Abstract: A light-emitting chip and a light-emitting substrate are provided. The light-emitting chip includes a base substrate and at least two sub-light-emitting chips disposed on a side of the base substrate, wherein each sub-light-emitting chip includes a first semiconductor layer, a second semiconductor layer and an light-emitting layer located between the first semiconductor layer and the second semiconductor layer which are stacked.

Abstract: A battery cell including a stack and a first internal terminal. The stack includes: C cathode electrodes each including a cathode current collector, a cathode active layer arranged on the cathode current collector, and an external connector extending from the cathode current collector; A anode electrodes each including an anode current collector, an anode active layer arranged on the anode current collector, and an external connector extending from the anode current collector; and S separators, where C, A, and S are integers greater than one. Each one of the external connectors, of one of the C cathode electrodes and the A anode electrodes, includes a first tab and a second tab extending farther than the first tab, the second tabs are folded onto the first tabs, and the first internal terminal is laser welded onto the second tabs.

Abstract: A weldment assembly includes a first component and a second component configured to be coupled to the first component. Additionally, the first component and the second component are coupled through a first linear stitch and a second linear stitch disposed parallel to the first linear stitch.

Abstract: A light-emitting chip and a light-emitting substrate are provided. The light-emitting chip includes a base substrate and at least two sub-light-emitting chips disposed on a side of the base substrate, wherein each sub-light-emitting chip includes a first semiconductor layer, a second semiconductor layer and an light-emitting layer located between the first semiconductor layer and the second semiconductor layer which are stacked.

Abstract: The present invention relates to a compound represented by general formula (I) or a stereoisomer, deuterated compound, solvate, prodrug, metabolite, pharmaceutically acceptable salt or eutectic crystal thereof, and an intermediate thereof, and use thereof in IRAK4-related diseases such as an autoimmune disease, an inflammatory disease or cancer.

Abstract: A method for joining external tabs of a battery cell to a terminal includes providing a battery cell stack; arranging a stack of external tabs of one of C cathode electrodes and A anode electrodes on a terminal; laser melting ends of the stack of external tabs; and after the laser melting, laser welding the stack of external tabs of the one of the C cathode electrodes and the A anode electrodes to the terminal.

Abstract: A leak detection system for a battery enclosure for one of a rechargeable energy storage system, a battery cell, a battery module, and/or a battery pack includes a gas delivery system configured to selectively provide a trace gas to the battery enclosure. A first optical gas imaging sensor is configured to generate images of a surface of the battery enclosure after the gas delivery system charges the battery enclosure with trace gas. The images are used to selectively detect a gas cloud adjacent to the surface of the of the battery enclosure. The gas cloud is used to determine a location of a gas leak on the surface of the battery enclosure.

Abstract: Disclosed herein are system, method, and computer program product embodiments for generating a virtual replica of a physical network device and/or a physical network. An aspect operates by receiving, from a network management system (NMS), a request to generate a device digital twin (device-DT) instance corresponding to a physical network device, where the request includes at least a first plurality and a second plurality of device characteristics corresponding to the physical network device. A DT template is selected from a plurality of DT templates based on the first plurality of device characteristics. The DT template is customized based on the second plurality of device characteristics, and the device-DT instance of the physical network device is generated based on the customized DT template. Then a management channel is established between the device-DT instance and the NMS.

Abstract: A method for joining external tabs of a battery cell to a terminal includes providing a battery cell stack including C cathode electrodes, A anode electrodes, and S separators, where C, S and A are integers greater than one. The method includes arranging a stack of external tabs of one of the C cathode electrodes and the A anode electrodes on a terminal; creating a trench in the stack of external tabs of the one of the C cathode electrodes and the A anode electrodes at a weld location during a first laser processing step; and welding the stack of external tabs of the one of the C cathode electrodes and the A anode electrodes at the weld location during a second laser processing step.

Abstract: A battery cell includes a stack including C cathode electrodes, A anode electrodes, and S separators, where C, A and S are integers greater than one. A first internal terminal includes a first slot. The external tabs of one of the C cathode electrodes and the A anode electrodes are inserted into the first slot. One of edges of the external tabs of one of the C cathode electrodes and the A anode electrodes are laser welded in the first slot, and portions of the external tabs of the one of the C cathode electrodes and the A anode electrodes extend through the first slot, are folded and laser welded to a surface of the first internal terminal.

Abstract: A method for joining external tabs of a battery cell to a terminal includes providing a battery cell stack including C cathode electrodes, A anode electrodes, and S separators, where C, S and A are integers greater than one. The method includes arranging a stack of external tabs of one of the C cathode electrodes and the A anode electrodes on a terminal; and laser welding W weld segments in each of L weld locations on the stack of external tabs of one of the C cathode electrodes and the A anode electrodes to join the external tabs of the one of the C cathode electrodes and the A anode electrodes to the terminal, where W and L are integers greater than one.

Abstract: A method for manufacturing a battery cell includes providing a stack including C cathode electrodes each including a cathode current collector, a cathode active layer, and an external tab extending from the cathode current collector, A anode electrodes including an anode current collector, an anode active layer, and an external tab extending from the anode current collector, and S separators. The method includes providing a terminal including a first portion connected to a second portion at a predetermined angle less than or equal to 100°; positioning external tabs of one of the A anode electrodes and the C cathode electrodes in contact with one of an inner surface and an outer surface of the first portion of the terminal; and laser welding ends of the external tabs to the one of an inner surface and an outer surface of the first portion of the terminal.

Abstract: A system for joining a first part and a second part together with a weld structure. The system includes: a welding element configured to form the weld structure between the first part and the second part; and a control module configured to operate the welding element to form the weld structure. The weld structure includes: a first curved end; a second curved end; a connecting portion connecting the first curved end and the second curved end; a first curved crown spaced apart from the first curved end and concentric with the first curved end; and a second curved crown spaced apart from the second curved end and concentric with the second curved end. The first curved end, the second curved end, and the connecting portion are between the first curved crown and the second curved crown.

Abstract: Provided are a light-emitting device, a light-emitting substrate and a display device. The light-emitting device includes: a substrate; a first semiconductor layer, the first semiconductor layer being located on one side of the substrate; a light-emitting layer, the light-emitting layer being located on the side of the first semiconductor layer facing away from the substrate; and a second semiconductor layer, the second semiconductor layer being located on the side of the light-emitting layer facing away from the first semiconductor layer.

Abstract: A light emitting diode chip, including at least two light emitting structures spaced apart and sequentially connected in series on a base substrate. At least one of the light emitting structures includes a first semiconductor layer, a light emitting layer, a second semiconductor layer, a first insulation layer, a current spreading layer and a first electrode stacked in sequence. The at least one light emitting structure includes a first via hole in the first insulation layer, the first electrode is electrically connected to the current spreading layer, and the current spreading layer is electrically connected to the second semiconductor layer through the first via hole. An orthographic projection of the first via hole on the base substrate falls within that of the current spreading layer, and the orthographic projection of the current spreading layer on the base substrate falls within that of the second semiconductor layer.

Abstract: A light-emitting diode chip, a display substrate and a manufacturing method thereof are disclosed. The light-emitting diode chip includes a first conductive type semiconductor layer, a light-emitting layer, at least two second conductive type semiconductor layers, and at least two first electrodes; the at least two second conductive type semiconductor layers are at a side of the light-emitting layer away from the first conductive type semiconductor layer, the at least two first electrodes are electrically respectively connected with the at least two second conductive type semiconductor layers. Orthographic projections of the at least two second conductive type semiconductor layers on the first conductive type semiconductor layer are spaced apart from each other, and orthographic projections of the at least two first electrodes on the first conductive type semiconductor layer are spaced apart from each other.

Abstract: Provided is a light emitting diode chip, including: a base substrate; at least two light emitting units disposed on the base substrate, wherein the at least two light emitting units include adjacent first light emitting unit and second light emitting unit, and each of the first light emitting unit and the second light emitting unit includes: a first semiconductor layer disposed on the base substrate; a light emitting layer disposed on the first semiconductor layer away from the base substrate; and a second semiconductor layer disposed on the light emitting layer away from the base substrate, wherein the light emitting diode chip further includes a bridging part for conducting, and the bridging part is configured to electrically connect the second semiconductor layer of the first light emitting unit with the first semiconductor layer of the second light emitting unit.

Abstract: Provided are the compound shown in general formula (I) or a stereoisomer, a deuterated compound, a solvate, a prodrug, a metabolite, a pharmaceutically acceptable salt, or co-crystal thereof, an intermediate thereof, and a use thereof in EGFR-related diseases such as cancer.

Abstract: The present disclosure provides a light-emitting device, a light-emitting module and a preparation method thereof. The light-emitting device includes: a light-emitting structure; an electrode structure provided on the light-emitting structure; and a die-bonding structure, at least a portion of which covers a surface of the electrode structure facing away from the light-emitting structure, where the die-bonding structure includes a doping material for inhibiting generation of an intermetallic compound. The present disclosure is capable of improving the die-bonding rework yield and reducing the risk of failure of a display module.

Abstract: A light-emitting diode chip, a display substrate and a manufacturing method thereof are disclosed. The light-emitting diode chip includes a first conductive type semiconductor layer, a light-emitting layer, at least two second conductive type semiconductor layers, and at least two first electrodes; the at least two second conductive type semiconductor layers are at a side of the light-emitting layer away from the first conductive type semiconductor layer, the at least two first electrodes are electrically respectively connected with the at least two second conductive type semiconductor layers. Orthographic projections of the at least two second conductive type semiconductor layers on the first conductive type semiconductor layer are spaced apart from each other, and orthographic projections of the at least two first electrodes on the first conductive type semiconductor layer are spaced apart from each other.