Patents by Inventor Junji Isikawa

Junji Isikawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electroless copper plating solution and process for electrolessly plating copper
    Patent number: 4834796
    Abstract: A practically fast electroless copper deposition is obtained by using a trialkanolmonoamine as a complexing agent for copper ion and as an accelerator, by adding it in an excess amount of 1.2 to 30 times the mole concentration of the copper ion. An optimum increased deposition rate of 100 .mu.m/hr is obtained even if additives such as potassium ferrocyanide, 2,2'-bipyridyl, polyethylenegrycol and an anionic surfactant are added.
    Type: Grant
    Filed: November 5, 1987
    Date of Patent: May 30, 1989
    Assignee: Nippondenso Co., Ltd.
    Inventors: Koji Kondo, Katuhiko Murakawa, Kaoru Nomoto, Futoshi Ishikawa, Nobumasa Isida, Junji Isikawa