Patents by Inventor Junji Tsuruoka
Junji Tsuruoka has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 8710666Abstract: A semiconductor device which can prevent a deterioration in the electrical properties by preventing sputters generated by laser welding from adhering to a circuit pattern or a semiconductor chip and a method for fabricating such a semiconductor device are provided. A connection conductor is bonded to a copper foil formed over a ceramic by a solder and resin is injected to a level lower than a top of the connection conductor. Laser welding is then performed. After that, resin is injected. This prevents sputters generated by the laser welding from adhering to a circuit pattern or a semiconductor chip. As a result, a deterioration in the electrical properties can be prevented.Type: GrantFiled: June 16, 2010Date of Patent: April 29, 2014Assignees: Aisin AW Co., Ltd., Fuji Electric Co., Ltd.Inventors: Junji Tsuruoka, Kazuo Aoki, Masaki Ono, Katsuhiko Yoshihara
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Publication number: 20130171891Abstract: A connection terminal that is conductive and that has a flat joint surface to be joined to a joint target surface by a brazing material interposed between the joint surface and the joint target surface. The joint surface has recesses provided on both sides across a predetermined reference line passing through a center of gravity of the joint surface and extending along the joint surface, and the recesses are dented from an outer edge portion of the joint surface toward the reference line.Type: ApplicationFiled: November 15, 2011Publication date: July 4, 2013Applicant: AISIN AW CO., LTD.Inventors: Junji Tsuruoka, Seiji Yasui
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Publication number: 20130113120Abstract: A semiconductor device includes a metal substrate; a semiconductor element placed on the metal substrate; a flexible circuit substrate that has one end placed on the metal substrate and is electrically connected to the semiconductor element, the flexible circuit substrate extending over an edge of the metal substrate to outside the metal substrate; a resin wall portion placed, in an outer periphery of the metal substrate, at least at the edge of the metal substrate over which the flexible circuit substrate extends, the resin wall portion being provided on the flexible circuit substrate at the edge; and a resin seal portion provided inside the resin wall portion so as to cover the metal substrate.Type: ApplicationFiled: October 5, 2012Publication date: May 9, 2013Inventors: Junji TSURUOKA, Seiji YASUI, Osamu YAMATO, Takayuki MAEDA
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Publication number: 20130105985Abstract: A semiconductor device includes a connection terminal. The connection terminal includes two legs bonded via a filler material to a bonding target object that is a substrate or one semiconductor element placed on the substrate; and a joining portion connected to the two legs, extending between the two legs, and separated from the bonding target object.Type: ApplicationFiled: October 5, 2012Publication date: May 2, 2013Inventors: Junji TSURUOKA, Seiji YASUI, Osamu YAMATO, Takayuki MAEDA
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Publication number: 20120118635Abstract: A conductive connection terminal having a planar joining surface joined to a joining target surface by a soldering material interposed between the joining surface and the joining target surface. The conductive connection terminal is configured such that, on either side across a predetermined reference straight line which, as well as passing through a center of gravity of the joining surface, extends along the joining surface, the joining surface includes indented portions indented from outer edge portions of the joining surface toward the reference straight line side.Type: ApplicationFiled: October 27, 2011Publication date: May 17, 2012Applicant: AISIN AW CO., LTD.Inventors: Junji TSURUOKA, Seiji YASUI
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Patent number: 7859103Abstract: A semiconductor module includes a base plate; a plurality of substrates placed on one surface of the base plate, with each substrate of the plurality of substrates including a switching element, a diode element, and a connection terminal area; and a parallel flow forming device that forms parallel coolant flow paths that are provided so as to be in contact with the other surface of the base plate.Type: GrantFiled: March 27, 2008Date of Patent: December 28, 2010Assignee: Aisin AW Co., Ltd.Inventors: Kazuo Aoki, Junji Tsuruoka, Seiji Yasui
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Publication number: 20100295187Abstract: A semiconductor device which can prevent a deterioration in the electrical properties by preventing sputters generated by laser welding from adhering to a circuit pattern or a semiconductor chip and a method for fabricating such a semiconductor device are provided. A connection conductor is bonded to a copper foil formed over a ceramic by a solder and resin is injected to a level lower than a top of the connection conductor. Laser welding is then performed. After that, resin is injected. This prevents sputters generated by the laser welding from adhering to a circuit pattern or a semiconductor chip. As a result, a deterioration in the electrical properties can be prevented.Type: ApplicationFiled: June 16, 2010Publication date: November 25, 2010Applicants: Aisin AW Co., Ltd., Fuji Electric Systems Co., Ltd.Inventors: Junji Tsuruoka, Kazuo Aoki, Masaki Ono, Katsuhiko Yoshihara
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Patent number: 7760503Abstract: A semiconductor module includes a base plate; a plurality of substrates placed on one surface of the base plate, with each substrate of the plurality of substrates including a switching element, a diode element, and a connection terminal area; and a parallel flow forming device that forms parallel coolant flow paths that are provided so as to be in contact with the other surface of the base plate. The coolant flow paths are formed such that coolant flows in a coolant flow direction.Type: GrantFiled: March 27, 2008Date of Patent: July 20, 2010Assignee: Aisin AW Co., Ltd.Inventors: Kazuo Aoki, Junji Tsuruoka, Seiji Yasui
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Patent number: 7755898Abstract: A semiconductor module includes a base plate; a plurality of substrates placed on one surface of the base plate, with each substrate of the plurality of substrates including a switching element, a diode element, and a connection terminal area; and a parallel flow forming device that forms parallel coolant flow paths that are provided so as to be in contact with the other.Type: GrantFiled: March 27, 2008Date of Patent: July 13, 2010Assignee: Aisin AW Co., Ltd.Inventors: Kazuo Aoki, Junji Tsuruoka, Seiji Yasui
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Patent number: 7728467Abstract: A heat generating member cooling structure in which a coolant space is formed between a heat releasing surface that is thermally connected to a heat generating member and an opposing surface that is positioned opposite the heat releasing surface, includes a plurality of heat releasing fins that are provided within the coolant space so as to be parallel to one another and stand from the heat releasing surface toward the opposing surface, and an inter-fin passage, through which a coolant flows, formed between every two of the plurality of heat releasing fins that are positioned adjacent to each other.Type: GrantFiled: January 22, 2008Date of Patent: June 1, 2010Assignees: Aisin AW Co., Ltd., Nakamura Mfg. Co., Ltd.Inventors: Kazuo Aoki, Junji Tsuruoka, Seiji Yasui, Yasushi Kabata, Hideyuki Miyahara, Masaharu Kumagai
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Patent number: 7663886Abstract: An electronic circuit device includes a lower-side substrate formed with a main circuit; an upper-side substrate formed with a drive control circuit that drivingly controls the main circuit; a support body positionally fixed above the lower-side substrate with resin in a hardened state; and a case having a peripheral portion with an outer surface that has at least a portion of an external lead-out terminal of the drive control circuit and the main circuit thereon, and a substrate storage space that accommodates the lower-side substrate on a side inward from the peripheral portion.Type: GrantFiled: December 19, 2007Date of Patent: February 16, 2010Assignees: Aisin AW Co., Ltd., Fuji Electric Device Technology Co., Ltd.Inventors: Kazuo Aoki, Junji Tsuruoka, Seiji Yasui, Yasushi Kabata, Shin Soyano
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Publication number: 20090243443Abstract: A drive unit includes a rotary electric machine; an inverter used to control the rotary electric machine and a capacitor that smooths a power supply voltage of the inverter; and a case housing the rotary electric machine. A control equipment housing space structured by an inverter housing space portion that houses the inverter and a capacitor housing space portion that houses the capacitor is formed in the case on an outer side of the rotary electric machine in an axial center radial direction of the rotary electric machine. A refrigerant flow chamber through which a refrigerant flows is formed between the control equipment housing space and the rotary electric machine. A capacitor heat exchange fin that performs heat exchange between the capacitor housing space portion and the refrigerant is provided between the capacitor housing space portion and the refrigerant flow chamber.Type: ApplicationFiled: December 3, 2008Publication date: October 1, 2009Applicant: AISIN AW CO., LTD.Inventors: Kazuo Aoki, Junji Tsuruoka, Tomoo Atarashi, Takafumi Koshida, Manabu Miyazawa, Tatsuyuki Uechi
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Patent number: 7569957Abstract: A heat generating member cooling structure in which a coolant space is formed between a heat releasing surface that is thermally connected to a heat generating member and an opposing surface that is positioned opposite the heat releasing surface, includes a plurality of heat releasing fins that are provided within the coolant space so as to be parallel to one another and stand from the heat releasing surface toward the opposing surface, and an inter-fin passage, through which a coolant flows, formed between every two of the plurality of heat releasing fins that are positioned adjacent to each other.Type: GrantFiled: December 27, 2007Date of Patent: August 4, 2009Assignee: Aisini Aw Co., Ltd.Inventors: Kazuo Aoki, Junji Tsuruoka, Seiji Yasui, Yasushi Kabata
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Publication number: 20080291628Abstract: A semiconductor module includes a base plate; a plurality of substrates placed on one surface of the base plate, with each substrate of the plurality of substrates including a switching element, a diode element, and a connection terminal area; and a parallel flow forming device that forms parallel coolant flow paths that are provided so as to be in contact with the other surface of the base plate. The coolant flow paths are formed such that coolant flows in a coolant flow direction.Type: ApplicationFiled: March 27, 2008Publication date: November 27, 2008Applicant: AISIN AW CO., LTD.Inventors: Kazuo Aoki, Junji Tsuruoka, Seiji Yasui
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Publication number: 20080291710Abstract: A semiconductor module includes a base plate; a plurality of substrates placed on one surface of the base plate, with each substrate of the plurality of substrates including a switching element, a diode element, and a connection terminal area; and a parallel flow forming device that forms parallel coolant flow paths that are provided so as to be in contact with the other.Type: ApplicationFiled: March 27, 2008Publication date: November 27, 2008Applicant: AISIN AW CO., LTD.Inventors: Kazuo Aoki, Junji Tsuruoka, Seiji Yasui
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Publication number: 20080290506Abstract: A semiconductor module includes a base plate; a plurality of substrates placed on one surface of the base plate, with each substrate of the plurality of substrates including a switching element, a diode element, and a connection terminal area; and a parallel flow forming device that forms parallel coolant flow paths that are provided so as to be in contact with the other surface of the base plate.Type: ApplicationFiled: March 27, 2008Publication date: November 27, 2008Applicant: AISIN AW CO., LTD.Inventors: Kazuo Aoki, Junji Tsuruoka, Seiji Yasui
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Publication number: 20080179972Abstract: A heat generating member cooling structure in which a coolant space is formed between a heat releasing surface that is thermally connected to a heat generating member and an opposing surface that is positioned opposite the heat releasing surface, includes a plurality of heat releasing fins that are provided within the coolant space so as to be parallel to one another and stand from the heat releasing surface toward the opposing surface, and an inter-fin passage, through which a coolant flows, formed between every two of the plurality of heat releasing fins that are positioned adjacent to each other.Type: ApplicationFiled: January 22, 2008Publication date: July 31, 2008Applicants: AISIN AW CO., LTD., NAKAMURA MFG. CO., LTD.Inventors: Kazuo Aoki, Junji Tsuruoka, Seiji Yasui, Yasushi Kabata, Hideyuki Miyahara, Masaharu Kumagai
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Publication number: 20080169088Abstract: A heat generating member cooling structure in which a coolant space is formed between a heat releasing surface that is thermally connected to a heat generating member and an opposing surface that is positioned opposite the heat releasing surface, includes a plurality of heat releasing fins that are provided within the coolant space so as to be parallel to one another and stand from the heat releasing surface toward the opposing surface, and an inter-fin passage, through which a coolant flows, formed between every two of the plurality of heat releasing fins that are positioned adjacent to each other.Type: ApplicationFiled: December 27, 2007Publication date: July 17, 2008Applicant: AISIN AW CO., LTD.Inventors: Kazuo Aoki, Junji Tsuruoka, Seiji Yasui, Yasushi Kabata
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Publication number: 20080158824Abstract: An electronic circuit device includes a lower-side substrate formed with a main circuit; an upper-side substrate formed with a drive control circuit that drivingly controls the main circuit; a support body positionally fixed above the lower-side substrate with resin in a hardened state; and a case having a peripheral portion with an outer surface that has at least a portion of an external lead-out terminal of the drive control circuit and the main circuit thereon, and a substrate storage space that accommodates the lower-side substrate on a side inward from the peripheral portion.Type: ApplicationFiled: December 19, 2007Publication date: July 3, 2008Applicants: AISIN AW CO., LTD., FUJI ELECTRIC DEVICE TECHNOLOGY CO., LTD.Inventors: Kazuo Aoki, Junji Tsuruoka, Seiji Yasui, Yasushi Kabata, Shin Soyano