Patents by Inventor Junji Ohno

Junji Ohno has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 4475007
    Abstract: A method for mounting a semiconductor chip to a supporting member in producing an integrated circuit, and a semiconductor chip supporting member used in this method, wherein the chip-mounting member having a chip-mounting surface with waved peripheral edge pattern is prepared, and a semiconductor chip is mounted onto this chip-mounting surface via a solder preform, and then the resulting assembly is subjected to a heat treatment to melt this solder. Whereupon, even when the semiconductor chip is placed at an eccentric position deviating from the central position of the mounting surface, it is pulled back toward substantially the required central position by virtue of the surface tension of the molten solder.
    Type: Grant
    Filed: July 8, 1981
    Date of Patent: October 2, 1984
    Assignee: Nippon Gakki Seizo Kabushiki Kaisha
    Inventor: Junji Ohno
  • Patent number: D349110
    Type: Grant
    Filed: December 22, 1992
    Date of Patent: July 26, 1994
    Assignee: Casio Computer Co., Ltd.
    Inventor: Junji Ohno
  • Patent number: D353614
    Type: Grant
    Filed: June 25, 1992
    Date of Patent: December 20, 1994
    Assignee: Casio Computer Co., Ltd.
    Inventors: Junji Ohno, Yukinori Ido