Abstract: A MEMS microphone is provided, comprising a substrate having a back cavity, and a plate capacitor structure arranged on the substrate, the plate capacitor structure being formed by a vibration diaphragm, a backplate and a support portion; wherein a pressure relief device is provided in the vibration diaphragm, a pressure maintaining channel is formed between the vibration diaphragm and the backplate; and the pressure relief device in the vibration diaphragm constitutes an inlet of the pressure maintaining channel.

Abstract: A MEMS microphone is provided, comprising a substrate having a back cavity, and a plate capacitor structure arranged on the substrate, the plate capacitor structure being formed by a vibration diaphragm, a backplate and a support portion; wherein a pressure relief device is provided in the vibration diaphragm, a pressure maintaining channel is formed between the vibration diaphragm and the backplate; and the pressure relief device in the vibration diaphragm constitutes an inlet of the pressure maintaining channel.

Abstract: The present invention discloses a vibration diaphragm in an MEMS microphone, and an MEMS microphone. The vibration diaphragm comprises a vibration diaphragm body and at least one pressure relief device defined by gaps in the vibration diaphragm body, wherein the gaps comprise at least two sections of circular arc-shaped gaps sequentially connected together. The two adjacent sections of circular arc-shaped gaps are in an S shape as a whole and centrosymmetrical with respect to a connected position thereof. The pressure relief device comprises at least two valve clacks formed by at least two sections of adjacent circular arc-shaped gaps and neck portions connected to the valve clacks and the vibration diaphragm body and of a constraint shape.

Abstract: The present invention provides a condenser microphone, comprising a substrate, and a back plate and a vibrating diaphragm which are arranged on the substrate; the back plate is arranged on the upper side and/or the lower side of the vibrating diaphragm; and the vibrating diaphragm is provided with a protruding layer or a corrugated membrane structure layer. With the above invention, the area of the vibrating diaphragm and the capacitance at the lateral side of the condenser microphone can be increased, so as to achieve the effect of improving the sensitivity of the condenser microphone.

Abstract: An environmental sensor and manufacturing method thereof. The environmental sensor comprises: a substrate comprising at least one recess disposed at an upper portion of the substrate; and a sensitive film layer disposed above the substrate, comprising a fixed portion fixed on an end surface of the substrate and a bent portion configured to extend inside the recess. The bent portion and a side wall of the recess form a capacitor configured to detect a signal. The bent portion, fixed portion, and the recess form a closed cavity. A conventional capacitive structure configured on a substrate surface is changed to a capacitive structure of the environmental sensor vertically extending into the inside of the substrate, increasing a depth of the recess, and in turn, increasing a sensing area between two polar plates of the capacitor, significantly shrinking a coverage area of the capacitor on the substrate, and satisfying a requirement of a modern compact electronic component.

Abstract: Provided are a MEMS microphone chip and an MEMS microphone. The MEMS microphone chip comprises a substrate, a backplate and a vibration diaphragm, the backplate and the vibration diaphragm constituting two electrodes of a capacitor respectively, the backplate and the vibration diaphragm being suspended above the substrate, the backplate being located between the substrate and the vibration diaphragm, and the substrate being provided with a back chamber and a support column, the support column being connected to a side wall of the back chamber via a connection portion, a through hole or a notch being formed in the connection portion through its thickness direction, to allow spaces at opposite sides of the connection portion to communicate with each other; and the support column being configured to support the backplate.

Abstract: Provided are a MEMS microphone chip and an MEMS microphone. The MEMS microphone chip comprises a substrate, a backplate and a vibration diaphragm, the backplate and the vibration diaphragm constituting two electrodes of a capacitor respectively, the backplate and the vibration diaphragm being suspended above the substrate, the backplate being located between the substrate and the vibration diaphragm, and the substrate being provided with a back chamber and a support column, the support column being connected to a side wall of the back chamber via a connection portion, a through hole or a notch being formed in the connection portion through its thickness direction, to allow spaces at opposite sides of the connection portion to communicate with each other; and the support column being configured to support the backplate.

Abstract: The present invention provides a condenser microphone, comprising a substrate, and a back plate and a vibrating diaphragm which are arranged on the substrate; the back plate is arranged on the upper side and/or the lower side of the vibrating diaphragm; and the vibrating diaphragm is provided with a protruding layer or a corrugated membrane structure layer. With the above invention, the area of the vibrating diaphragm and the capacitance at the lateral side of the condenser microphone can be increased, so as to achieve the effect of improving the sensitivity of the condenser microphone.

Abstract: The present invention discloses a piezoelectric microphone. The piezoelectric microphone comprises a substrate having a cavity-backed, and a piezoelectric film connected to the upper side of the substrate via an insulating layer. A position on the piezoelectric film, which is located at the inner side of a junction of the piezoelectric film and the substrate, is provided with a plurality of hollowed-out holes. The hollowed-out holes in the piezoelectric film are at least partly overlapped with the substrate. A gap is provided between the substrate and the position, where the hollowed-out holes are located, on the piezoelectric film. The gap and the hollowed-out holes a together form a channel.

Abstract: The present invention discloses a vibration diaphragm in an MEMS microphone, and an MEMS microphone. The vibration diaphragm comprises a vibration diaphragm body (1) and at least one pressure relief device (2) defined by gaps (a) in the vibration diaphragm body (1), wherein the gaps (a) comprise at least two sections of circular arc-shaped gaps sequentially connected together. The two adjacent sections of circular arc-shaped gaps are in an S shape as a whole and centrosymmetrical with respect to a connected position thereof. The pressure relief device (2) comprises at least two valve clacks formed by at least two sections of adjacent circular arc-shaped gaps and neck portions connected to the valve clacks and the vibration diaphragm body (1) and of a constraint shape. When subjected to a relatively high sound pressure caused by, for example, mechanical shock, blowing or falling, the at least two valve clacks symmetrical in structure can warp upwards or downwards by taking respective neck portions as pivots.

Abstract: An MEMS microphone is disclosed, which comprises a substrate and a vibrating diaphragm and a back electrode which are located above the substrate, a plurality of comb tooth parts are formed in edge positions of the vibrating diaphragm, and the plurality of comb tooth parts are distributed in a peripheral direction of the vibrating diaphragm at intervals, wherein a position between every two adjacent comb tooth parts on the vibrating diaphragm is connected to the substrate via an insulating layer; and the comb tooth parts on the vibrating diaphragm are at least partially overlapped with the substrate, and a clearance exists between the comb tooth parts and the substrate and is configured as an airflow circulation channel. The microphone of the present invention has better impact resistance and can avoid intrusion of dust.

Abstract: An acoustic sensor integrated MEMS microphone structure and a fabrication method thereof. A diaphragm (3e) and back-pole (7) which forms a condenser structure are formed on a substrate (1) having at least one recessed slot (1a) on the top. A sensitive electrode is formed on the substrate (1), the sensitive electrode comprising a fixed portion (3b) fixed on the substrate (1) via a sacrificial layer (2), and a bending portion (3a) inserted into the recessed slot (1a), wherein the bending portion and the side wall of the recessed slot form the condenser structure. The integrated structure integrates the condenser structure of the microphone and condenser structure of the acoustic sensor on a substrate (1), thereby increasing the integration level thereof and reducing the overall size of the package.

Abstract: A method for forming a filter net on an MEMS sensor and an MEMS sensor are disclosed. The method comprises the following steps: disposing a dissociable adhesive tape on a base material, and forming a filter net on an adhesive surface of the dissociable adhesive tape; transferring the filter net on a film to form a self-adhesive coiled material; and transferring and adhering the filter net on the self-adhesive coiled material to collecting a hole of the MEMS sensor. The filter net formed by the method have fine and uniform meshes, and a yield is high. In addition, the method is suitable for large-scale and industrialized production.

Abstract: The present invention discloses a piezoelectric microphone. The piezoelectric microphone comprises a substrate having a cavity-backed, and a piezoelectric film connected to the upper side of the substrate via an insulating layer. A position on the piezoelectric film, which is located at the inner side of a junction of the piezoelectric film and the substrate, is provided with a plurality of hollowed-out holes. The hollowed-out holes in the piezoelectric film are at least partly overlapped with the substrate. A gap is provided between the substrate and the position, where the hollowed-out holes are located, on the piezoelectric film. The gap and the hollowed-out holes a together form a channel.

Abstract: An MEMS microphone is disclosed, which comprises a substrate and a vibrating diaphragm and a back electrode which are located above the substrate, a plurality of comb tooth parts are formed in edge positions of the vibrating diaphragm, and the plurality of comb tooth parts are distributed in a peripheral direction of the vibrating diaphragm at intervals, wherein a position between every two adjacent comb tooth parts on the vibrating diaphragm is connected to the substrate via an insulating layer; and the comb tooth parts on the vibrating diaphragm are at least partially overlapped with the substrate, and a clearance exists between the comb tooth parts and the substrate and is configured as an airflow circulation channel. The microphone of the present invention has better impact resistance and can avoid intrusion of dust.

Abstract: A method for forming a filter net on an MEMS sensor and an MEMS sensor are disclosed. The method comprises the following steps: disposing a dissociable adhesive tape on a base material, and forming a filter net on an adhesive surface of the dissociable adhesive tape; transferring the filter net on a film to form a self-adhesive coiled material; and transferring and adhering the filter net on the self-adhesive coiled material to collecting a hole of the MEMS sensor. The filter net formed by the method have fine and uniform meshes, and a yield is high. In addition, the method is suitable for large-scale and industrialized production.

Abstract: An environmental sensor and manufacturing method thereof. The environmental sensor comprises: a substrate comprising at least one recess disposed at an upper portion of the substrate; and a sensitive film layer disposed above the substrate, comprising a fixed portion fixed on an end surface of the substrate and a bent portion configured to extend inside the recess. The bent portion and a side wall of the recess form a capacitor configured to detect a signal. The bent portion, fixed portion, and the recess form a closed cavity. A conventional capacitive structure configured on a substrate surface is changed to a capacitive structure of the environmental sensor vertically extending into the inside of the substrate, increasing a depth of the recess, and in turn, increasing a sensing area between two polar plates of the capacitor, significantly shrinking a coverage area of the capacitor on the substrate, and satisfying a requirement of a modern compact electronic component.

Abstract: An acoustic sensor integrated MEMS microphone structure and a fabrication method thereof. A diaphragm (3e) and back-pole (7) which forms a condenser structure are formed on a substrate (1) having at least one recessed slot (1a) on the top. A sensitive electrode is formed on the substrate (1), the sensitive electrode comprising a fixed portion (3b) fixed on the substrate (1) via a sacrificial layer (2), and a bending portion (3a) inserted into the recessed slot (1a), wherein the bending portion and the side wall of the recessed slot form the condenser structure. The integrated structure integrates the condenser structure of the microphone and condenser structure of the acoustic sensor on a substrate (1), thereby increasing the integration level thereof and reducing the overall size of the package.