Patents by Inventor Junmi JEON

Junmi JEON has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electroless nickel plating solution, electroless nickel plating method using same, and flexible nickel plated layer formed by using same
    Patent number: 10358724
    Abstract: The present invention provides an electroless nickel plating solution supplying high flexibility to a plated layer and having improved stability. The electroless nickel plating solution according to an embodiment of the present invention is an electroless nickel plating layer using an electroless nickel plating method. The electroless nickel plating solution comprises: a nickel metal salt providing a nickel ion for plating, and containing sulfamic acid nickel; a reducer reducing the nickel ion for plating; a complexing agent forming a complex together with the nickel ion for plating; and a cyan-based stabilizer providing stability of the electroless plating solution and preventing the generation of pits in a flexible nickel plated layer.
    Type: Grant
    Filed: July 1, 2014
    Date of Patent: July 23, 2019
    Assignee: KOREA INSTITUTE OF INDUSTRIAL TECHNOLOGY
    Inventors: Hongkee Lee, Junmi Jeon
  • ELECTROLESS NICKEL PLATING SOLUTION, ELECTROLESS NICKEL PLATING METHOD USING SAME, AND FLEXIBLE NICKEL PLATED LAYER FORMED BY USING SAME
    Publication number: 20160168718
    Abstract: The present invention provides an electroless nickel plating solution supplying high flexibility to a plated layer and having improved stability. The electroless nickel plating solution according to an embodiment of the present invention is an electroless nickel plating layer using an electroless nickel plating method. The electroless nickel plating solution comprises: a nickel metal salt providing a nickel ion for plating, and containing sulfamic acid nickel; a reducer reducing the nickel ion for plating; a complexing agent forming a complex together with the nickel ion for plating; and a cyan-based stabilizer providing stability of the electroless plating solution and preventing the generation of pits in a flexible nickel plated layer.
    Type: Application
    Filed: July 1, 2014
    Publication date: June 16, 2016
    Inventors: Hongkee LEE, Junmi JEON