Patents by Inventor Junlong NIE

Junlong NIE has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Camera module comprising circuit board with lateral connecting belts
    Patent number: 12744982
    Abstract: Disclosed is a circuit board for a camera module including a circuit board body and at least two lateral connecting belts, wherein the lateral connecting belts are led out from the side surfaces of the circuit board body and bend upwards, and, after being bent, extend on the side surfaces of a camera module to form lateral connecting belt bodies, an outer surface of a hard plate of one of the lateral connecting belts is provided with a plurality of bonding pads, and the hard plate of the other lateral connecting belt has a plurality of conductive holes, so that the movement resistance of a circuit board body and a photosensitive chip can be reduced, while the yield and production efficiency are improved.
    Type: Grant
    Filed: September 9, 2022
    Date of Patent: September 22, 2026
    Assignee: NINGBO SUNNY OPOTECH CO., LTD.
    Inventors: Haijiang Zhu, Yihang Lao, Yafei Zhu, Junlong Nie, Yongming Chen, Wei Li, Dike Fan, Hangang Wei, Yi Yang, Sisi Yu, Chunmei Liu, Kaikai Zhao, Yurong Wu
  • Circuit Board for Camera Module and Corresponding Camera Module
    Publication number: 20250280185
    Abstract: Disclosed is a circuit board for a camera module including a circuit board body and at least two lateral connecting belts, wherein the lateral connecting belts are led out from the side surfaces of the circuit board body and bend upwards, and, after being bent, extend on the side surfaces of a camera module to form lateral connecting belt bodies, an outer surface of a hard plate of one of the lateral connecting belts is provided with a plurality of bonding pads, and the hard plate of the other lateral connecting belt has a plurality of conductive holes, so that the movement resistance of a circuit board body and a photosensitive chip can be reduced, while the yield and production efficiency are improved.
    Type: Application
    Filed: September 9, 2022
    Publication date: September 4, 2025
    Inventors: Haijiang ZHU, Yihang LAO, Yafei ZHU, Junlong NIE, Yongming CHEN, Wei LI, Dike FAN, Hangang WEI, Yi YANG, Sisi YU, Chunmei LIU, Kaikai ZHAO, Yurong WU