Patents by Inventor Junjiang FU
Junjiang FU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20260164164Abstract: The present disclosure discloses an earphone. The earphone may include a hook-shaped component, a connecting component, and a holding component. When the earphone is in a wearing state, the hook-shaped component may be configured to hang between a rear side of an ear of a user and a head of the user. The holding component may be configured to contact a front side of the ear. The connecting component may be configured to connect the hook-shaped component and the holding component and extend from the head to an outside of the head to cooperate with the hook-shaped component to provide the holding component with a pressing force on the front side of the ear.Type: ApplicationFiled: January 28, 2026Publication date: June 11, 2026Applicant: SHENZHEN SHOKZ CO., LTD.Inventors: Zeying ZHENG, Jiang XU, Yonggen WANG, Haofeng ZHANG, Gan LAI, Chong WANG, Liwei WANG, Ruixin HAN, Lei ZHANG, Junjiang FU, Tao ZHAO, Peigeng TONG, Guolin XIE, Duoduo WU, Ao JI, Xin QI, Yongjian LI
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Patent number: 12652497Abstract: The present disclosure provides a bone conduction speaker, comprising: a vibration assembly, the vibration assembly including a vibration element and a vibration housing, the vibration element being used to convert an electrical signal into a mechanical vibration, the vibration housing being used to contact with a face of a user and to transmit the mechanical vibration to the user in a bone conduction manner to produce a sound; and a resonance assembly including a first elastic element and a mass element, the mass element being connected to the vibration assembly by the first elastic element, wherein the vibration assembly causes the resonance assembly to vibrate, the vibration of the resonance assembly weakening a vibration amplitude of the vibration housing.Type: GrantFiled: March 14, 2023Date of Patent: June 9, 2026Assignee: SHENZHEN SHOKZ CO., LTD.Inventors: Junjiang Fu, Fengyun Liao
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Publication number: 20260156422Abstract: A speaker comprises a housing, a transducer residing inside the housing, and at least one sound guiding hole located on the housing. The transducer generates vibrations. The vibrations produce a sound wave inside the housing and cause a leaked sound wave spreading outside the housing from a portion of the housing. The at least one sound guiding hole guides the sound wave inside the housing through the at least one sound guiding hole to an outside of the housing. The guided sound wave interferes with the leaked sound wave in a target region. The interference at a specific frequency relates to a distance between the at least one sound guiding hole and the portion of the housing.Type: ApplicationFiled: July 1, 2025Publication date: June 4, 2026Applicant: SHENZHEN SHOKZ CO., LTD.Inventors: Xin QI, Fengyun LIAO, Zeying ZHENG, Jiang XU, Haofeng ZHANG, Gan LAI, Chong WANG, Liwei WANG, Ruixin HAN, Lei ZHANG, Junjiang FU
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Publication number: 20260156403Abstract: Embodiments of the present disclosure disclose a headphone including a first acoustic wave generation structure, a second acoustic wave generation structure, an acoustic transmission structure, and a filtering structure. The first acoustic wave generation structure and the second acoustic wave generation structure respectively generate a first acoustic wave and a second acoustic wave. The acoustic transmission structure may be configured to transmit the first acoustic wave and the second acoustic wave to a spatial point outside the headphone. The first acoustic wave transmitted to the spatial point interferes with the second acoustic wave transmitted to the spatial point in a first frequency range, and the interference reduces an amplitude of the first acoustic wave in the first frequency range. The filtering structure may be configured to reduce an amplitude of an acoustic wave generated by the headphone in a second frequency range at the spatial point.Type: ApplicationFiled: January 21, 2026Publication date: June 4, 2026Applicant: SHENZHEN SHOKZ CO., LTD.Inventors: Lei ZHANG, Junjiang FU, Zhen WANG, Fengyun LIAO, Xin QI
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Patent number: 12647712Abstract: The present disclosure mainly relates to a headphone. The headphone may include a supporting assembly and a core module connected with the supporting assembly. The supporting assembly may be configured to support the core module to be worn at a wearing position. The core module may include a core housing, a transducer device, and a vibration panel. The transducer device may be provided in a accommodating cavity of the core housing, and the vibration panel may be connected with the transducer device and configured to transmit a mechanical vibration generated by the transducer device to a user.Type: GrantFiled: December 18, 2023Date of Patent: June 2, 2026Assignee: SHENZHEN SHOKZ CO., LTD.Inventors: Junjiang Fu, Yueqiang Wang, Chaojie Cui, Lei Zhong, Zhi Cai, Yingying Zhang, Weihua Zhou, Piyou Cheng
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Patent number: 12647713Abstract: The present disclosure discloses an earphone. The earphone may include a hook-shaped component, a connecting component, and a holding component. When the earphone is in a wearing state, the hook-shaped component may be configured to hang between a rear side of an ear of a user and a head of the user. The holding component may be configured to contact a front side of the ear. The connecting component may be configured to connect the hook-shaped component and the holding component and extend from the head to an outside of the head to cooperate with the hook-shaped component to provide the holding component with a pressing force on the front side of the ear.Type: GrantFiled: September 27, 2023Date of Patent: June 2, 2026Assignee: SHENZHEN SHOKZ CO., LTD.Inventors: Zeying Zheng, Jiang Xu, Yonggen Wang, Haofeng Zhang, Gan Lai, Chong Wang, Liwei Wang, Ruixin Han, Lei Zhang, Junjiang Fu, Yongjian Li, Tao Zhao, Peigeng Tong, Guolin Xie, Duoduo Wu, Ao Ji, Xin Qi
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Patent number: 12647723Abstract: The present disclosure discloses an acoustic output device. The acoustic output device may include a first acoustic driver including a first diaphragm; a second acoustic driver including a second diaphragm; a control circuit electrically connected with the first acoustic driver and the second acoustic driver respectively, the control circuit provides a first electrical signal for driving a vibration of the first diaphragm, and a second electrical signal for driving a vibration of the second diaphragm, and the control circuit is configured to adjust a phase of the first electrical signal and a phase of the second electrical signal such that, in a first scenario, the phase of the first electrical signal and the phase of the second electrical signal are opposite, and in a second scenario, the phase of the first electrical signal and the phase of the second electrical signal are same.Type: GrantFiled: April 6, 2024Date of Patent: June 2, 2026Assignee: SHENZHEN SHOKZ CO., LTD.Inventors: Junjiang Fu, Lei Zhang, Xin Qi, Fengyun Liao
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Patent number: 12641383Abstract: The present disclosure discloses a hearing aid device. The hearing aid device may comprise at least one sound transmitter configured to collect a sound signal and convert the sound signal into an electrical signal, a signal processing circuit configured to generate a control signal by processing the electrical signal, at least one vibration loudspeaker configured to convert the control signal into a vibration signal, and a housing structure configured to accommodate at least one of the at least one sound transmitter, the signal processing circuit, or the at least one vibration loudspeaker, wherein the control signal may include an original signal and an air-conducted sound leakage signal generated from the at least one vibration loudspeaker, and a difference between the air-conducted sound leakage signal received by the at least one sound transmitter and the original signal may not be larger than ?33 dB.Type: GrantFiled: April 28, 2023Date of Patent: May 26, 2026Assignee: SHENZHEN SHOKZ CO., LTD.Inventors: Junjiang Fu, Huifang Tang
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Publication number: 20260129340Abstract: The present disclosure discloses an earphone. The earphone may include a hook-shaped component, a connecting component, and a holding component. When the earphone is in a wearing state, the hook-shaped component may be configured to hang between a rear side of an ear of a user and a head of the user. The holding component may be configured to contact a front side of the ear. The connecting component may be configured to connect the hook-shaped component and the holding component and extend from the head to an outside of the head to cooperate with the hook-shaped component to provide the holding component with a pressing force on the front side of the ear.Type: ApplicationFiled: December 28, 2025Publication date: May 7, 2026Applicant: SHENZHEN SHOKZ CO., LTD.Inventors: Zeying ZHENG, Jiang XU, Yonggen WANG, Haofeng ZHANG, Gan LAI, Chong WANG, Liwei WANG, Ruixin HAN, Lei ZHANG, Junjiang FU
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Publication number: 20260129349Abstract: A speaker assembly is provided. The speaker assembly includes a housing assembly including a main housing, an air conduction speaker disposed within the main housing, and a bone conduction speaker rotatably supported on the main housing and being capable of rotating relative to the main housing along a preset rotation axis. A vibration direction of the air conduction speaker is parallel to the preset rotation axis, and a vibration direction of the bone conduction speaker is perpendicular to the preset rotation axis.Type: ApplicationFiled: December 30, 2025Publication date: May 7, 2026Applicant: SHENZHEN SHOKZ CO., LTD.Inventors: Yueqiang WANG, Junjiang FU, Song YOU, Yingying ZHANG
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Publication number: 20260129326Abstract: A speaker assembly comprising a housing assembly and a bone conduction speaker is provided. The housing assembly includes a main housing, the main housing includes a bottom wall and a circumferential sidewall connected to the bottom wall to form an accommodation space with an open end, the circumferential sidewall includes a first sidewall and a second sidewall disposed opposite to each other. The main housing further includes a partition assembly disposed between the first sidewall and the second sidewall and at least partially spaced apart from the first sidewall and the second sidewall, respectively, the partition assembly and the second sidewall are provided with a first shaft mechanism and a second shaft mechanism, respectively. The bone conduction speaker includes a core shell disposed between the partition assembly and the second sidewall. A third shaft mechanism and a fourth shaft mechanism are respectively disposed on opposite sides of the core shell.Type: ApplicationFiled: December 30, 2025Publication date: May 7, 2026Applicant: SHENZHEN SHOKZ CO., LTD.Inventors: Yueqiang WANG, Junjiang FU, Song YOU, Yingying ZHANG
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Publication number: 20260129325Abstract: The present disclosure relates to a vibration transmission plate, a loudspeaker assembly, and a bone-conduction earphone. The vibration transmission plate includes an inner ring body, an outer ring body, a first connecting rod, and a second connecting rod. The inner ring body includes a first inner ring edge including two first straight line segments and two first curved segments. The outer ring body includes a first outer ring edge including two second straight line segments and two second curved segments. The first connecting rod includes a first inner connecting portion, a first outer connecting portion, and a straight extending portion located within a straight gap. The second connecting rod includes a second inner connecting portion, a second outer connecting portion, and a curved extending portion located within a curved gap.Type: ApplicationFiled: December 28, 2025Publication date: May 7, 2026Applicant: SHENZHEN SHOKZ CO., LTD.Inventors: Junjiang FU, Shuai LIU
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Publication number: 20260129345Abstract: A speaker assembly comprising a housing assembly and a bone conduction speaker is provided. the bone conduction speaker includes a core shell, a transducer, a vibration transmission face-fitting assembly, and an auxiliary face-fitting assembly. The housing assembly includes a main housing, the core shell is supported on the main housing, the transducer is disposed inside the core shell. the vibration transmission face-fitting assembly includes a vibration plate connected to the transducer and contacts a face region on a front side of a tragus of a user when the speaker assembly is in a wearing state. the auxiliary face-fitting assembly includes a rigid support member and a soft fitting member, the rigid support member is connected to the core shell, and the soft fitting member is disposed on the rigid support member.Type: ApplicationFiled: December 28, 2025Publication date: May 7, 2026Applicant: SHENZHEN SHOKZ CO., LTD.Inventors: Yueqiang WANG, Junjiang FU, Song YOU, Yingying ZHANG
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Publication number: 20260129350Abstract: A speaker assembly is provided. The speaker assembly comprises a bone conduction speaker. The bone conduction speaker includes a core shell configured to form an accommodation space with an open end, a transducer disposed within the accommodation space, and a vibration transmission face-fitting assembly including a vibration plate, a soft vibration transmission member, and a rigid bracket. A middle region of the soft vibration transmission member is fixed to the vibration plate in a molding manner. An edge region of the soft vibration transmission member is fixed to the rigid bracket. The vibration plate is assembled and fixed to the transducer, the rigid bracket is assembled and fixed to the core shell, and the soft vibration transmission member covers the open end of the core shell and is configured to contact a skin of a user.Type: ApplicationFiled: December 30, 2025Publication date: May 7, 2026Applicant: SHENZHEN SHOKZ CO., LTD.Inventors: Yueqiang WANG, Junjiang FU, Song YOU, Yingying ZHANG
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Patent number: 12610172Abstract: The present disclosure mainly relates to a headphone. The headphone may include a supporting assembly and a core module connected with the supporting assembly. The supporting assembly may be configured to support the core module to be worn at a wearing position. The core module may include a core housing, a transducer device, and a vibration panel. The transducer device may be provided in a accommodating cavity of the core housing, and the vibration panel may be connected with the transducer device and configured to transmit a mechanical vibration generated by the transducer device to a user.Type: GrantFiled: December 18, 2023Date of Patent: April 21, 2026Assignee: SHENZHEN SHOKZ CO., LTD.Inventors: Junjiang Fu, Yueqiang Wang, Chaojie Cui, Lei Zhong, Zhi Cai, Yingying Zhang, Weihua Zhou, Piyou Cheng
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Publication number: 20260101144Abstract: Provided is a sound output device. The sound output device includes a sound output unit, an ear hook, one or more microphones, and a processing circuit. The sound output unit includes a housing and a diaphragm disposed in the housing. A front cavity and a rear cavity are respectively provided on two sides of the diaphragm in the housing, the front cavity is acoustically coupled to a sound outlet hole provided on the housing, the sound outlet hole is disposed toward an ear canal of the user, and the rear cavity is acoustically coupled to a pressure relief hole provided on the housing. The ear hook includes a first portion located between an auricle and a head of a user, and a second portion extending toward a side of the auricle away from the head and connected to the sound output unit. The one or more microphones, disposed on the ear hook, are configured to collect an ambient sound to generate an electric signal.Type: ApplicationFiled: December 12, 2025Publication date: April 9, 2026Applicant: SHENZHEN SHOKZHEAR CO., LTD.Inventors: Huifang TANG, Junjiang FU
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Patent number: 12581249Abstract: A speaker comprises a housing, a transducer residing inside the housing, and at least one sound guiding hole located on the housing. The transducer generates vibrations. The vibrations produce a sound wave inside the housing and cause a leaked sound wave spreading outside the housing from a portion of the housing. The at least one sound guiding hole guides the sound wave inside the housing through the at least one sound guiding hole to an outside of the housing. The guided sound wave interferes with the leaked sound wave in a target region. The interference at a specific frequency relates to a distance between the at least one sound guiding hole and the portion of the housing.Type: GrantFiled: September 22, 2023Date of Patent: March 17, 2026Assignee: SHENZHEN SHOKZ CO., LTD.Inventors: Lei Zhang, Junjiang Fu, Bingyan Yan, Fengyun Liao, Xin Qi, Peigeng Tong, Guolin Xie, Yongjian Li, Jiang Xu, Tao Zhao, Duoduo Wu, Ao Ji
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Patent number: 12556859Abstract: Embodiments of the present disclosure disclose a headphone including a first acoustic wave generation structure, a second acoustic wave generation structure, an acoustic transmission structure, and a filtering structure. The first acoustic wave generation structure and the second acoustic wave generation structure respectively generate a first acoustic wave and a second acoustic wave. The acoustic transmission structure may be configured to transmit the first acoustic wave and the second acoustic wave to a spatial point outside the headphone. The first acoustic wave transmitted to the spatial point interferes with the second acoustic wave transmitted to the spatial point in a first frequency range, and the interference reduces an amplitude of the first acoustic wave in the first frequency range. The filtering structure may be configured to reduce an amplitude of an acoustic wave generated by the headphone in a second frequency range at the spatial point.Type: GrantFiled: March 26, 2024Date of Patent: February 17, 2026Assignee: SHENZHEN SHOKZ CO., LTD.Inventors: Lei Zhang, Junjiang Fu, Zhen Wang, Fengyun Liao, Xin Qi
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Patent number: 12549905Abstract: The embodiments of the present disclosure provide a speaker. The speaker may include a vibration assembly and a first elastic element. The vibration assembly may include a vibration element and a vibration housing. The vibration element may convert an electrical signal into a mechanical vibration. The vibration housing may be in contact with facial skin of a user. The first elastic element may be elastically connected to the vibration housing.Type: GrantFiled: February 6, 2023Date of Patent: February 10, 2026Assignee: SHENZHEN SHOKZ CO., LTD.Inventors: Junjiang Fu, Lei Zhang, Fengyun Liao, Xin Qi
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Patent number: 12538083Abstract: A speaker comprises a housing, a transducer residing inside the housing, and at least one sound guiding hole located on the housing. The transducer generates vibrations. The vibrations produce a sound wave inside the housing and cause a leaked sound wave spreading outside the housing from a portion of the housing. The at least one sound guiding hole guides the sound wave inside the housing through the at least one sound guiding hole to an outside of the housing. The guided sound wave interferes with the leaked sound wave in a target region. The interference at a specific frequency relates to a distance between the at least one sound guiding hole and the portion of the housing.Type: GrantFiled: April 1, 2021Date of Patent: January 27, 2026Assignee: SHENZHEN SHOKZ CO., LTD.Inventors: Lei Zhang, Junjiang Fu, Bingyan Yan, Fengyun Liao, Xin Qi