Abstract: A clamp includes (a) a first engager that engages with engagement parts formed at ends of the tiebars at the moving platen side after moving the moving platen in the fixed platen direction to close a die or mold, in the tiebar insertion holes of the moving platen, (b) a second engager that engages with engagement parts formed at ends of the tiebars at the fixed platen sides detachably at ends of clamping pistons using a detachable engager, (c) a pushing device that cooperates with the tiebars and pushes the moving platen after die or mold closing against the fixed platen in the tiebar insertion holes of the fixed platen, and (d) a tiebar inserting and extracting device coupled with ends of the tiebars at the fixed platen sides at a side of the fixed platen opposite to the die or mold mounting surface.

Abstract: The semiconductor element according to an aspect of the present invention is a solid-state imaging element formed on a semiconductor substrate, having an overflow drain structure for draining excessive charges generated in photoelectric conversion elements, and reading out signal charges accumulated in the photoelectric conversion elements to a vertical transfer unit via a readout gate electrode. The solid-state imaging element includes: a first voltage generating circuit which applies, to the semiconductor substrate, substrate voltage defining the height of overflow barrier in the overflow drain structure; and a second voltage generating circuit which selectively generates first voltage and second voltage each including the height of pulse wave superimposed onto the substrate voltage, at a time when readout pulse to be applied to the readout gate electrode is generated.

Abstract: A clamp includes (a) a first engager that engages with engagement parts formed at ends of the tiebars at the moving platen side after moving the moving platen in the fixed platen direction to close a die or mold, in the tiebar insertion holes of the moving platen, (b) a second engager that engages with engagement parts formed at ends of the tiebars at the fixed platen sides detachably at ends of clamping pistons using a detachable engager, (c) a pushing device that cooperates with the tiebars and pushes the moving platen after die or mold closing against the fixed platen in the tiebar insertion holes of the fixed platen, and (d) a tiebar inserting and extracting device coupled with ends of the tiebars at the fixed platen sides at a side of the fixed platen opposite to the die or mold mounting surface.

Abstract: A movable platen (4) capable of advance and retraction with respect to a fixed plate is provided with a tie bar connecting device (12) for meshing a split nut (18) with the multiple groove portion (16) of a tie bar (10), and a mold clamping cylinder (20) operable with the split nut (18) serving as a reaction force point. The mold clamping cylinder (20) comprises a primary piston (22) contacting the split nut (18) and a secondary piston (24) movable relative to the primary piston (22). It is arranged that the movable platen (4) is stopped just before the position at which the movable mold contacts the fixed mold, and in this state the split nut (18) is reliably meshed with the multiple groove portion (16). Thereafter, the secondary piston (24) and primary piston (22) are moved integrally with respect to the movable platen (4) so as to effect mold contacting and mold clamping. After molding, the secondary piston (24) and the primary piston (22) are relatively moved to effect mold release.

Abstract: A movable platen (4) capable of advance and retraction with respect to a fixed plate is provided with a tie bar connecting device (12) for meshing a split nut (18) with the multiple groove portion (16) of a tie bar (10), and a mold clamping cylinder (20) operable with the split nut (18) serving as a reaction force point. The mold clamping cylinder (20) comprises a primary piston (22) contacting the split nut (18) and a secondary piston (24) movable relative to the primary piston (22). It is arranged that the movable platen (4) is stopped just before the position at which the movable mold contacts the fixed mold, and in this state the split nut (18) is reliably meshed with the multiple groove portion (16). Thereafter, the secondary piston (24) and primary piston (22) are moved integrally with respect to the movable platen (4) so as to effect mold contacting and mold clamping. After molding, the secondary piston (24) and the primary piston (22) are relatively moved to effect mold release.