Abstract: A device capable of performing surface treatment evenly to an upper portion of a substrate is provided. An upper end of a substrate 54 is sandwiched and held by a clip 52 of a hanger 50. A pipe 56 as a treatment solution releasing section is provided on each side of the substrate 54 that is held by the hanger 50. This pipe 56 is provided with a hole 58 from which the treatment solution is released obliquely upward. The released treatment solution flows down on a surface of the substrate 54, reaches a lower portion thereof, is circulated by a pump 60, and is released from the pipe 56 again.

Abstract: A device capable of performing surface treatment evenly to an upper portion of a substrate is provided. An upper end of a substrate 54 is sandwiched and held by a clip 52 of a hanger 50. A pipe 56 as a treatment solution releasing section is provided on each side of the substrate 54 that is held by the hanger 50. This pipe 56 is provided with a hole 58 from which the treatment solution is released obliquely upward. The released treatment solution flows down on a surface of the substrate 54, reaches a lower portion thereof, is circulated by a pump 60, and is released from the pipe 56 again.

Abstract: To prevent a plate-like work in a plating tank from swinging to improve quality of plating and prevent dropout or damages of a printed circuit board during transportation. A plating tank 2a includes an upper guide rail 11 that is provided above the plating tank 2a and transports a transport hanger 15a in a moving direction and a lower guide rail 14 that is provided inside the plating tank 2a and generates an attractive force against a lower clamp 49 of the transport hanger 15a. In the plating tank 2a, an attractive force is generated while performing plate processing to pull the lower clamp 49 of the transport hanger 15a downward, thereby giving tension to a plate-like work W.

Abstract: An tank such as an electroless copper plating tank 200, includes a liquid squirting part 4 having a squirt port 6 for squirting the processing solution Q from the squirt port 6 toward the treatment object obliquely upward to a horizontal plane, and hitting the processing solution Q on the upper area of the plate-like work 10 so that the processing solution Q runs down the plate-like work 10.

Abstract: An tank such as an electroless copper plating tank 200, includes a liquid squirting part 4 having a squirt port 6 for squirting the processing solution Q from the squirt port 6 toward the treatment object obliquely upward to a horizontal plane, and hitting the processing solution Q on the upper area of the plate-like work 10 so that the processing solution Q runs down the plate-like work 10.

Abstract: To prevent a plate-like work in a plating tank from swinging to improve quality of plating and prevent dropout or damages of a printed circuit board during transportation. A plating tank 2a includes an upper guide rail 11 that is provided above the plating tank 2a and transports a transport hanger 15a in a moving direction and a lower guide rail 14 that is provided inside the plating tank 2a and generates an attractive force against a lower clamp 49 of the transport hanger 15a. In the plating tank 2a, an attractive force is generated while performing plate processing to pull the lower clamp 49 of the transport hanger 15a downward, thereby giving tension to a plate-like work W.

Abstract: Provides a plating tank that can transport platy work securely without causing abrasion and attain uniform plating quality and uniform plating film thickness. The shields are comprised of four shielding plates 108, 109, 112, and 113 on upper part and lower part of the thin plate board as follows. The restrict roller 304 is comprised of the roller stand body 120 which reaches until nearly upper end area's height of thin plate board and stood on upper face of the lower shielding plates 108, and the work-end deviation preventing member 122.