Patents by Inventor Junjiang FU

Junjiang FU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240147134
    Abstract: The present disclosure mainly relates to a headphone. The headphone may include a supporting assembly and a core module connected with the supporting assembly. The supporting assembly may be configured to support the core module to be worn at a wearing position. The core module may include a core housing, a transducer device, and a vibration panel. The transducer device may be provided in a accommodating cavity of the core housing, and the vibration panel may be connected with the transducer device and configured to transmit a mechanical vibration generated by the transducer device to a user.
    Type: Application
    Filed: December 18, 2023
    Publication date: May 2, 2024
    Applicant: SHENZHEN SHOKZ CO., LTD.
    Inventors: Junjiang FU, Yueqiang WANG, Chaojie CUI, Lei ZHONG, Zhi CAI, Yingying ZHANG, Weihua ZHOU, Piyou CHENG
  • Patent number: 11974097
    Abstract: A speaker comprises a housing, a transducer residing inside the housing, and at least one sound guiding hole located on the housing. The transducer generates vibrations. The vibrations produce a sound wave inside the housing and cause a leaked sound wave spreading outside the housing from a portion of the housing. The at least one sound guiding hole guides the sound wave inside the housing through the at least one sound guiding hole to an outside of the housing. The guided sound wave interferes with the leaked sound wave in a target region. The interference at a specific frequency relates to a distance between the at least one sound guiding hole and the portion of the housing.
    Type: Grant
    Filed: March 31, 2021
    Date of Patent: April 30, 2024
    Assignee: SHENZHEN SHOKZ CO., LTD.
    Inventors: Lei Zhang, Junjiang Fu, Bingyan Yan, Fengyun Liao, Xin Qi
  • Publication number: 20240137684
    Abstract: The present disclosure mainly relates to a headphone. The headphone may include a supporting assembly and a core module connected with the supporting assembly. The supporting assembly may be configured to support the core module to be worn at a wearing position. The core module may include a core housing, a transducer device, and a vibration panel. The transducer device may be provided in a accommodating cavity of the core housing, and the vibration panel may be connected with the transducer device and configured to transmit a mechanical vibration generated by the transducer device to a user.
    Type: Application
    Filed: December 15, 2023
    Publication date: April 25, 2024
    Applicant: SHENZHEN SHOKZ CO., LTD.
    Inventors: Junjiang FU, Yueqiang WANG, Chaojie CUI, Lei ZHONG, Zhi CAI, Yingying ZHANG, Weihua ZHOU, Piyou CHENG
  • Publication number: 20240137683
    Abstract: The present disclosure mainly relates to a headphone. The headphone may include a supporting assembly and a core module connected with the supporting assembly. The supporting assembly may be configured to support the core module to be worn at a wearing position. The core module may include a core housing, a transducer device, and a vibration panel. The transducer device may be provided in a accommodating cavity of the core housing, and the vibration panel may be connected with the transducer device and configured to transmit a mechanical vibration generated by the transducer device to a user.
    Type: Application
    Filed: December 18, 2023
    Publication date: April 25, 2024
    Applicant: SHENZHEN SHOKZ CO., LTD.
    Inventors: Junjiang FU, Yueqiang WANG, Chaojie CUI, Lei ZHONG, Zhi CAI, Yingying ZHANG, Weihua ZHOU, Piyou CHENG
  • Publication number: 20240137689
    Abstract: The present disclosure mainly relates to a headphone. The headphone may include a supporting assembly and a core module connected with the supporting assembly. The supporting assembly may be configured to support the core module to be worn at a wearing position. The core module may include a core housing, a transducer device, and a vibration panel. The transducer device may be provided in a accommodating cavity of the core housing, and the vibration panel may be connected with the transducer device and configured to transmit a mechanical vibration generated by the transducer device to a user.
    Type: Application
    Filed: December 15, 2023
    Publication date: April 25, 2024
    Applicant: SHENZHEN SHOKZ CO., LTD.
    Inventors: Junjiang FU, Yueqiang WANG, Chaojie CUI, Lei ZHONG, Zhi CAI, Yingying ZHANG, Weihua ZHOU, Piyou CHENG
  • Publication number: 20240137682
    Abstract: The present disclosure mainly relates to a headphone. The headphone may include a supporting assembly and a core module connected with the supporting assembly. The supporting assembly may be configured to support the core module to be worn at a wearing position. The core module may include a core housing, a transducer device, and a vibration panel. The transducer device may be provided in a accommodating cavity of the core housing, and the vibration panel may be connected with the transducer device and configured to transmit a mechanical vibration generated by the transducer device to a user.
    Type: Application
    Filed: December 18, 2023
    Publication date: April 25, 2024
    Applicant: SHENZHEN SHOKZ CO., LTD.
    Inventors: Junjiang FU, Yueqiang WANG, Chaojie CUI, Lei ZHONG, Zhi CAI, Yingying ZHANG, Weihua ZHOU, Piyou CHENG
  • Publication number: 20240137693
    Abstract: The present disclosure mainly relates to a headphone. The headphone may include a supporting assembly and a core module connected with the supporting assembly. The supporting assembly may be configured to support the core module to be worn at a wearing position. The core module may include a core housing, a transducer device, and a vibration panel. The transducer device may be provided in a accommodating cavity of the core housing, and the vibration panel may be connected with the transducer device and configured to transmit a mechanical vibration generated by the transducer device to a user.
    Type: Application
    Filed: December 15, 2023
    Publication date: April 25, 2024
    Applicant: SHENZHEN SHOKZ CO., LTD.
    Inventors: Junjiang FU, Yueqiang WANG, Chaojie CUI, Lei ZHONG, Zhi CAI, Yingying ZHANG, Weihua ZHOU, Piyou CHENG
  • Publication number: 20240137687
    Abstract: The present disclosure mainly relates to a headphone. The headphone may include a supporting assembly and a core module connected with the supporting assembly. The supporting assembly may be configured to support the core module to be worn at a wearing position. The core module may include a core housing, a transducer device, and a vibration panel. The transducer device may be provided in a accommodating cavity of the core housing, and the vibration panel may be connected with the transducer device and configured to transmit a mechanical vibration generated by the transducer device to a user.
    Type: Application
    Filed: December 18, 2023
    Publication date: April 25, 2024
    Applicant: SHENZHEN SHOKZ CO., LTD.
    Inventors: Junjiang FU, Yueqiang WANG, Chaojie CUI, Lei ZHONG, Zhi CAI, Yingying ZHANG, Weihua ZHOU, Piyou CHENG
  • Publication number: 20240137681
    Abstract: The present disclosure mainly relates to a headphone. The headphone may include a supporting assembly and a core module connected with the supporting assembly. The supporting assembly may be configured to support the core module to be worn at a wearing position. The core module may include a core housing, a transducer device, and a vibration panel. The transducer device may be provided in a accommodating cavity of the core housing, and the vibration panel may be connected with the transducer device and configured to transmit a mechanical vibration generated by the transducer device to a user.
    Type: Application
    Filed: December 19, 2023
    Publication date: April 25, 2024
    Applicant: SHENZHEN SHOKZ CO., LTD.
    Inventors: Junjiang FU, Yueqiang WANG, Chaojie CUI, Lei ZHONG, Zhi CAI, Yingying ZHANG, Weihua ZHOU, Piyou CHENG
  • Publication number: 20240137692
    Abstract: The present disclosure mainly relates to a headphone. The headphone may include a supporting assembly and a core module connected with the supporting assembly. The supporting assembly may be configured to support the core module to be worn at a wearing position. The core module may include a core housing, a transducer device, and a vibration panel. The transducer device may be provided in a accommodating cavity of the core housing, and the vibration panel may be connected with the transducer device and configured to transmit a mechanical vibration generated by the transducer device to a user.
    Type: Application
    Filed: December 15, 2023
    Publication date: April 25, 2024
    Applicant: SHENZHEN SHOKZ CO., LTD.
    Inventors: Junjiang FU, Yueqiang WANG, Chaojie CUI, Lei ZHONG, Zhi CAI, Yingying ZHANG, Weihua ZHOU, Piyou CHENG
  • Publication number: 20240137690
    Abstract: The present disclosure mainly relates to a headphone. The headphone may include a supporting assembly and a core module connected with the supporting assembly. The supporting assembly may be configured to support the core module to be worn at a wearing position. The core module may include a core housing, a transducer device, and a vibration panel. The transducer device may be provided in a accommodating cavity of the core housing, and the vibration panel may be connected with the transducer device and configured to transmit a mechanical vibration generated by the transducer device to a user.
    Type: Application
    Filed: December 15, 2023
    Publication date: April 25, 2024
    Applicant: SHENZHEN SHOKZ CO., LTD.
    Inventors: Junjiang FU, Yueqiang WANG, Chaojie CUI, Lei ZHONG, Zhi CAI, Yingying ZHANG, Weihua ZHOU, Piyou CHENG
  • Publication number: 20240129665
    Abstract: The present application discloses a sound-output device, including a signal processing circuit, configured to generate a bone-conducted control signal and an air-conducted control signal based on an initial sound signal; a vibration speaker, configured to generate a bone-conducted sound wave based on the bone-conducted control signal; and an air-conduction speaker, configured to generate an air-conducted sound wave based on the air-conducted control signal, wherein a signal component of at least partial frequency band in the air-conducted control signal has an amplitude and a phase canceling at least partial leakage of sound generated by the vibration speaker, such that at least partial component in the air-conducted sound wave cancels the at least partial leakage of sound.
    Type: Application
    Filed: October 11, 2023
    Publication date: April 18, 2024
    Applicant: Shenzhen Shokz Co., Ltd.
    Inventors: Lei ZHANG, Junjiang FU, Fengyun LIAO, Xin QI
  • Patent number: 11956603
    Abstract: The present application discloses a sound-output device, including a vibration speaker configured to generate a bone-conducted sound wave; and an air-conducted speaker configured to generate an air-conducted sound wave. The sound-output device further comprises a signal processing module configured to generate a control signal, wherein, the vibration speaker includes a vibration assembly electrically connected to the signal processing module to receive the control signal, and generate the bone-conducted sound wave based on the control signal, and the air-conducted speaker includes a housing coupled to the vibration assembly to generate the air-conducted sound wave based on the bone-conducted sound wave.
    Type: Grant
    Filed: June 29, 2021
    Date of Patent: April 9, 2024
    Assignee: Shenzhen Shokz Co., Ltd.
    Inventors: Lei Zhang, Junjiang Fu, Fengyun Liao, Xin Qi
  • Patent number: 11956591
    Abstract: The present disclosure discloses an acoustic output device. The acoustic output device may include a first acoustic driver including a first diaphragm; a second acoustic driver including a second diaphragm; a control circuit electrically connected with the first acoustic driver and the second acoustic driver respectively, the control circuit provides a first electrical signal for driving a vibration of the first diaphragm, and a second electrical signal for driving a vibration of the second diaphragm, and a phase of the first electrical signal and a phase of the second electrical signal are opposite; and a housing supporting the first acoustic driver and the second acoustic driver, wherein a sound generated by the vibration of the first diaphragm is radiated outward through a first sound guide hole on the housing, and a sound generated by the vibration of the second diaphragm is radiated outward through a second sound guide hole on the housing.
    Type: Grant
    Filed: February 24, 2022
    Date of Patent: April 9, 2024
    Assignee: SHENZHEN SHOKZ CO., LTD.
    Inventors: Junjiang Fu, Lei Zhang, Xin Qi, Fengyun Liao
  • Patent number: 11930314
    Abstract: The present disclosure may provide an acoustic device. The acoustic device may include a housing, at least one low-frequency acoustic driver, at least one high-frequency acoustic driver, and a noise reduction assembly. The housing may be configured to be rested on a shoulder of a user. The at least one low-frequency acoustic driver may be carried by the housing and configured to output first sound from at least two first sound guiding holes. The at least one high-frequency acoustic driver may be carried by the housing and configured to output second sound from at least two second sound guiding holes. The noise reduction assembly may be configured to receive third sound and reduce noise of the third sound.
    Type: Grant
    Filed: December 9, 2022
    Date of Patent: March 12, 2024
    Assignee: SHENZHEN SHOKZ CO., LTD.
    Inventors: Lei Zhang, Junjiang Fu, Bingyan Yan, Fengyun Liao, Xin Qi
  • Publication number: 20240073583
    Abstract: The present disclosure discloses an earphone. The earphone may include a hook-shaped component, a connecting component, and a holding component. When the earphone is in a wearing state, the hook-shaped component may be configured to hang between a rear side of an ear of a user and a head of the user. The holding component may be configured to contact a front side of the ear. The connecting component may be configured to connect the hook-shaped component and the holding component and extend from the head to an outside of the head to cooperate with the hook-shaped component to provide the holding component with a pressing force on the front side of the ear.
    Type: Application
    Filed: November 9, 2023
    Publication date: February 29, 2024
    Applicant: SHENZHEN SHOKZ CO., LTD.
    Inventors: Zeying ZHENG, Jiang XU, Yonggen WANG, Haofeng ZHANG, Gan LAI, Chong WANG, Liwei WANG, Ruixin HAN, Lei ZHANG, Junjiang FU
  • Publication number: 20240073579
    Abstract: The present disclosure discloses an acoustic output apparatus. The acoustic output apparatus may include at least one acoustic driver. The at least one acoustic driver may generate sound that is output through at least two sound guiding holes. Further, the acoustic output apparatus may include a supporting structure. The supporting structure may be configured to support the at least one acoustic driver. A baffle may be disposed between the at least two sound guiding holes. The baffle may increase an acoustic distance from at least one sound guiding hole of the at least two sound guiding holes to a user's ear.
    Type: Application
    Filed: November 6, 2023
    Publication date: February 29, 2024
    Applicant: SHENZHEN SHOKZ CO., LTD.
    Inventors: Lei ZHANG, Junjiang FU, Bingyan YAN, Fengyun LIAO, Xin QI
  • Patent number: 11917352
    Abstract: The present disclosure discloses an acoustic output device. The acoustic output device may include at least one acoustic driver configured to generate sounds and a housing structure configured to carry the at least one acoustic driver. The housing structure may include a cavity, and the at least one acoustic driver may be arranged in the cavity and may divide the cavity into a first cavity and a second cavity. And the sounds generated by the at least one acoustic driver may be transmitted from the first cavity and the second cavity, respectively, pass through the housing structure, and form dual sound sources arranged on two sides of an auricle, respectively.
    Type: Grant
    Filed: October 26, 2021
    Date of Patent: February 27, 2024
    Assignee: SHENZHEN SHOKZ CO., LTD.
    Inventors: Lei Zhang, Junjiang Fu, Bingyan Yan, Fengyun Liao, Xin Qi
  • Patent number: 11917377
    Abstract: The present application discloses a sound-output device, including a vibration speaker configured to generate a bone-conducted sound wave; and an air-conducted speaker configured to generate an air-conducted sound wave. The sound-output device further comprises a signal processing module configured to generate a control signal, wherein, the vibration speaker includes a vibration assembly electrically connected to the signal processing module to receive the control signal, and generate the bone-conducted sound wave based on the control signal, and the air-conducted speaker includes a housing coupled to the vibration assembly to generate the air-conducted sound wave based on the bone-conducted sound wave.
    Type: Grant
    Filed: June 29, 2021
    Date of Patent: February 27, 2024
    Assignee: Shenzhen Shokz Co., Ltd.
    Inventors: Lei Zhang, Junjiang Fu, Fengyun Liao, Xin Qi
  • Publication number: 20240048921
    Abstract: A speaker comprises a housing, a transducer residing inside the housing, and at least one sound guiding hole located on the housing. The transducer generates vibrations. The vibrations produce a sound wave inside the housing and cause a leaked sound wave spreading outside the housing from a portion of the housing. The at least one sound guiding hole guides the sound wave inside the housing through the at least one sound guiding hole to an outside of the housing. The guided sound wave interferes with the leaked sound wave in a target region. The interference at a specific frequency relates to a distance between the at least one sound guiding hole and the portion of the housing.
    Type: Application
    Filed: October 17, 2023
    Publication date: February 8, 2024
    Applicant: SHENZHEN SHOKZ CO., LTD.
    Inventors: Lei ZHANG, Junjiang FU, Bingyan YAN, Fengyun LIAO, Xin QI