Abstract: A capillary-retaining structure for an ultrasonic horn used in a wire bonding apparatus including a stress relief hole formed inside of a capillary attachment hole that is opened at an end portion of the ultrasonic horn. Thus, the capillary retention by the ultrasonic horn is stabilized, and the vibrational characteristics of the ultrasonic horn are also stabilized, thus improving overall bondability in wire bonding. The same effect can be obtained by setting the thickness of a portion between the end surface of the horn and the capillary attachment hole to be thin or by utilizing a bold and nut combination to hold the capillary.

Abstract: A wire bonding method for connecting a first bonding point and a second bonding point via a wire including the steps of first connecting the wire to the first bonding point, raising a capillary slightly and moving it slightly away from the second bonding point, raising the capillary further by an amount sufficient for forming the wire loop with the wire being played out, moving the capillary over the second bonding point along a circular track which has a radius sufficient for forming the wire loop, and connecting the wire to the second bonding point.