Abstract: An electronic apparatus includes a chassis, a keyboard device which is installed on the upper surface side of the chassis and has a plurality of keycaps and a frame which is installed on the upper surface side of the chassis and isolates the respective keycaps of the keyboard device from one another, in which each of at least some of the plurality of keycaps has an upper plate which forms an operation surface, and side walls on four sides which are provided so as to hang down from a peripheral edge part of the upper plate and face the frame respectively, and in at least the side wall on one side of the side walls on the four sides, a flow path formation part which widens a clearance between that side wall and the frame and thereby forms an air flow path is provided.

Abstract: A heat radiation structure includes a mesh that abuts on a surface of a die, and a vapor chamber that interposes the mesh between the surface of the die and the vapor chamber. The mesh includes a heat generation element abutting range portion that is provided at a central portion of the mesh, is impregnated with a liquid metal, and abuts on the surface of the die to receive heat, and a pair of heat generation element non-abutting range portions that continuously extends from both sides of the heat generation element abutting range portion and does not abut on the surface of the die. Each of the pair of heat generation element non-abutting range portions is fixed to the vapor chamber via a sheet material. Each of a pair of the heat generation element non-abutting range portions is interposed between a pair of the sheet materials.

Abstract: A centrifugal fan includes: a fan having a motor that rotates around a central axis, and a plurality of blades provided on an outer periphery of the motor; and a casing which accommodates the fan, and has an intake port provided in the axial direction of the central axis, and an exhaust port provided in a direction orthogonal to the central axis, wherein an end surface of each of the plurality of blades that faces the intake port is provided with an inclined portion that inclines such that a height thereof in the axial direction gradually decreases toward the motor, and the plurality of blades include a plurality of blade groups having different start point positions at which the inclined portions start to incline in a direction from the tips of the blades toward the motor.

Abstract: A heat radiation component radiates heat from a GPU that generates heat, and includes a mesh impregnated with a liquid metal, and two film bodies that cover both surfaces of the mesh and have sealed peripheries. An opening is formed in the film body. In the mesh, an exposed portion that is exposed through the opening abuts on a surface of a die of the GPU. In the mesh, the portion exposed through the opening is formed of two layers, a first layer and a second layer. In the mesh, an area of the exposed portion exposed through the opening is smaller than an area of the other portion.

Abstract: A heat radiation structure includes a vapor chamber provided along a surface of a die, a mesh interposed between the die and the vapor chamber, and a liquid metal impregnated in the mesh. In the mesh, a peripheral portion has a higher material density per unit volume than a central portion. In the mesh, the central portion may be formed of a single layer, and the peripheral portion is formed of two layers. The mesh may be a resin material.

Abstract: A heat radiating structure includes a mesh which abuts on a surface of a die of a GPU and a copper plate which is equipped with a recessed part into which the mesh fits and which sandwiches and holds the mesh together with the surface of the die. The mesh includes a heat generating element abutment range part into which a liquid metal is impregnated and which abuts on the surface of the die and receives heat from the die and a heat generating element non-abutment region part which is contiguous to the heat generating element abutment range part and does not abut on the surface of the die. The heat generating element non-abutment range part is fixed to the copper plate with the use of a sponge tape. The heat generating element abutment range part is shaped to protrude from the heat generating element abutment range part.

Abstract: A cooling module includes a fan, a heat sink, and a first heat pipe and a second heat pipe that are connected to a first surface of the heat sink. The heat sink includes a valley portion in which the second surface is recessed toward a side of the first surface, a first mountain portion that is between the valley portion and the air introduction surface and has a greater height of the fin than the valley portion, and a second mountain portion that is between the valley portion and the air exhaust surface and has a greater height of the fin than the valley portion. The first mountain portion is disposed at a position overlapping the first heat pipe, and the second mountain portion is disposed at a position overlapping the second heat pipe.

Abstract: A heat dissipation structure of an electric component that generates heat includes: a heat dissipator provided along a surface of the electric component; a liquid metal interposed between the electric component and the heat dissipator; and a fencing body interposed between the electric component and the heat dissipator in a crushed state and surrounding the liquid metal.

Abstract: An electronic apparatus includes: a chassis; a first and a second heat generating elements which are placed with a step between surfaces thereof; and a cooling module that absorbs heat generated by the first and the second heat generating elements. The cooling module has: a first heat pipe having a first surface thereof connected to a surface of the first heat generating element; a plate-shaped vapor chamber having a first surface thereof connected to a surface of the second heat generating element and a second surface of the first heat pipe; a second heat pipe which is connected to a second surface of the vapor chamber and overlaps the second heat generating element; a first fin connected to the first heat pipe; and a second fin connected to the second heat pipe.

Abstract: A heat dissipation structure, for a semiconductor chip in which a die is provided on a surface of a substrate and an electric element is provided around the die, includes: a heat transfer plate thermally connected to a surface of the die; a liquid metal provided between the surface of the die and the heat transfer plate; and an insulating material covering the electric element. The heat transfer plate has a recessed portion in a location facing the electric element.

Abstract: An electronic apparatus includes a chassis, a heating element in the chassis, and a cooling module in the chassis to cool the heating element. The cooling module includes: a blower fan; a heat sink having a plurality of fins spaced to have a gap therebetween, a first face with a first gap from the first cover member, and a second face with a second gap from the second cover member; a seal member attached to the first face of the heat sink so as to surround the first face; and a cover sheet attached to a surface of the seal member so as to cover the first face of the heat sink, thus defining a duct between the cover sheet and the first face to let air from the blower fan pass through the duct.

Abstract: An electronic apparatus includes a chassis, a keyboard device, a frame including partition walls, and a fan device. At least part of the partition walls has a bottom edge surface notched to form an air flow path between the notched bottom edge surface and a top surface of the plate-shaped member, to have a communicating path through which adjacent key arrangement holes communicate. A height of the communicating path in a region not overlapping with the fan device is lower than a height of the communicating path in a region overlapping with the fan device, in a plan view of the chassis.

Abstract: An electronic apparatus includes a chassis, a keyboard device which is installed on the upper surface side of the chassis and has a plurality of keycaps and a frame which is installed on the upper surface side of the chassis and isolates the respective keycaps of the keyboard device from one another, in which each of at least some of the plurality of keycaps has an upper plate which forms an operation surface, and side walls on four sides which are provided so as to hang down from a peripheral edge part of the upper plate and face the frame respectively, and in at least the side wall on one side of the side walls on the four sides, a flow path formation part which widens a clearance between that side wall and the frame and thereby forms an air flow path is provided.