Patents by Inventor Junki SOMEKAWA

Junki SOMEKAWA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Printed wiring board and semiconductor package
    Patent number: 11040517
    Abstract: Provided are a printed circuit board in which warps are effectively suppressed, and a semiconductor package having a semiconductor device mounted on said printed circuit board, even though circuit patterns of different amounts of metal are formed on both sides of one cured product of a prepreg. Specifically, said printed circuit board is a printed circuit board which comprises a cured product of a prepreg comprising a fiber base material and a resin composition, in which circuit patterns of different amounts of metal are formed on both sides of one cured product of the prepreg, in which said prepreg has layers on the front and back of said fiber base material, wherein said layers comprise resin compositions having different heat curing shrinkage rates, in which among these layers, the layer made of the resin composition having a smaller heat curing shrinkage rate is present on the side on which the circuit pattern with a smaller amount of metal is formed.
    Type: Grant
    Filed: November 9, 2017
    Date of Patent: June 22, 2021
    Assignee: Showa Denko Materials Co., Ltd.
    Inventors: Takeshi Saitoh, Yukio Nakamura, Ryohta Sasaki, Junki Somekawa, Yuji Tosaka, Hiroshi Shimizu, Ryoichi Uchimura
  • PRINTED WIRING BOARD AND SEMICONDUCTOR PACKAGE
    Publication number: 20190315094
    Abstract: Provided are a printed circuit board in which warps are effectively suppressed, and a semiconductor package having a semiconductor device mounted on said printed circuit board, even though circuit patterns of different amounts of metal are formed on both sides of one cured product of a prepreg. Specifically, said printed circuit board is a printed circuit board which comprises a cured product of a prepreg comprising a fiber base material and a resin composition, in which circuit patterns of different amounts of metal are formed on both sides of one cured product of the prepreg, in which said prepreg has layers on the front and back of said fiber base material, wherein said layers comprise resin compositions having different heat curing shrinkage rates, in which among these layers, the layer made of the resin composition having a smaller heat curing shrinkage rate is present on the side on which the circuit pattern with a smaller amount of metal is formed.
    Type: Application
    Filed: November 9, 2017
    Publication date: October 17, 2019
    Inventors: Takeshi SAITOH, Yukio NAKAMURA, Ryohta SASAKI, Junki SOMEKAWA, Yuji TOSAKA, Hiroshi SHIMIZU, Ryoichi UCHIMURA