Abstract: There is disclosed a static pressure bearing which is provided with plural fluid supplying pads for supplying a fluid in a gap between a guide member and a bearing member whereby the ratio of the change of pressure of the fluid supplied from the pads to the change in the gap is regulatable.

Abstract: An aligning system for aligning a first object and second object with each other by moving them as a unit through a fluid bearing is adapted to accomplish a coarse alignment by displacing the first and second objects relative to each other and to attain a fine alignment by controlling the supply of pressure to the fluid bearing.

Abstract: Disclosed is an apparatus for exposing a wafer to a projected image of a mask, and including a mask holder for holding the mask, a wafer holder for holding the wafer, a projection optical system for projecting the image of the mask upon the wafer, a guide path extending along a scanning direction, a plurality of sliders sliding on the guide path, a movable member coupling the mask holder and the wafer holder and placed on the sliders, a heater for compensating for the magnification error of the image in a direction orthogonal to the scanning direction attributable to the projection optical system and for producing a temperature distribution in one of the mask and the wafer, and a controller for compensating for the magnification error of the image in the scanning direction and the error of right angle attributable to the guide path and for controlling the posture of the movable member during the movement thereof.

Abstract: A projection-printing apparatus moves at least one of a mask and a wafer with precise rectilinearity along a guide relative to an optical system for projecting the image of the mask upon the wafer, and in a plane perpendicular to the optical axis of the optical system whereby the image of the mask is printed on the wafer.

Abstract: An automatic wafer orienting apparatus comprising a first orienting device for driving and rotating a wafer thereby orienting the wafer while utilizing a peripheral edge and an orientation cut thereof as the guide, a device for disengaging the thus oriented wafer from the first wafer orienting device, and a second wafer orienting device for re-orienting the wafer by pressing a lateral edge and an orientation cut thereof against orienting members provided on a wafer chuck.

Abstract: A projection exposure apparatus in which a mask and a wafer are displaced in a plane perpendicular to the optical axis of the projection optical system to form circuit patterns on the entire surface of the wafer. The mask and wafer are displaced along guides having two guide rails between which are provided means for compensating for non-linearity of one of the guide rails.

Abstract: An apparatus for automatically orienting wafers of semiconductive material to a desired position individually, each wafer having a round periphery provided with a linear or recessed portion formed therein and with a pair of resultant edges formed at the points of intersection between that portion and the other portion to serve as a distinctive physical feature with which a mechanism interacts to impart an orientation to the wafer in cooperation with an idler.