Abstract: A wafer storage container cleaning device according to an embodiment includes a first inspection unit that inspects a grip target portion of a wafer storage container; a cleaning unit that cleans a storage space storing the wafer, in the container; a second inspection unit that inspects the storage space; a robot that conveys the container from the first inspection unit to the cleaning unit and conveys the container from the cleaning unit to the second inspection unit; and a control unit that controls the robot. The control unit controls the robot to convey the container from the first inspection unit to the cleaning unit when the container is determined to be in a usable state, and controls the robot to convey the container from the first inspection unit to a position different from that of the cleaning unit when the container is determined not to be in the usable state.

Abstract: According to one embodiment, a transfer apparatus includes: a transfer robot transferring a shell of a wafer storage container to a placement table including a positioning member. The transfer robot includes a gripping unit with a pair of shell gripping claws that grips a flange of the shell, and a support member contactable with the shell at a different position from the flange. The support member supports the shell such that in a state where the flange is gripped by the shell gripping claws, and the placement target surface of the shell faces downward, the placement target surface has a posture placeable on the placement surface of the placement table via the positioning member. The transfer robot transfers the shell to the placement table in a state where the flange is gripped by the shell gripping claws, and the shell is supported by the support member.

Abstract: According to one embodiment of the present disclosure, a wafer storage container cleaning apparatus includes a cleaning chamber that cleans a wafer storage container including a shell including an opening on one surface and a gripped portion on another surface crossing the one surface with the opening, and a door detachable from the opening; and a transfer robot including a robot hand that individually grips the shell and the door. The robot hand includes a shell gripping portion including a pair of first gripping claws that are movable toward and away from each other along a first straight line; and a door gripping portion including a pair of second gripping claws movable toward and away from each other along a second straight line intersecting the first straight line in a top view. The cleaning chamber cleans the shell with the opening facing downward.

Abstract: According to one embodiment, a wafer storage container processing apparatus that processes a wafer storage container including a body having a storage space connected to an opening and a door detachable from the opening, includes a stage having a disposition surface on which the wafer storage container is disposed; and a gas supply configured to supply an inert gas to the wafer storage container disposed on the stage. The stage disposes the wafer storage container such that the door is disposed on the disposition surface in a state where the door is attached to the body, and the gas supply supplies the inert gas through a gas supply port provided on an intersecting surface of the body that intersects a surface having the opening.

Abstract: According to one embodiment of the present disclosure, a wafer storage container cleaning apparatus includes a cleaning chamber that cleans a wafer storage container. The cleaning chamber includes: a chamber that accommodates a shell of the wafer storage container, and capable of being opened and closed by an opening/closing lid via a hinge; a door holder that holds the door; a cleaning nozzle that supplies a cleaning liquid to the shell and the door; a rotation mechanism that rotates the shell and the door; a circular frame that surrounds an outside of the door and has a height that covers a part of the thickness of the door; and an inclined cover that is provided to be inclined such that an end opposite the hinge is the lowest and is higher toward the circular frame, and guides the cleaning liquid supplied to the door and scattered thereon.

Abstract: According to one embodiment of the present disclosure, a drying apparatus includes a drying chamber that holds a drying processing target in an inside thereof, a decompression device that decompresses the inside of the drying chamber; and a controller that controls the decompression device to decompress the inside of the drying chamber, thereby executing a drying processing of evaporating and removing moisture from the drying processing target. The controller executes, after the drying processing, an additional decompression processing of lowering a pressure of the inside of the drying chamber below a pressure at a time of the drying processing, for a predetermined time and determines a dry condition of the drying processing target based on a pressure of the inside of the drying chamber that has been reached after the additional decompression processing.

Abstract: According to one embodiment of the present disclosure, a wafer storage container drying apparatus includes a drying tank for drying a wafer storage container that has a storage space connected to an opening and configured to store a wafer, and includes a body including a flange gripped by a robot, and a door installed to be openable and closable with respect to the opening, wherein the drying tank includes a carrying-in/out port configured to be openable and closable by an opening and closing cover, a body receiver configured to receive the body of the wafer storage container in a state where the flange faces the carrying-in/out port; and a door holder configured to hold the door such that each side of the door is neither orthogonal nor parallel to one side that forms the carrying-in/out port, when the drying tank is viewed in a plan view.

Abstract: According to an embodiment of the present disclosure, the cleaning apparatus includes a cleaning tank body having a body opening and a cleaning space; a lid provided to be openable and closable with respect to the body opening; a mounting stage provided in the cleaning space placing a shell of a wafer storage container; a first ejector that ejects a cleaning liquid into a storage space of the shell; a second ejector that ejects the cleaning liquid into an outer portion of the shell; a first discharge port that discharges the cleaning liquid ejected into the storage space of the shell; a second discharge port that discharges the cleaning liquid that has passed through the outer portion of the shell; and a particle counter that measures particles in the cleaning liquid discharged by the first discharge port.

Abstract: Provided is a maintenance method of a heat treatment apparatus including a chamber having a box shape and provided with a heater and a receiving member that supports a cassette having a box shape including a space in which a workpiece is supported. The maintenance method includes: attaching a loading/unloading jig including a roller on an upper portion and capable of moving the roller upward and downward, to the receiving member; transmitting the cassette supported by the receiving member onto the roller by raising the loading/unloading jig; unloading the cassette to an outside of the chamber by moving the cassette on the roller; loading the cassette into the chamber by moving the cassette on the roller; transmitting the cassette to the receiving member by lowering the loading/unloading jig; and detaching the loading/unloading jig from the receiving member.

Abstract: A die with alignment mechanism includes a die including a through-hole through which a traveling wire travels, a bearing member for rotationally moving the die in a circumferential direction of the traveling wire, and a movable member that moves the die so that a central axis of the through-hole is aligned with a travel direction of the traveling wire without inhibiting the rotational movement of the die produced by the bearing member when the travel direction changes in a direction orthogonal to the travel direction.

Abstract: A die with alignment mechanism includes a die including a through-hole through which a traveling wire travels, a bearing member for rotationally moving the die in a circumferential direction of the traveling wire, and a movable member that moves the die so that a central axis of the through-hole is aligned with a travel direction of the traveling wire without inhibiting the rotational movement of the die produced by the bearing member when the travel direction changes in a direction orthogonal to the travel direction.

Abstract: A power tool (10) may include a motor (11) accommodated within a housing (12). An adapter (32) may be attached to the housing. A connector fitting portion or insert (34) may be defined in a projecting portion of the adapter and the projecting portion may extend from the housing. A power cord (61) may be removably connected to the connector fitting portion. The power cord may include a cord fitting portion or plug (62), which fits into the connector fitting portion. By inserting the cord fitting portion into the connector fitting portion, the power cord can be removably connected to the connector fitting portion. The motor may be electrically connected to a commercial power source by connecting one end of the power cord to the connector fitting portion and by connecting the other end of the power cord to the commercial power source.

Abstract: A portable telephone having a liquid crystal display with a backlight includes a touch sensor arranged on a side surface of a main body, and an operation unit arranged on a front surface of the main body which has the liquid crystal display to input a telephone number or the like. The portable telephone has two modes, i.e., a touch mode for the touch sensor in lighting the backlight and a key operation mode by the operation unit in lighting the backlight. The backlight is lit in accordance with one of the two modes which is previously selected by a user.

Abstract: A control circuit 7 investigates, based on inputs from an opening/closing condition detecting circuit 3 and a display button switch 1, a radio wave receiving condition when the display button switch 1 is operated while first and second main bodies 8 and 9 are closed, instructs, if although out of bounds is displayed when the display button switch 1 is operated, the display is then changed to within bounds, a sounder 6 to issue an informing sound in order to inform a user of the change in condition and also instructs a display lamp 2 for displaying. The sounder 6 informs the user of the change in condition from out of bounds to within bounds and the display lamp 2 displays within bounds.