Abstract: Disclosed is a laser processing device including a laser light source configured to output laser light, a converging unit configured to converge the laser light toward a first surface to form a converging point, a camera configured to image reflected light of the laser light from the first surface, a spatial light modulator for modulating the laser light according to a modulation pattern, and a controller configured to execute acquisition processing of applying the laser light to the first surface by controlling the laser light source and imaging the reflected light by controlling the camera to acquire a reflectance of the first surface for the first wavelength.

Abstract: A laser processing apparatus includes a support portion, a laser processing head, a vertical movement mechanism, a horizontal movement mechanism, and a controller. The controller controls starting and stopping of emission of a laser light from the laser processing head based on rotation information in a state where a focusing point is positioned at a position along a circumferential edge of an effective region in a target, while rotating the support portion, to perform a circumferential edge process for forming a modified region along the circumferential edge of the effective region in the target.

Abstract: A laser processing apparatus includes a support portion, a laser processing head, a vertical movement mechanism, a horizontal movement mechanism, and a controller. The controller controls starting and stopping of emission of a laser light from the laser processing head based on rotation information in a state where a focusing point is positioned at a position along a circumferential edge of an effective region in a target, while rotating the support portion, to perform a circumferential edge process for forming a modified region along the circumferential edge of the effective region in the target.

Abstract: A laser processing device includes a support unit, a laser light source, a reflecting spatial light modulator, a light collection optical system, an imaging optical system, a mirror, a first sensor configured to acquire displacement data on a laser light entry surface, and a second sensor configured to acquire displacement data on the laser light entry surface. An optical path of the laser light extending from the mirror to the light collection optical system is set along a first direction. An optical path of the laser light extending from the reflecting spatial light modulator to the mirror through the imaging optical system is set along a second direction. The first sensor is disposed on one side of the light collection optical system in a third direction.

Abstract: A laser processing method includes a first step of emitting measurement laser light of a first wavelength from the reference surface side to a reference object having a reference surface of which reflectance for the first wavelength is known to obtain a reference light amount as a reflected light amount of the measurement laser light on the reference surface, a second step of emitting the measurement laser light from the first surface side to the object to be processed to obtain a first light amount as a reflected light amount of the measurement laser light on the first surface, and a third step of, after the first step and the second step, calculating a reflectance of the first surface for the first wavelength based on a reflectance of the reference object, the reference light amount, and the first light amount.

Abstract: A laser light irradiation device includes: a laser light source; a spatial light modulator including a display unit, the spatial light modulator modulating the laser light in accordance with a phase pattern displayed on the display unit; a beam diameter conversion mechanism arranged on an optical path of the laser light between the laser light source and the spatial light modulator, the beam diameter conversion mechanism enlarging or reducing the beam diameter of the laser light; a lens insertion and removal mechanism including a lens configured to vary the beam diameter of the laser light, the lens insertion and removal mechanism being enabled to insert/remove the lens in/from the optical path; and a controller configured to control the phase pattern to be displayed. The controller displays the phase pattern configured to correct a wavefront aberration caused by insertion or removal of the lens.

Abstract: There is provided a laser light irradiating device that includes a spatial light modulator configured to modulate laser light output from a laser light source according to a phase pattern and emit the modulated laser light, an objective lens configured to converge the laser light emitted from the spatial light modulator onto the object, a focusing lens arranged between the spatial light modulator and the objective lens in an optical path of the laser light and configured to focus the laser light, and a slit member arranged at a focal position on a rear side of the focusing lens in the optical path of the laser light and configured to block a part of the laser light.

Abstract: A distance measurement unit includes: a distance measurement light source that outputs distance measurement light; an objective lens through which the distance measurement light and reflected light are transmitted; an imaging lens through which the reflected light is transmitted and which forms an image at an imaging position; an optical path adjustment unit that adjusts an optical path of the reflected light; and a light detection unit that detects the reflected light. The objective lens allows the distance measurement light to be transmitted therethrough in a state in which an optical path of the distance measurement light is spaced apart from a central axis of the objective lens. The optical path adjustment unit adjusts the optical path so that the imaging position of the reflected light approaches a predetermined plane. A light reception surface of the light detection unit is located to follow along the predetermined plane.

Abstract: A laser processing apparatus includes a support portion, a first laser processing head, a second laser processing head, a first vertical movement mechanism, a second vertical movement mechanism, a first horizontal movement mechanism, a second horizontal movement mechanism, and a controller configured to control rotation of the support portion, emission of a first and a second laser lights from the first and the second laser processing heads, and movement of a first and a second focusing points.

Abstract: A laser processing apparatus includes: a support portion configured to move along a first direction; a first moving portion configured to move along a second direction orthogonal to the first direction; a first attachment portion configured to move along a third direction orthogonal to the first direction and the second direction; a first laser processing head attached to the first attachment portion; a light source unit; and a first mirror attached to the first moving portion. The first laser processing head includes a first entrance portion and a first condensing portion. The light source unit includes a first emission portion. The first mirror is attached to the first moving portion to face the first emission portion in the second direction and face the first entrance portion in the third direction.

Abstract: A laser processing apparatus includes a support portion, a laser processing head, a vertical movement mechanism, a horizontal movement mechanism, and a controller. The controller controls starting and stopping of emission of a laser light from the laser processing head based on rotation information in a state where a focusing point is positioned at a position along a circumferential edge of an effective region in a target, while rotating the support portion, to perform a circumferential edge process for forming a modified region along the circumferential edge of the effective region in the target.

Abstract: A laser processing method includes a laser light emitting step of emitting a pulsed laser light along a line from a back surface of a target having a functional element layer on side of a front surface. The laser light emitting step includes: a first step of irradiating the functional element layer with a first pulsed laser light along the line, to form a weakened region in the functional element layer along the line; and a second step of emitting a second pulsed laser light into the target to follow the first pulsed laser light along the line, to form a crack reaching the front surface along the line in the target. The first pulsed laser light has a pulse width that is shorter than a pulse width of the second pulsed laser light.

Abstract: A laser processing head includes: a housing; an entrance portion; an adjustment portion; and a condensing portion. A distance between a third wall portion and a fourth wall portion facing each other in a second direction is shorter than a distance between a first wall portion and a second wall portion facing each other in a first direction. The housing is configured to be attached to an attachment portion of a laser processing apparatus, with at least one of the first wall portion, the second wall portion, the third wall portion, and a fifth wall portion disposed on the side of the attachment portion. The condensing portion is disposed on a sixth wall portion, and is offset toward the fourth wall portion in the second direction.

Abstract: Disclosed is a laser processing device including a laser light source configured to output laser light, a converging unit configured to converge the laser light toward a first surface to form a converging point, a camera configured to image reflected light of the laser light from the first surface, a spatial light modulator for modulating the laser light according to a modulation pattern, and a controller configured to execute acquisition processing of applying the laser light to the first surface by controlling the laser light source and imaging the reflected light by controlling the camera to acquire a reflectance of the first surface for the first wavelength.