Patents by Inventor Junjie SHU

Junjie SHU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240353608
    Abstract: A backlight module includes a rear housing, a light guide plate and a light source. The rear housing includes a bottom wall and a side wall that are connected to each other; the bottom wall and the side wall enclose an accommodation cavity. The light guide plate is located in the accommodation cavity. The light source is located in the accommodation cavity and located between the side wall and a side surface of the light guide plate. The light source includes a circuit board and a plurality of light-emitting devices that are mounted on the circuit board. A surface of the circuit board away from the plurality of light-emitting devices faces the side wall, and light-emitting surfaces of the plurality of light-emitting devices face the side surface of the light guide plate.
    Type: Application
    Filed: June 29, 2022
    Publication date: October 24, 2024
    Applicants: Chongqing BOE Optoelectronics Technology Co., Ltd., BOE TECHNOLOGY GROUP CO., LTD.
    Inventors: Nan WANG, Yong SHU, Qi CAO, Xian WANG, Ming WANG, Quan TONG, Yinggang LIU, Chengyi XU, Xiaofei ZHU, Junjie JIANG
  • Patent number: 12099712
    Abstract: A gesture recognition method, apparatus and system based on coupling capacitance, which are configured to solve the technical problem in the prior art of it not being possible to recognize a complex gesture due to the fact that the coordinates of a manipulation body on a three-dimensional plane cannot be determined.
    Type: Grant
    Filed: May 21, 2021
    Date of Patent: September 24, 2024
    Assignees: Beijing BOE Optoelectronics Technology Co., Ltd., BOE Technology Group Co., Ltd.
    Inventors: Xingjun Shu, Qingzhu Guan, Shuang Shi, Jinlong Zheng, Junjie Xu, Yanming Wang, Sa Li, Fuan Zhu, Yue An, Yadong Zhang, Zongli Gao, Cuie Wang, Shuainan Liu, Shengwei Yang, Lidong Wang, Libao Cui, Runfei Du, Qi Zhang
  • Publication number: 20240272064
    Abstract: The present disclosure relates to a sample and an evaluation method for measuring galvanic corrosion between a conductive coating and a protected substrate. A micropore insulating layer is arranged between the conductive coating and the substrate, the micropore insulating layer is composed of an insulating material and contains a micropore structure, the micropore structure can form an ion pathway on the surfaces of the conductive coating and the substrate after being filled with a conductive medium, and the substrate and the conductive coating are both connected with an independent leading wire. The sample of the present disclosure can evaluate galvanic corrosion between a conductive coating and other conductive materials more fully.
    Type: Application
    Filed: November 22, 2021
    Publication date: August 15, 2024
    Applicant: WUHAN RESEARCH INSTITUTE OF MATERIALS PROTECTION
    Inventors: Dongdong LI, Lanxuan LIU, Yang WANG, Xiusheng LIU, Weihua QIN, Zenghui FENG, Dongheng WU, Bei GUO, Junjie SHU