Patents by Inventor Junling Gao

Junling Gao has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250093894
    Abstract: A method for controlling temperature and humidity in a storage device, in which (S1) a set temperature range and a set humidity range of the storage cavity are obtained; (S2) an initial temperature in the storage cavity is obtained, and the temperature in the storage cavity is adjusted by the temperature regulating system to reach the set temperature range; and (S3) an initial humidity in the storage cavity is obtained, and the humidity in the storage cavity is adjusted by the humidifying system and the dehumidifying system to reach the set humidity range. A system for implementing such method includes an acquisition module, a temperature adjustment module and a humidity adjustment module. A computer-readable storage medium stores a computer program, which is configured to be executed by a processor to implement the aforementioned method.
    Type: Application
    Filed: November 29, 2024
    Publication date: March 20, 2025
    Inventors: Wentian GONG, Junling GAO, Wenjie LI, Guihua WANG, Jinshan WANG, Baiqin WEN
  • Patent number: 11404621
    Abstract: Provided by the present invention is a magnesium-antimony-based (Mg—Sb-based) thermoelement, a preparation method and application thereof. The Mg—Sb-based thermoelement comprises: a substrate layer of a Mg—Sb-based thermoelectric material positioned in the center of the thermoelement, transitional layers that are attached to the two surfaces of the substrate layer, and two electrode layer that are respectively attached to the surfaces of the two transitional layers; the transitional layers are made of a magnesium-copper alloy and/or magnesium-aluminum alloy, and the electrode layer is made of copper. The transitional layer and the electrode layer which are developed in the present invention and which are suitable for a Mg—Sb-based thermoelectric material have great significance and prospects in application. The electrode layer enable the Mg—Sb-based thermoelectric material to have an opportunity to enter the market and realize commercialization.
    Type: Grant
    Filed: February 22, 2019
    Date of Patent: August 2, 2022
    Assignee: Institute of Physics, Chinese Academy of Sciences
    Inventors: Huaizhou Zhao, Jiawei Yang, Siyi Chang, Junling Gao
  • Publication number: 20220020909
    Abstract: Provided by the present invention is a magnesium-antimony-based (Mg—Sb-based) thermoelenient, preparation method and application thereof. The Mg—Sb-based. thermoelement comprises: a substrate layer of a Mg—Sb-based. thermoelectric material positioned in the center of the thermoelement, transitional layers that are attached to the two surfaces of the substrate layer, and two electrode layer that are respectively attached to the surfaces of the two transitional layers; the transitional layers are made of a magnesium-copper alloy and/or magnesium-aluminum alloy, and the electrode layer is made of copper. The transitional layer and the electrode layer which are developed in the present invention and which are suitable for a Mg—Sb-based thermoelectric material have great significance and prospects in application. The electrode layer enable the Mg—Sb-based thermoelectric material to have an opportunity to enter the market and realize commercialization.
    Type: Application
    Filed: February 22, 2019
    Publication date: January 20, 2022
    Applicant: INSTITUTE OF PHYSICS, CHINESE ACADEMY OF SCIENCES
    Inventors: Huaizhou Zhao, Jiawei Yang, Siyi Chang, Junling Gao
  • Patent number: 6715298
    Abstract: An indirect thermoelectric cooling device comprises a thermoelectric cooling plate, in the indirect thermoelectric cooling device, a heat dispersing member is connected to the hot end of the thermoelectric cooling plate, and a cooling transmitting member is connected to the cold end of the thermoelectric cooling plate, characterized in that an inside mid-frame is provided between the heat dispersing member and cooling transmitting member, an outside mid-frame which is of a shape of sleeve is provided to surround the inside mid-frame, and the thermoelectric cooling plate is sandwiched between the inside mid-frame and the outside mid-frame. According to the present invention, there exist less connecting portions in the route of the cold or hot gas transferring, thus decreasing the heat resistant, and increasing the cooling or heating transmit efficiency, so that the heat dispersing and the cooling transmitting can be both realized in the same device.
    Type: Grant
    Filed: August 31, 2001
    Date of Patent: April 6, 2004
    Assignee: Hebei Energy Conservation Investment Co., Ltd.
    Inventors: Chen Guo, Junling Gao
  • Publication number: 20020170296
    Abstract: An indirect thermoelectric cooling device comprises a thermoelectric cooling plate, in the indirect thermoelectric cooling device, a heat dispersing member is connected to the hot end of the thermoelectric cooling plate, and a cooling transmitting member is connected to the cold end of the thermoelectric cooling plate, characterized in that an inside mid-frame is provided between the heat dispersing member and cooling transmitting member, an outside mid-frame which is of a shape of sleeve is provided to surround the inside mid-frame, and the thermoelectric cooling plate is sandwiched between the inside mid-frame and the outside mid-frame. According to the present invention, there exist less connecting portions in the route of the cold or hot gas transferring, thus decreasing the heat resistant, and increasing the cooling or heating transmit efficiency, so that the heat dispersing and the cooling transmitting can be both realized in the same device.
    Type: Application
    Filed: August 31, 2001
    Publication date: November 21, 2002
    Inventors: Chen Guo, Junling Gao
  • Patent number: 6351951
    Abstract: A thermoelectric cooling device using heat pipes for heat conducting and dispersing, comprising a multi-bundle of the heat pipe conducting plates installed at the cold end of the thermoelectric cooling member and converged to condenser, a multi-bundle of the heat pipe heat exchangers installed at the hot end of the thermoelectric cooling member with fin plates or fin stripes and converged to the evaporator. It performs a fast cooling and heat dispersing by heat pipes and high efficient phase change and heat transport of the working medium. It can eliminate the heat exchange produced by the heat accumulation on the cold and hot ends, so as to run at the minimum operation temperature differences in order to obtain the maximum cooling capacity.
    Type: Grant
    Filed: November 17, 2000
    Date of Patent: March 5, 2002
    Inventors: Chen Guo, Junling Gao, Aimin Zhang