Abstract: The invention is a method for producing cellulose ester and acrylic composite latex particles and to latex compositions prepared from the method. The cellulose ester and acrylic composite materials are prepared by dispersing at least one cellulose ester in water and incrementally adding at least one acrylic monomer to said dispersion in the presence of a polymerization initiator. Surfactants and solvents are optionally added to aid in the dispersion of the cellulose ester in water.

Abstract: The present disclosure generally relates to a shielded patterned ground structure in a PCB. The PCB may be disposed in a hard disk drive. Conductive traces in PCBs can have the problem of common mode current flowing through the traces and thus increasing the magnitude of EMI noise. By providing a shielded patterned ground structure, the common mode current is reduced as is the magnitude of EMI noise, yet there is no negative impact to the differential signal.

Abstract: The present disclosure generally relates to a shielded patterned ground structure in a PCB. The PCB may be disposed in a hard disk drive. Conductive traces in PCBs can have the problem of common mode current flowing through the traces and thus increasing the magnitude of EMI noise. By providing a shielded patterned ground structure, the common mode current is reduced as is the magnitude of EMI noise, yet there is no negative impact to the differential signal.

Abstract: A curable polyester resin composition containing residues of: a) polyhydroxyl compounds that include: (i) 2,2,4,4-tetraalkylcyclobutane-1,3-diol (TACD) compounds, and (ii) polyhydroxyl compounds other than TACD, and (b) polycarboxylic acid compounds that include: (i) polycarboxylic acid compounds, a derivative of polycarboxylic acid compound other than (bii), or a combination thereof, and (ii) a polycarboxylic anhydride compound; wherein the curable polyester resin has an acid number ranging from about 20 to about 120 mg KOH/g, a hydroxyl number ranging from greater than 0 to about 100 mg KOH/g, and an acid number:hydroxyl (AN:OH) number ratio of at least 0.5:1. The curable polyester resin can be dispersed in water or a solvent and is suitable for waterborne or solventborne coating compositions and powder coating applications. Phenolic based crosslinking coating compositions that contain these curable polyester resins are curable at elevated temperatures.

Abstract: A curable polyester resin composition containing residues of: a) polyhydroxyl compounds that include: (i) 2,2,4,4-tetraalkylcyclobutane-1,3-diol (TACD) compounds, and (ii) polyhydroxyl compounds other than TACD, and (b) polycarboxylic acid compounds that include: (i) polycarboxylic acid compounds, a derivative of polycarboxylic acid compound other than (bii), or a combination thereof, and (ii) a polycarboxylic anhydride compound; wherein the curable polyester resin has an acid number ranging from about 20 to about 120 mg KOH/g, a hydroxyl number ranging from greater than 0 to about 100 mg KOH/g, and an acid number:hydroxyl (AN:OH) number ratio of at least 0.5:1. The curable polyester resin can be dispersed in water or a solvent and is suitable for waterborne or solventborne coating compositions and powder coating applications. Phenolic based crosslinking coating compositions that contain these curable polyester resins are curable at elevated temperatures.

Abstract: This invention relates to a resole phenolic resin comprising the residues of (a) from about 50 to 100 mole % of a meta-substituted phenol [phenolic component (a)], (b) from 0 to about 50 mole % of at least one phenolic component [phenolic component (b)] other than said meta-substituted phenol, and (c) from about 150 to about 300 mole % of at least one aldehyde, wherein the mole percentages of said phenolic components (a) and (b) are based on the total moles of phenolic components (a) and (b); wherein the mole percentages of said aldehyde component is based on the total moles of said phenolic components (a) and (b), and wherein said resole phenolic resin is soluble in an organic solvent and curable with a functional polyester.

Abstract: There is now provided a variety of curable polyester resins that cure well with phenolic crosslinking agents. The curable polyester resins include polyester resins that have both carboxyl and hydroxyl functionalities and a high ratio of carboxyl functionalities to hydroxyl functionalities; unsaturated curable polyester having residues of an ?,?-unsaturated polycarboxylic acid compound with at least one unsaturation in a position that is ?,? relative to a carbonyl group and not located on an aromatic ring; and a curable polyester resin containing beta-ketoacetate moieties without vinyl unsaturation. The curable polyester resin can be dispersed in water or dissolved in a solvent and is suitable for waterborne or solventborne coating compositions. Phenolic based crosslinking coating compositions that contain these curable polyester resins cure well with phenolic resin crosslinking compounds with a wide variety of reactive curable polyester resins or other kinds of polyester resins.

Abstract: Formulations of solutions and processes are described to form a substrate including a dopant. In particular implementations, the dopant can include arsenic (As) or phosphorus (P). In an embodiment, a dopant solution is provided that includes a solvent and a dopant-containing molecule. In a particular embodiment, the solvent of the dopant solution can have a flashpoint that is at least 55° C. In some cases, the dopant-containing molecule can have a molecular weight that is no greater than about 300 g/mol. In other instances, a ratio of a concentration of a dopant-containing molecule relative to a concentration of a contaminant is no greater than about 1×1010.

Abstract: Formulations of solutions and processes are described to form a substrate including a dopant. In particular implementations, the dopant may include arsenic (As). In an embodiment, a dopant solution is provided that includes a solvent and a dopant. In a particular embodiment, the dopant solution may have a flashpoint that is at least approximately equal to a minimum temperature capable of causing atoms at a surface of the substrate to attach to an arsenic-containing compound of the dopant solution. In one embodiment, a number of silicon atoms at a surface of the substrate are covalently bonded to the arsenic-containing compound.

Abstract: Formulations of solutions and processes are described to form a substrate including a dopant. In particular implementations, the dopant may include arsenic (As). In an embodiment, a dopant solution is provided that includes a solvent and a dopant. In a particular embodiment, the dopant solution may have a flashpoint that is at least approximately equal to a minimum temperature capable of causing atoms at a surface of the substrate to attach to an arsenic-containing compound of the dopant solution. In one embodiment, a number of silicon atoms at a surface of the substrate are covalently bonded to the arsenic-containing compound.

Abstract: Infections caused by Mycobacterium tuberculosis kill more than 1.8 million people each year. While the persistence of this pathogenic bacterial species and the emergence of multidrug resistant strains have created an urgent need for new TB therapies, a new TB-specific drug has not been developed in over 40 years. The disclosure herein provides short and scalable syntheses of small molecules, and small molecules as new therapeutics for eradicating this life threatening pathogen.