Abstract: A resin molded portion 5 is provided with a first protruding molded portion 17 that protrudes from a first inclination portion 11 and a second protruding molded portion 18 that protrudes from a second inclination portion 12. The first protruding molded portion 17 and the second protruding molded portion 18 are diced along dicing lines DL in the same manner as a wiring substrate 1 so that a first protruding portion 17b and a second protruding portion 18b are formed on the first inclination portion 11 and the second inclination portion 12, respectively. The first protruding portion 17b and the second protruding portion 18b have flat portions 17s and 18s in the direction perpendicular to the plane surface of the wiring substrate 1.

Abstract: An integral-detem-type optical semiconductor device employing lead frame(s) 11, shield case region(s) 111 created by bending portion(s) of lead frame(s) 11 extending to the exterior being disposed between light-emitting lens portion(s) 19 and light-receiving lens portion(s) 18 of resin package(s) 17 produced as a result of encapsulation by translucent resin(s).

Abstract: A semiconductor device which includes: a semiconductor chip bonded to a surface of a solid device; and a stiffener surrounding the periphery of the semiconductor chip. A surface of the stiffener opposite from the solid device is generally flush with a surface of the semiconductor chip opposite from the solid device.

Abstract: A resin molded portion 5 is provided with a first protruding molded portion 17 that protrudes from a first inclination portion 11 and a second protruding molded portion 18 that protrudes from a second inclination portion 12. The first protruding molded portion 17 and the second protruding molded portion 18 are diced along dicing lines DL in the same manner as a wiring substrate 1 so that a first protruding portion 17b and a second protruding portion 18b are formed on the first inclination portion 11 and the second inclination portion 12, respectively. The first protruding portion 17b and the second protruding portion 18b have flat portions 17s and 18s in the direction perpendicular to the plane surface of the wiring substrate 1.

Abstract: A semiconductor device which includes: a semiconductor chip bonded to a surface of a solid device; and a stiffener surrounding the periphery of the semiconductor chip. A surface of the stiffener opposite from the solid device is generally flush with a surface of the semiconductor chip opposite from the solid device.

Abstract: A semiconductor device which includes: a semiconductor chip bonded to a surface of a solid device; and a stiffener surrounding the periphery of the semiconductor chip. A surface of the stiffener opposite from the solid device is generally flush with a surface of the semiconductor chip opposite from the solid device.

Abstract: An integral-detem-type optical semiconductor device employing lead frame(s) 11, shield case region(s) 111 created by bending portion(s) of lead frame(s) 11 extending to the exterior being disposed between light-emitting lens portion(s) 19 and light-receiving lens portion(s) 18 of resin package(s) 17 produced as a result of encapsulation by translucent resin(s).

Abstract: Provided is a semiconductor apparatus manufacturing method capable of severing a base material without producing burrs. A multiplicity of semiconductor apparatuses are produced as follows. A multi-segment base material is obtained by mounting a multiplicity of semiconductor chips on a substrate having a wiring pattern, followed by sealing the semiconductor chips with resin, further followed by attaching a terminal portion having a terminal hole to a back surface of the substrate. A filler is charged in each terminal hole, and, after curing the filler, the base material is severed along a cutting line covering the terminal hole, whereupon the multi-segment base material is divided into separate semiconductor apparatuses. The terminal hole is left exposed along the cut surface of the semiconductor apparatus. Chilled water is applied to the filler filled in the terminal hole to remove it from the terminal hole.

Abstract: A semiconductor device which includes: a semiconductor chip bonded to a surface of a solid device; and a stiffener surrounding the periphery of the semiconductor chip. A surface of the stiffener opposite from the solid device is generally flush with a surface of the semiconductor chip opposite from the solid device.

Abstract: A semiconductor device which includes: a semiconductor chip bonded to a surface of a solid device; and a stiffener surrounding the periphery of the semiconductor chip. A surface of the stiffener opposite from the solid device is generally flush with a surface of the semiconductor chip opposite from the solid device.

Abstract: Provided is a semiconductor apparatus manufacturing method capable of severing a base material without producing burrs. A multiplicity of semiconductor apparatuses are produced as follows. A multi-segment base material is obtained by mounting a multiplicity of semiconductor chips on a substrate having a wiring pattern, followed by sealing the semiconductor chips with resin, further followed by attaching a terminal portion having a terminal hole to a back surface of the substrate. A filler is charged in each terminal hole, and, after curing the filler, the base material is severed along a cutting line covering the terminal hole, whereupon the multi-segment base material is divided into separate semiconductor apparatuses. The terminal hole is left exposed along the cut surface of the semiconductor apparatus. Chilled water is applied to the filler filled in the terminal hole to remove it from the terminal hole.

Abstract: A semiconductor device which includes: a semiconductor chip bonded to a surface of a solid device; and a stiffener surrounding the periphery of the semiconductor chip. A surface of the stiffener opposite from the solid device is generally flush with a surface of the semiconductor chip opposite from the solid device.