Abstract: A network of a new configuration is flexibly constructed while maintaining a stable operation in the network. A management device includes: a detection unit that detects addition of a function unit to a network including one or a plurality of on-vehicle function units; an acquisition unit that acquires function unit information of a new function unit that is the function unit the addition of which has been detected by the detection unit and function unit information of each on-vehicle function unit, each piece of function unit information including information regarding network configuration of a layer lower than an application layer; and a generation unit that, based on the pieces of function unit information acquired by the acquisition unit, generates configuration information of a new network that is the network further including the new function unit.

Abstract: Provided are an imaging apparatus, a control method for an imaging apparatus, and a control program that can obtain image data with the same image size even with different angle of view sizes. The imaging apparatus includes an image size setting unit configured to set a set image size selected from multiple settable image sizes, an angle of view size setting unit configured to set a set angle of view size selected from multiple settable angle of view sizes that include a first angle of view size and a second angle of view size, and a control unit configured to perform pixel count control on the set image size set by the image size setting unit, to achieve the same or almost the same number of pixels regardless of a difference in the set angle of view size.

Abstract: A damper spring having an excellent fatigue limit is provided. A damper spring according to the present embodiment includes a nitrided layer formed in an outer layer, and a core portion that is further inward than the nitrided layer. The chemical composition of the core portion consists of, in mass%, C: 0.53 to 0.59%, Si: 2.51 to 2.90%, Mn: 0.70 to 0.85%, P: 0.020% or less, 5: 0.020% or less, Cr: 1.40 to 1.70%, Mo: 0.17 to 0.53%, V: 0.23 to 0.33%, Cu: 0.050% or less, Ni: 0.050% or less, Al: 0.0050% or less, Ti: 0.050% or less, N: 0.0070% or less, and Nb: 0 to 0.020%, with the balance being Fe and impurities. In the core portion, a number density of V-based precipitates having a maximum diameter ranging from 2 to 10 nm is 500 to 8000 pieces/?m2.

Abstract: A semiconductor module includes: a semiconductor element; and a sealing member. The semiconductor element includes: a semiconductor substrate; a protection film on the semiconductor substrate; a metal film on the semiconductor substrate and having at least a part located between the semiconductor substrate and the protection film; and a dummy metal film on the semiconductor substrate between the metal film and the protection film. The surface of the semiconductor substrate has a recess. The protection film has an other recess or a hole. The dummy metal film is arranged in both the recess of the semiconductor substrate and the other recess or the hole of the protection film.

Abstract: A vehicle accident prediction system, a vehicle accident prediction method, a vehicle accident prediction program, and a learned model creation system obtain a training data set containing feature group data, which includes a first feature representing an attribute of a driver of a vehicle, a second feature representing a state of the vehicle, and a third feature combining a plurality of second features, and accident data relating to an accident of the vehicle, create, through learning, a learned model that predicts an accident of the vehicle from the feature group data using a plurality of the obtained training data sets, input the feature group data that is to be a prediction target, and predict an accident of the vehicle from the input feature group data using the created learned model.

Abstract: A semiconductor module includes: a semiconductor element; and a sealing member. The semiconductor element includes: a semiconductor substrate; a protection film on the semiconductor substrate; a metal film on the semiconductor substrate and having at least a part located between the semiconductor substrate and the protection film; and a dummy metal film on the semiconductor substrate between the metal film and the protection film. The surface of the semiconductor substrate has a recess. The protection film has an other recess or a hole. The dummy metal film is arranged in both the recess of the semiconductor substrate and the other recess or the hole of the protection film.

Abstract: This invention provides a prophylactic and therapeutic agent for dry eye, having new ingredients to reduce the deterioration of the lacrimal secretory ability and to inhibit the generation of radical oxygen in lacrimal gland tissue. The prophylactic and therapeutic agent for dry eye of this invention contains the maqui berry extract as the active substance of this invention, i.e. containing delphinidin glycoside extracted from the maqui berry and at least one or more of the active substances delphinidin-3-sambubioside-5-glucoside, delphinidin-3,5-diglucoside, delphinidin-3-sambubioside and delphinidin-3-glucoside, preferably delphinidin-3,5-diglucoside.

Abstract: Various embodiments of the present disclosure include a non-volatile memory semiconductor device and a device that uses the same, the semiconductor device including a first semiconductor chip disposed on a substrate, a first sealing resin sealing the first semiconductor chip, a built-in semiconductor device disposed on the first sealing resin, and a second sealing resin sealing the first sealing resin and the built-in semiconductor device and covering a side surface of the substrate. According to an aspect of the present disclosure, it is possible to provide a high-quality semiconductor device, in which downsizing and cost reduction can be realized.

Abstract: An electronic device includes an acoustic component, a first housing component including the acoustic component in the inside and including a cut in a first surface located on an outer side, the cut allowing passage of sound toward the acoustic component or sound emitted from the acoustic component, and a second housing component which is removably attached to a side of the first surface of the first housing component and includes a projection introduced in the cut in a second surface opposed to the first surface. An elastic material is located to close at least a part between an inner surface of the cut and a surface of the projection.

Abstract: An electronic device includes a first accommodation portion to accommodate a first card, a second accommodation portion to accommodate a second card, and a holding member capable of holding the first card and the second card. The first accommodation portion and the second accommodation portion are arranged so that an ejection path of the first card and an ejection path of the second card overlap. The holding member is located in an area where the ejection path of the first card and the ejection path of the second card overlap.

Abstract: An electronic device includes a first accommodation portion to accommodate a first card, a second accommodation portion to accommodate a second card, and a holding member capable of holding the first card and the second card. The first accommodation portion and the second accommodation portion are arranged so that an ejection path of the first card and an ejection path of the second card overlap. The holding member is located in an area where the ejection path of the first card and the ejection path of the second card overlap.

Abstract: Various embodiments of the present invention include a semiconductor device and a fabrication method therefore, the semiconductor device including a first semiconductor chip disposed on a substrate, a first sealing resin sealing the first semiconductor chip, a built-in semiconductor device disposed on the first sealing resin, and a second sealing resin sealing the first sealing resin and the built-in semiconductor device and covering a side surface of the substrate. According to an aspect of the present invention, it is possible to provide a high-quality semiconductor device and a fabrication method therefore, in which downsizing and cost reduction can be realized.

Abstract: An electronic device includes an acoustic component, a first housing component including the acoustic component in the inside and including a cut in a first surface located on an outer side, the cut allowing passage of sound toward the acoustic component or sound emitted from the acoustic component, and a second housing component which is removably attached to a side of the first surface of the first housing component and includes a projection introduced in the cut in a second surface opposed to the first surface. An elastic material is located to close at least a part between an inner surface of the cut and a surface of the projection.

Abstract: This invention provides a prophylactic and therapeutic agent for dry eye, having new ingredients to reduce the deterioration of the lacrimal secretory ability and to inhibit the generation of radical oxygen in lacrimal gland tissue. The prophylactic and therapeutic agent for dry eye of this invention contains the maqui berry extract as the active substance of this invention, i.e. containing delphinidin glycoside extracted from the maqui berry and at least one or more of the active substances delphinidin-3-sambubioside-5-glucoside, delphinidin-3,5-diglucoside, delphinidin-3-sambubioside and delphinidin-3-glucoside, preferably delphinidin-3,5-diglucoside.

Abstract: Various embodiments of the present disclosure include a non-volatile memory semiconductor device and a device that uses the same, the semiconductor device including a first semiconductor chip disposed on a substrate, a first sealing resin sealing the first semiconductor chip, a built-in semiconductor device disposed on the first sealing resin, and a second sealing resin sealing the first sealing resin and the built-in semiconductor device and covering a side surface of the substrate. According to an aspect of the present disclosure, it is possible to provide a high-quality semiconductor device, in which downsizing and cost reduction can be realized.

Abstract: Various embodiments of the present invention include a semiconductor device and a fabrication method therefore, the semiconductor device including a first semiconductor chip disposed on a substrate, a first sealing resin sealing the first semiconductor chip, a built-in semiconductor device disposed on the first sealing resin, and a second sealing resin sealing the first sealing resin and the built-in semiconductor device and covering a side surface of the substrate. According to an aspect of the present invention, it is possible to provide a high-quality semiconductor device and a fabrication method therefore, in which downsizing and cost reduction can be realized.

Abstract: Various embodiments of the present invention include a method for making a semiconductor device the method including disposing a first semiconductor chip on a first surface of a first substrate, the first substrate comprising a second surface opposing the first surface, depositing a first resin above the first semiconductor chip, disposing a built-in semiconductor device on the first resin. The built-in semiconductor device including a second substrate, a second semiconductor chip disposed on the second substrate, and a second resin that seals the second semiconductor chip. The method including depositing a third resin above the built-in semiconductor device and the first resin and covering a side surface of the first substrate and not extending beyond the second surface of the first substrate. According to an aspect of the present invention, it is possible to provide a high-quality semiconductor device fabrication method, in which downsizing and cost reduction can be realized.

Abstract: A method of fabricating a semiconductor device includes the steps of providing a heat-resistant sheet on an interposer so as to cover electrode terminals provided on the interposer, and sealing a semiconductor chip on the interposer sandwiched between molds with a sealing material. The electrode terminals are covered by the heat-resistant resin for protection, and the semiconductor chip is then sealed with resin. It is thus possible to avoid the problem in which contaminations adhere to the electrode terminals. This makes it possible to prevent the occurrence of resin burrs on the interposer and contamination of the electrode pads and to improve the production yield.

Abstract: A wireless communication terminal device according to the present invention comprises a main body which has a built-in electronic component, a casing which houses the main body, a cover body which is detachably attached to the casing, an antenna for wireless communication which is mounted on the cover body, a pair of electrodes which are disposed on the inner face of the cover body and connected to the antenna, a pair of terminals which are disposed on the main body and make contact with the pair of electrodes, and at least two projection pieces which are formed on the inner face of the cover body near the pair of electrodes as well as on both sides with the pair of electrodes interposed therebetween and project higher than the surfaces of the pair of electrodes.