB} and C units of blue {w1-wC} are sampled and measurements are performed, and an interpolation equation is found from the A×B×C units of data in three-dimensions (L*, a*, b*) that are obtained. Firstly, A units of point sequence data in 3×B×C dimensions are least squares approximated for the parameters u, and Mu control points in 3×B×C dimensions are found. Then, B units of point sequence data in 3×C×Mu dimensions are least squares approximated for the parameters v, and My control points in 3×C×Mu dimensions are found. Next, C units of point sequence data in 3×Mu×Mv dimensions are least squares approximated for the parameters w, and Mw control points in 3×Mu×Mv dimensions are found. Then, output values (L*,a*,b*) corresponding to arbitrary input values (Red,Green,Blue) can be obtained by an interpolation equation according to Mu×Mv×Mw final control points in three dimensions and basis functions used in the least squares approximations.

Abstract: A three-dimensional model modification system for modifying a three-dimensional model, defined by a plurality of surfaces and representing an arbitrary object is disclosed.

Abstract: The invention relates to an IC socket, and more particularly an IC socket comprising a socket base plate having contacts on which the IC lead wires of the mounted IC are mounted and contacted, a pushing cover to be closed against the socket base plate through IC, and a pushing member for pressing the IC lead wires against the contacts in response to the closing operation of the pushing cover. Means for making a positive prevention of the displacements of the pushing positions of the IC lead wires by the pushing member is provided, that is, the pushing cover is rotatably supported on the socket base plate, the pushing member is supported on the socket base plate separate from the pushing cover and the pivoting shaft is supported in a longitudinal hole extending in a vertical direction and the pushing cover can be rotated and moved up and down vertically.

Abstract: This invention relates to an IC socket, and more particularly an IC socket comprising a socket base plate having contacts on which the IC lead wires of the mounted IC are mounted and contacted, a pushing cover to be closed against the socket base plate through IC, and a pushing member for pressing the IC lead wires against the contacts in response to the closing operation of the pushing cover. Means for making a positive prevention of the displacements of the pushing positions of the IC lead wires by the pushing member is provided, that is, the pushing cover is rotatably supported on the socket base plate, the pushing member is supported on the socket base plate separate from the pushing cover and the pivoting shaft is supported in a longitudinal hole extending in a vertical direction and the pushing cover can be rotated and moved up and down vertically.

Abstract: An IC socket includes a socket body having a plurality of contacts arranged in such a manner as to contact terminal members of an IC package. A contact shutter member is vertically movably mounted on the socket body and adapted, when lowering, to push the contacts against their elastic property so that the contacts will be displaced backward and downward to remove the contact relation.

Abstract: A socket for the use of an electric part has contacts disposed in such a manner as to contact with contact pieces or leads of an electric part and a stage with the electric part supported thereon and able to move between a lower position where the contact pieces are brought into contact with the contacts and an upper position where the contact pieces are brought out of contact with the contacts. The socket further has a swingable crankshaft as means for restraining the stage in the upper or lower position. The crankshaft is provided with a crank bar portion disposed in such a manner as to vertically move upward and downward while supporting the stage and to push up the stage during a raising movement thereof and a crank arm portion which is swung about the crank bar portion and engaged with lock means thereby to restrain the stage in the upper and lower positions.

Abstract: An IC socket has an IC supporting means which can be moved between an upper and a lower positions with an IC mounted on it, a first spring means for energizing the IC supporting means so that the IC supporting means is pushed up to the upper position, a contact for contacting with a lead of the IC when the IC supporting means is moved to the lower position against the force of the first spring means, an IC vertical movement operating means which can be moved between the upper and lower positions and adapted to push down the IC supporting means against the first spring means, a second spring means for energizing the IC vertical movement operating means so as to push up the same to the upper position, and a lock means for retaining the IC supporting means to the lower position against the force of the first spring means by the vertical movement operation of the IC vertical movement operating means against the force of the second spring means or in accordance with the force of the second spring so that the IC is