Abstract: The purpose of the present invention is to provide a semiconductor device that is small and has diagnosability, and that can quickly recover from power source malfunctions. Provided is a semiconductor device that includes: a control signal generation circuit that generates control signals which differ according to the fluctuation time of power-source voltage; and a control circuit that changes an operation sequence according to the differences in the control signals.

Abstract: A mechanical quantity measuring device includes: a sensor chip having a strain detector formed on a surface of a semiconductor substrate and a plurality of electrodes connected to the strain detector; a stem having ascot that protrudes from an adjacent peripheral portion and has an upper surface that is attached to a lower surface of the sensor chip by a bonding material formed from a metallic material or a glass material; a lead-out wiring part including a plurality of wires that are electrically connected to the plurality of electrodes; and a fixing part for fixing the stem, wherein: the stem and the fixing part are integrally molded or fixed through metallic bonding or mechanical bonding.

Abstract: A semiconductor device includes a metal body; a bonding layer placed on the metal body; and a semiconductor chip placed on the bonding layer. The bonding layer includes a filler-containing first layer formed between the metal body and the semiconductor chip and a second layer bonded to the first layer and the semiconductor chip. The second layer has a thermal expansion coefficient higher than that of the first layer.

Abstract: In a pressure sensor having a configuration in which strain gauges are provided on a diaphragm, a change in sensor characteristic caused by a positional shift of the strain gauges is suppressed, and a change in sensor output in response to a change in temperature is suppressed.

Abstract: The purpose of the present invention is to provide a semiconductor device that is small and has diagnosability, and that can quickly recover from power source malfunctions. Provided is a semiconductor device that includes: a control signal generation circuit that generates control signals which differ according to the fluctuation time of power-source voltage; and a control circuit that changes an operation sequence according to the differences in the control signals.

Abstract: The purpose of the present invention is to provide a position sensor capable of improving the mounting characteristics of a magnet to a moving body in the axial direction of a shaft or the like. In order to achieve the purpose, this position sensor is provided with a magnetic force sensor and a target mounted on a moving body that moves in the axial direction, wherein the target has a magnet and a magnet base for holding the magnet, and the magnet base has a magnet-holding section and a securing section to the moving body that are integrally formed.

Abstract: A semiconductor device includes a metal body; a bonding layer placed on the metal body; and a semiconductor chip placed on the bonding layer. The bonding layer includes a filler-containing first layer formed between the metal body and the semiconductor chip and a second layer bonded to the first layer and the semiconductor chip. The second layer has a thermal expansion coefficient higher than that of the first layer.

Abstract: The purpose of the present invention is to provide an eddy current position sensor that is less susceptible to the influence of changes in gaps due to installation or changes in temperature, or by changes in coil properties due to changes in temperature. The present invention is configured to detect the position of an object 4 to be measured by detecting the difference in signals from a reference coil 8A and a sensing coil 8B, which are configured such that, even if the object 4 to be measured rotates in a rotation direction 6A, a gap 7A between the reference coil 8A in a sensor 2 and a reference surface 9A on the object 4 to be measured does not change and a gap 7B between the sensing coil 8B and a sensing surface 9B on the object 4 to be measured changes, wherein changes in a gap 7 between the object 4 to be measured and each of coils 8A, 8B are signal output as magnetic field changes.

Abstract: An object of the present invention is to realize a pressure sensor with a small variation in sensor characteristics. The pressure sensor includes a diaphragm having longitudinal and lateral sides, and four strain gauges disposed on the diaphragm. The four strain gauges are arranged at a center of the diaphragm. Two of the four strain gauges are arranged along a lateral direction, and other two strain gauges are arranged along a longitudinal direction.

Abstract: A pressure detecting device is mounted in a measurement target and instrument includes a strain inducer to which pressure of a pressure medium is applied and which generates strain in accordance with the pressure and a strain detecting element that is bonded onto a surface opposite to a pressure receiving surface of the strain inducer, in which the strain detecting element includes one or multiple central strain resistant bridges which are arranged at a central portion of the strain detecting element in a bonded surface direction, and one or multiple outer peripheral strain resistant bridges which are arranged at an outer periphery, and in which, for example, deformation of the strain detecting element caused by an external force when being screw-fixed to the measurement target instrument is obtained through the multiple strain resistant bridges. An error of detection pressure caused by the deformation in a pressure value detected through the central strain resistant bridge is corrected.

Abstract: A mechanical quantity measuring device includes: a sensor chip having a strain detector formed on a surface of a semiconductor substrate and a plurality of electrodes connected to the strain detector; a stem having ascot that protrudes from an adjacent peripheral portion and has an upper surface that is attached to a lower surface of the sensor chip by a bonding material formed from a metallic material or a glass material; a lead-out wiring part including a plurality of wires that are electrically connected to the plurality of electrodes; and a fixing part for fixing the stem, wherein: the stem and the fixing part are integrally molded or fixed through metallic bonding or mechanical bonding.

Abstract: In a pressure sensor having a configuration in which strain gauges are provided on a diaphragm, a change in sensor characteristic caused by a positional shift of the strain gauges is suppressed, and a change in sensor output in response to a change in temperature is suppressed.

Abstract: An object of the present invention is to realize a pressure sensor with a small variation in sensor characteristics. The pressure sensor includes a diaphragm having longitudinal and lateral sides, and four strain gauges disposed on the diaphragm. The four strain gauges are arranged at a center of the diaphragm. Two of the four strain gauges are arranged along a lateral direction, and other two strain gauges are arranged along a longitudinal direction.

Abstract: A pressure detecting device is mounted in a measurement target and instrument includes a strain inducer to which pressure of a pressure medium is applied and which generates strain in accordance with the pressure and a strain detecting element that is bonded onto a surface opposite to a pressure receiving surface of the strain inducer, in which the strain detecting element includes one or multiple central strain resistant bridges which are arranged at a central portion of the strain detecting element in a bonded surface direction, and one or multiple outer peripheral strain resistant bridges which are arranged at an outer periphery, and in which, for example, deformation of the strain detecting element caused by an external force when being screw-fixed to the measurement target instrument is obtained through the multiple strain resistant bridges. An error of detection pressure caused by the deformation in a pressure value detected through the central strain resistant bridge is corrected.

Abstract: The invention provides a hydrogen sensing device capable of preventing sensor sensitivity decreases. A hydrogen sensor 150 detects the hydrogen in an exhaust pipe and is installed in a divergent pipe DP. Flowing through the exhaust pipe is off-gas discharged from the fuel cell of a fuel cell vehicle. In order to decompose the siloxanes contained in the gas, a siloxane decomposing material 130 is placed upstream of the hydrogen sensor 150 inside the divergent pipe DP. Also, an SiO2 capturing material 140 is placed between the siloxane decomposing material 130 and the hydrogen sensor 150, so that the SiO2 capturing material can capture the SiO2 resulting from the decomposition of siloxanes by the siloxane decomposing material 130.

Abstract: An oxygen concentration detecting element including a base member made of an electrically insulating material, a heater disposed on an outer surface of the base member, the heater being adapted to generate heat upon being energized, and an oxygen detecting unit disposed in an offset position on the outer surface of the base member in which the oxygen detecting unit is prevented from overlapping with the heater, the oxygen detecting unit including a solid electrolyte layer and a pair of electrodes between which the solid electrolyte layer is disposed.

Abstract: The invention relates to an oxygen-concentration detecting element including (a) a base member constructed of a first insulating material; (b) an electric heater layer formed on the base member to generate a heat when electrically energized; (c) an oxygen-detecting laminated unit formed on the base member, the unit including a solid electrolyte layer activated by the heat; (d) a printed protecting layer covering the base member, the electric heater layer and the oxygen-detecting laminated unit, being constructed of a mixture of a second insulating material and a solid electrolyte material, and having a porous structure provided with voids derived from a void forming agent contained in an amount of 10-80 volume %, based on a total volume of the second insulating material and the void forming agent, prior to a baking for producing the oxygen concentration detecting element; and (e) a porous protecting layer covering the printed protecting layer.

Abstract: The invention relates to an oxygen-concentration detecting element including (a) a base member of a first insulating material; (b) an electric heater layer formed on the base member to generate a heat when electrically energized; and (c) an oxygen-detecting laminated unit formed on the base member, the unit including a solid electrolyte layer and inner and outer electrodes interposing the solid electrolyte layer therebetween. The inner electrode may be constructed of a noble metal material and voids that are dispersed in the noble metal material and are derived from a void forming agent. The oxygen-concentration detecting element may include a penetration layer for allowing penetration of oxygen therethrough, between the outer surface of the base member and the oxygen-detecting laminated unit. The penetration layer is extended in the axial direction of the base member from the position of the unit.

Abstract: An oxygen concentration detecting element including a base member made of an electrically insulating material, a heater disposed on an outer surface of the base member, the heater being adapted to generate heat upon being energized, and an oxygen detecting unit disposed in an offset position on the outer surface of the base member in which the oxygen detecting unit is prevented from overlapping with the heater, the oxygen detecting unit including a solid electrolyte layer and a pair of electrodes between which the solid electrolyte layer is disposed.