Patents by Inventor Junjiang FU

Junjiang FU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12786613
    Abstract: A core module and an electronic device are provided. The core module comprises a housing component, a transducer device, and a vibration panel. The housing component includes a core housing, a core cover plate, and a sealing film. The transducer device includes a support. The core cover plate and the sealing film are respectively provided with a first avoidance hole and a second avoidance hole allowing the vibration panel to be connected with the support. The sealing film is configured to seal an assembly clearance of the first avoidance hole. At least one of the vibration panel and the support is provided with a support end surface corresponding to a surrounding region of the second avoidance hole. The sealing film is fixed on the support end surface.
    Type: Grant
    Filed: December 24, 2024
    Date of Patent: November 3, 2026
    Assignee: SHENZHEN SHOKZ CO., LTD.
    Inventors: Junjiang Fu, Chaowu Li, Peigeng Tong
  • Patent number: 12786623
    Abstract: The present application discloses a sound-output device, a vibration speaker configured to generate a bone-conducted sound wave; and an air-conducted speaker configured to generate an air-conducted sound wave. The vibration speaker is coupled to the air-conducted speaker through a mechanical structure; and the bone-conducted sound wave is input to the air-conducted speaker at least in part as an input signal.
    Type: Grant
    Filed: July 27, 2024
    Date of Patent: November 3, 2026
    Assignee: Shenzhen Shokz Co., Ltd.
    Inventors: Lei Zhang, Junjiang Fu, Fengyun Liao, Xin Qi
  • Publication number: 20260343140
    Abstract: A core module and an electronic device are provided. The core module comprises a housing component, a transducer device, and a microphone component. The transducer device and the microphone component are disposed in the housing component. The microphone component includes a first microphone. The first microphone falls on the transducer device when being projected onto the transducer device along a vibration direction of the transducer device. The core module further comprises a limiting member disposed in the housing component. The limiting member is configured to stop the transducer device when a motion amplitude of the transducer device along the vibration direction exceeds a preset amplitude threshold, so as to maintain a preset distance between the transducer device and the first microphone to prevent the first microphone from being damaged by the transducer device, especially under an extreme operation condition such as the core module falling or colliding.
    Type: Application
    Filed: May 25, 2026
    Publication date: October 29, 2026
    Applicant: SHENZHEN SHOKZ CO., LTD.
    Inventors: Junjiang FU, Peigeng TONG, Le XIAO, Qianwen NIE
  • Patent number: 12777287
    Abstract: The present disclosure application relates to a transducer, a loudspeaker, and an acoustic output device. The transducer comprises: a magnetic circuit system including a magnet assembly and a magnetic conductive cover, the magnetic conductive cover being arranged at least partially around the magnet assembly; and a vibration plate, including a first vibration plate and a second vibration plate, the first vibration plate and the second vibration plate being respectively distributed on both sides of the magnet assembly along a vibration direction of the magnet assembly, and being configured to elastically support the magnet assembly, wherein an equivalent stiffness of the first vibration plate or the second vibration plate in any direction perpendicular to the vibration direction of the magnet assembly is greater than 4.7×104 N/m.
    Type: Grant
    Filed: July 8, 2024
    Date of Patent: October 27, 2026
    Assignee: SHENZHEN SHOKZ CO., LTD.
    Inventors: Lei Zhang, Guangyuan Zhu, Junjiang Fu, Xin Qi
  • Patent number: 12777288
    Abstract: The present disclosure application relates to a transducer, a loudspeaker, and an acoustic output device. The transducer comprises: a magnetic circuit system including a magnet, a magnetic conductive plate and a magnetic conductive cover, the magnet and the magnetic conductive plate being arranged along a vibration direction of the transducer; and a vibration plate including a first vibration plate and a second vibration plate, the first vibration plate or the second vibration plate being fixed on both sides of the magnet along the vibration direction of the transducer for elastically supporting the magnet; wherein at least one of the magnet, the magnetic conductive plate, and the magnetic conductive cover includes multiple magnetic parts with different magnetization directions.
    Type: Grant
    Filed: July 9, 2024
    Date of Patent: October 27, 2026
    Assignee: SHENZHEN SHOKZ CO., LTD.
    Inventors: Guangyuan Zhu, Lei Zhang, Junjiang Fu, Xin Qi
  • Publication number: 20260281632
    Abstract: A speaker comprises a housing, a transducer residing inside the housing, and at least one sound guiding hole located on the housing. The transducer generates vibrations. The vibrations produce a sound wave inside the housing and cause a leaked sound wave spreading outside the housing from a portion of the housing. The at least one sound guiding hole guides the sound wave inside the housing through the at least one sound guiding hole to an outside of the housing. The guided sound wave interferes with the leaked sound wave in a target region. The interference at a specific frequency relates to a distance between the at least one sound guiding hole and the portion of the housing.
    Type: Application
    Filed: May 11, 2026
    Publication date: September 17, 2026
    Applicant: SHENZHEN SHOKZ CO., LTD.
    Inventors: Lei ZHANG, Junjiang FU, Bingyan YAN, Fengyun LIAO, Xin QI
  • Publication number: 20260281605
    Abstract: The present disclosure discloses an earphone. The earphone may include a hook-shaped component, a connecting component, and a holding component. When the earphone is in a wearing state, the hook-shaped component may be configured to hang between a rear side of an ear of a user and a head of the user. The holding component may be configured to contact a front side of the ear. The connecting component may be configured to connect the hook-shaped component and the holding component and extend from the head to an outside of the head to cooperate with the hook-shaped component to provide the holding component with a pressing force on the front side of the ear.
    Type: Application
    Filed: May 12, 2026
    Publication date: September 17, 2026
    Applicant: SHENZHEN SHOKZ CO., LTD.
    Inventors: Zeying ZHENG, Jiang XU, Yonggen WANG, Haofeng ZHANG, Gan LAI, Chong WANG, Liwei WANG, Ruixin HAN, Lei ZHANG, Junjiang FU, Tao ZHAO, Peigeng TONG, Guolin XIE, Duoduo WU, Ao JI, Xin QI, Yongjian LI
  • Patent number: 12739566
    Abstract: The present disclosure relates to an earphone and a transducer device thereof. The transducer device may include a first magnet conductor, a coil, and a magnet assembly. An orthographic projection of the coil on a reference plane perpendicular to a first reference direction may surround an orthographic projection of at least a portion of the first magnet conductor on the reference plane. An orthographic projection of the magnet assembly on the reference plane may surround a periphery of the orthographic projection of the coil on the reference plane. One of the first magnet conductor and the magnet assembly may be connected to the coil. A magnetic field generated by the coil after an excitation signal is input may interact with a magnetic field generated by the magnet assembly to cause the first magnet conductor to move relative to the magnet assembly.
    Type: Grant
    Filed: April 29, 2024
    Date of Patent: September 15, 2026
    Assignee: SHENZHEN SHOKZ CO., LTD.
    Inventor: Junjiang Fu
  • Patent number: 12707181
    Abstract: The present disclosure mainly relates to a headphone. The headphone may include a supporting assembly and a core module connected with the supporting assembly. The supporting assembly may be configured to support the core module to be worn at a wearing position. The core module may include a core housing, a transducer device, and a vibration panel. The transducer device may be provided in a accommodating cavity of the core housing, and the vibration panel may be connected with the transducer device and configured to transmit a mechanical vibration generated by the transducer device to a user.
    Type: Grant
    Filed: December 18, 2023
    Date of Patent: August 11, 2026
    Assignee: SHENZHEN SHOKZ CO., LTD.
    Inventors: Junjiang Fu, Yueqiang Wang, Chaojie Cui, Lei Zhong, Zhi Cai, Yingying Zhang, Weihua Zhou, Piyou Cheng
  • Patent number: 12701349
    Abstract: The present disclosure relates to an acoustic output device. The acoustic output device may include an earphone core, a controller, a power source, and a flexible circuit board. The earphone core may include at least one low-frequency acoustic driver configured to output sounds from at least two first guiding holes and the at least one high-frequency acoustic driver configured to output sounds from at least two second guiding holes. The controller may be configured to direct the at least one low-frequency acoustic driver to output the sounds in a first frequency range and direct the at least one high-frequency acoustic driver to output the sounds in a second frequency range. The power source may be configured to provide power supply for the earphone core. The flexible circuit board may be configured to connect the earphone core with the power source.
    Type: Grant
    Filed: June 6, 2024
    Date of Patent: August 4, 2026
    Assignee: SHENZHEN SHOKZ CO., LTD.
    Inventors: Lei Zhang, Junjiang Fu, Bingyan Yan, Fengyun Liao, Xin Qi
  • Publication number: 20260222726
    Abstract: The present disclosure discloses an earphone. The earphone may include a hook-shaped component, a connecting component, and a holding component. When the earphone is in a wearing state, the hook-shaped component may be configured to hang between a rear side of an ear of a user and a head of the user. The holding component may be configured to contact a front side of the ear. The connecting component may be configured to connect the hook-shaped component and the holding component and extend from the head to an outside of the head to cooperate with the hook-shaped component to provide the holding component with a pressing force on the front side of the ear.
    Type: Application
    Filed: March 26, 2026
    Publication date: July 30, 2026
    Applicant: SHENZHEN SHOKZ CO., LTD.
    Inventors: Zeying ZHENG, Jiang XU, Yonggen WANG, Haofeng ZHANG, Gan LAI, Chong WANG, Liwei WANG, Ruixin HAN, Lei ZHANG, Junjiang FU, Tao ZHAO, Peigeng TONG, Guolin XIE, Duoduo WU, Ao JI, Xin QI, Yongjian LI
  • Publication number: 20260205731
    Abstract: The present disclosure relates to a vibration transmission plate, a bone conduction sounding assembly, and an earphone. The vibration transmission plate includes an inner ring portion, an outer ring portion, and a plurality of connecting rods connected between the inner ring portion and the outer ring portion. The connecting rod includes a rod body, a first connection portion, and a second connection portion. The vibration transmission plate includes a major axis and a minor axis, a size of the vibration transmission plate along the major axis being greater than a size along the minor axis, and also includes a first reference point located at a connection between the first connection portion and the rod body, a second reference point located at a connection between the second connection portion and the rod body, and a first reference line defined by the first reference point and the second reference point.
    Type: Application
    Filed: December 29, 2025
    Publication date: July 16, 2026
    Applicant: SHENZHEN SHOKZ CO., LTD.
    Inventors: Shuai LIU, Junjiang FU
  • Patent number: 12684278
    Abstract: The present disclosure mainly relates to a headphone. The headphone may include a supporting assembly and a core module connected with the supporting assembly. The supporting assembly may be configured to support the core module to be worn at a wearing position. The core module may include a core housing, a transducer device, and a vibration panel. The transducer device may be provided in a accommodating cavity of the core housing, and the vibration panel may be connected with the transducer device and configured to transmit a mechanical vibration generated by the transducer device to a user.
    Type: Grant
    Filed: December 15, 2023
    Date of Patent: July 14, 2026
    Assignee: SHENZHEN SHOKZ CO., LTD.
    Inventors: Junjiang Fu, Yueqiang Wang, Chaojie Cui, Lei Zhong, Zhi Cai, Yingying Zhang, Weihua Zhou, Piyou Cheng
  • Patent number: 12671929
    Abstract: The present disclosure mainly relates to a headphone. The headphone may include a supporting assembly and a core module connected with the supporting assembly. The supporting assembly may be configured to support the core module to be worn at a wearing position. The core module may include a core housing, a transducer device, and a vibration panel. The transducer device may be provided in a accommodating cavity of the core housing, and the vibration panel may be connected with the transducer device and configured to transmit a mechanical vibration generated by the transducer device to a user.
    Type: Grant
    Filed: December 15, 2023
    Date of Patent: June 30, 2026
    Assignee: SHENZHEN SHOKZ CO., LTD.
    Inventors: Junjiang Fu, Yueqiang Wang, Chaojie Cui, Lei Zhong, Zhi Cai, Yingying Zhang, Weihua Zhou, Piyou Cheng
  • Patent number: 12666188
    Abstract: The present disclosure relates to an acoustic output apparatus. The acoustic output apparatus may include an earphone core including at least one acoustic driver for outputting sound though one or more sound guiding holes set on the acoustic output apparatus, a controller configured to cause the at least one acoustic driver to output sound, a power source assembly configured to provide electrical power to the earphone core, the one or more sensors, and the controller, and an interactive control component configured to allow an interaction between a user and the acoustic output apparatus.
    Type: Grant
    Filed: August 16, 2023
    Date of Patent: June 23, 2026
    Assignee: SHENZHEN SHOKZ CO., LTD.
    Inventors: Lei Zhang, Junjiang Fu, Bingyan Yan, Fengyun Liao, Xin Qi
  • Patent number: 12666207
    Abstract: A speaker comprises a housing, a transducer residing inside the housing, and at least one sound guiding hole located on the housing. The transducer generates vibrations. The vibrations produce a sound wave inside the housing and cause a leaked sound wave spreading outside the housing from a portion of the housing. The at least one sound guiding hole guides the sound wave inside the housing through the at least one sound guiding hole to an outside of the housing. The guided sound wave interferes with the leaked sound wave in a target region. The interference at a specific frequency relates to a distance between the at least one sound guiding hole and the portion of the housing.
    Type: Grant
    Filed: August 9, 2023
    Date of Patent: June 23, 2026
    Assignee: SHENZHEN SHOKZ CO., LTD.
    Inventors: Lei Zhang, Junjiang Fu, Bingyan Yan, Fengyun Liao, Xin Qi
  • Patent number: 12666190
    Abstract: The present disclosure discloses an earphone. The earphone may include a hook-shaped component, a connecting component, and a holding component. When the earphone is in a wearing state, the hook-shaped component may be configured to hang between a rear side of an ear of a user and a head of the user. The holding component may be configured to contact a front side of the ear. The connecting component may be configured to connect the hook-shaped component and the holding component and extend from the head to an outside of the head to cooperate with the hook-shaped component to provide the holding component with a pressing force on the front side of the ear.
    Type: Grant
    Filed: September 28, 2023
    Date of Patent: June 23, 2026
    Assignee: SHENZHEN SHOKZ CO., LTD.
    Inventors: Zeying Zheng, Jiang Xu, Yonggen Wang, Haofeng Zhang, Gan Lai, Chong Wang, Liwei Wang, Ruixin Han, Lei Zhang, Junjiang Fu, Yongjian Li, Tao Zhao, Peigeng Tong, Guolin Xie, Duoduo Wu, Ao Ji, Xin Qi
  • Publication number: 20260164164
    Abstract: The present disclosure discloses an earphone. The earphone may include a hook-shaped component, a connecting component, and a holding component. When the earphone is in a wearing state, the hook-shaped component may be configured to hang between a rear side of an ear of a user and a head of the user. The holding component may be configured to contact a front side of the ear. The connecting component may be configured to connect the hook-shaped component and the holding component and extend from the head to an outside of the head to cooperate with the hook-shaped component to provide the holding component with a pressing force on the front side of the ear.
    Type: Application
    Filed: January 28, 2026
    Publication date: June 11, 2026
    Applicant: SHENZHEN SHOKZ CO., LTD.
    Inventors: Zeying ZHENG, Jiang XU, Yonggen WANG, Haofeng ZHANG, Gan LAI, Chong WANG, Liwei WANG, Ruixin HAN, Lei ZHANG, Junjiang FU, Tao ZHAO, Peigeng TONG, Guolin XIE, Duoduo WU, Ao JI, Xin QI, Yongjian LI
  • Patent number: 12652497
    Abstract: The present disclosure provides a bone conduction speaker, comprising: a vibration assembly, the vibration assembly including a vibration element and a vibration housing, the vibration element being used to convert an electrical signal into a mechanical vibration, the vibration housing being used to contact with a face of a user and to transmit the mechanical vibration to the user in a bone conduction manner to produce a sound; and a resonance assembly including a first elastic element and a mass element, the mass element being connected to the vibration assembly by the first elastic element, wherein the vibration assembly causes the resonance assembly to vibrate, the vibration of the resonance assembly weakening a vibration amplitude of the vibration housing.
    Type: Grant
    Filed: March 14, 2023
    Date of Patent: June 9, 2026
    Assignee: SHENZHEN SHOKZ CO., LTD.
    Inventors: Junjiang Fu, Fengyun Liao
  • Publication number: 20260156422
    Abstract: A speaker comprises a housing, a transducer residing inside the housing, and at least one sound guiding hole located on the housing. The transducer generates vibrations. The vibrations produce a sound wave inside the housing and cause a leaked sound wave spreading outside the housing from a portion of the housing. The at least one sound guiding hole guides the sound wave inside the housing through the at least one sound guiding hole to an outside of the housing. The guided sound wave interferes with the leaked sound wave in a target region. The interference at a specific frequency relates to a distance between the at least one sound guiding hole and the portion of the housing.
    Type: Application
    Filed: July 1, 2025
    Publication date: June 4, 2026
    Applicant: SHENZHEN SHOKZ CO., LTD.
    Inventors: Xin QI, Fengyun LIAO, Zeying ZHENG, Jiang XU, Haofeng ZHANG, Gan LAI, Chong WANG, Liwei WANG, Ruixin HAN, Lei ZHANG, Junjiang FU