Abstract: Laundry machines and methods for operating the same are disclosed. A laundry machine includes a container for containing laundry and a dehumidifier including a circulation fan for generating moist air flowing out of the container toward a moisture absorption and removal structure for absorbing moisture in the moist air, a regeneration fan for generating airflow including the moisture absorbed by the moisture absorption and removal structure to flow toward a condenser for condensing water from the generated airflow. The moisture absorption and removal structure is disposed adjacent to the circulation fan, the regeneration fan, and the condenser; wherein the moisture absorption and removal structure comprises a roller assembly, a functional roller is provided on at least one of a bottom portion of the roller assembly or a side of the roller assembly.

Abstract: A method for controlling a laundry treating device includes acquiring, in response to a drying apparatus being in a running state, a temperature near an air opening of at least one of a laundry accommodating apparatus or a moisture absorption-desorption passage, where the air opening includes at least one of an air inlet or an air outlet; and performing, in response to the temperature near the air opening of at least one of the laundry accommodating apparatus or the moisture absorption-desorption passage reaching a preset temperature threshold, at least one of adjusting a working state of the drying apparatus or outputting abnormal prompt information. The moisture absorption-desorption passage is communicated with the laundry accommodating apparatus. The drying apparatus is arranged in the moisture absorption-desorption passage and includes at least one of a moisture absorption-desorption rotary wheel, a heating module or a heat exchange module.

Abstract: The invention discloses a novel packaging structure of a power semiconductor module, which mainly comprises an insulating radiating fin, a metal lead frame unit and a chip unit. The insulating radiating fin comprises an insulating layer, and an inner metal conducting layer and an outer metal conducting layer which are respectively arranged on two sides of the insulating layer; the metal lead frame unit mainly comprises a frame pin input portion, a frame pin output portion and a frame pin signal portion, the frame pin input portion is arranged on an upper side of the inner metal conducting layer in a solder welding mode, and the chip unit is welded to the middle of the inner metal conductive layer. The frame pin output portion is provided with an inner concave portion.

Abstract: Disclosed are a drying device and an integrated washer-dryer. The drying device includes a circulating module assembly, communicated with a drum of the integrated washer-dryer and configured to enable moist air from the drum to form a circulating airflow by rotating and output it to a dehumidifying module assembly; the dehumidifying module assembly, communicated with the circulating module assembly and the drum and configured to dehumidify and dry the circulating airflow by circulating movement and output the dried circulating airflow to the drum; a regenerating module assembly, communicated with the dehumidifying module assembly and configured to output a dry regeneration airflow to the dehumidifying module assembly to dehumidify and dry part of the dehumidifying module assembly so as to restore a dehumidifying capacity of the dehumidifying module assembly, the circulating module assembly, the dehumidifying module assembly and the regenerating module assembly are disposed substantially in one plane.

Abstract: Provided is a laundry treating device.

Abstract: Disclosed is an integrated washer-dryer, including: a drum and a drying module assembly, the drying module assembly includes a moisture-absorbing and dehumidifying component, a moisture-absorbing passage, and a dehumidifying passage; the moisture-absorbing passage includes an air inlet and air outlet of the moisture-absorbing passage; the drum is communicated with the air inlet and air outlet of the moisture-absorbing passage, respectively; a fan for the moisture-absorbing passage is arranged in the moisture-absorbing passage, so as to form a moisture-absorbing airflow in the drum and in the moisture-absorbing passage; a fan for the dehumidifying passage is arranged in the dehumidifying passage, so as to form a dehumidifying airflow in the dehumidifying passage; and the moisture-absorbing and dehumidifying component is disposed in a path of the moisture-absorbing passage and the dehumidifying passage, such that the moisture-absorbing airflow and the dehumidifying airflow both flow through the moisture-absorbi

Abstract: Laundry machines and methods for operating the same are disclosed. A laundry machine includes a container for containing laundry and a dehumidifier including a circulation fan for generating moist air flowing out of the container toward a moisture absorption and removal structure for absorbing moisture in the moist air, a regeneration fan for generating airflow including the moisture absorbed by the moisture absorption and removal structure to flow toward a condenser for condensing water from the generated airflow. The moisture absorption and removal structure is disposed adjacent to the circulation fan, the regeneration fan, and the condenser; wherein the moisture absorption and removal structure comprises a roller assembly, a functional roller is provided on at least one of a bottom portion of the roller assembly or a side of the roller assembly.

Abstract: The invention discloses a novel packaging structure of a power semiconductor module, which mainly comprises an insulating radiating fin, a metal lead frame unit and a chip unit. The insulating radiating fin comprises an insulating layer, and an inner metal conducting layer and an outer metal conducting layer which are respectively arranged on two sides of the insulating layer; the metal lead frame unit mainly comprises a frame pin input portion, a frame pin output portion and a frame pin signal portion, the frame pin input portion is arranged on an upper side of the inner metal conducting layer in a solder welding mode, and the chip unit is welded to the middle of the inner metal conductive layer. The frame pin output portion is provided with an inner concave portion.