Patents by Inventor Junnan Jin

Junnan Jin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11981834
    Abstract: The present disclosure discloses a high-temperature fast-curing starch-based adhesive for particleboards and a preparation method thereof, belonging to the technical field of adhesive preparation. The low viscosity of the starch-based adhesive is ensured by selecting a crosslinking monomer which does not self-crosslink in a reaction process in the present disclosure, and a binary crosslinking agent matched with the crosslinking monomer is added before use to be quickly crosslinked with the crosslinking monomer at high temperature so as to ensure better thermosetting property and water resistance as well as faster curing speed of the starch-based adhesive at the same time, which meets the requirements of the particleboards for the adhesive, solves the problem of long curing time of the existing starch-based adhesives at high temperatures, further shortens the curing time of the starch-based adhesives to about 60 s, and improves the production efficiency of the particleboards.
    Type: Grant
    Filed: December 6, 2023
    Date of Patent: May 14, 2024
    Assignee: JIANGNAN UNIVERSITY
    Inventors: Li Cheng, Zhengbiao Gu, Yan Hong, Zhaofeng Li, Caiming Li, Xiaofeng Ban, Junnan Jin, Dongdong Wu, Mengwei Zhang, Jian Yin
  • Publication number: 20240101873
    Abstract: The present disclosure discloses a high-temperature fast-curing starch-based adhesive for particleboards and a preparation method thereof, belonging to the technical field of adhesive preparation. The low viscosity of the starch-based adhesive is ensured by selecting a crosslinking monomer which does not self-crosslink in a reaction process in the present disclosure, and a binary crosslinking agent matched with the crosslinking monomer is added before use to be quickly crosslinked with the crosslinking monomer at high temperature so as to ensure better thermosetting property and water resistance as well as faster curing speed of the starch-based adhesive at the same time, which meets the requirements of the particleboards for the adhesive, solves the problem of long curing time of the existing starch-based adhesives at high temperatures, further shortens the curing time of the starch-based adhesives to about 60 s, and improves the production efficiency of the particleboards.
    Type: Application
    Filed: December 6, 2023
    Publication date: March 28, 2024
    Inventors: Li CHENG, Zhengbiao GU, Yan HONG, Zhaofeng LI, Caiming LI, Xiaofeng BAN, Junnan JIN, Dongdong WU, Mengwei ZHANG, Jian YIN
  • Patent number: 11879071
    Abstract: The present disclosure discloses a low-viscosity thermosetting starch adhesive for particleboards, and a preparation method therefore, belonging to the technical field of adhesive preparation. The adhesive of the present invention selects N-hydroxyethyl acrylamide or acetoxyethyl methacrylate as the crosslinking monomer, which has a low degree of crosslinking in the process of adhesive preparation to avoid the problem of increasing viscosity, but can cross-link quickly during the hot pressing process, forming a network structure, and improving the water resistance of the adhesive; and furthermore, itaconic acid is added to promote the self-crosslinking reaction of the crosslinking monomer in the hot-pressing process, thus further improving the water resistance.
    Type: Grant
    Filed: June 13, 2023
    Date of Patent: January 23, 2024
    Assignee: JIANGNAN UNIVERSITY
    Inventors: Li Cheng, Junnan Jin, Zhengbiao Gu, Zhaofeng Li, Yan Hong, Caiming Li, Xiaofeng Ban
  • Publication number: 20230323164
    Abstract: The present disclosure discloses a low-viscosity thermosetting starch adhesive for particleboards, and a preparation method therefore, belonging to the technical field of adhesive preparation. The adhesive of the present invention selects N-hydroxyethyl acrylamide or acetoxyethyl methacrylate as the crosslinking monomer, which has a low degree of crosslinking in the process of adhesive preparation to avoid the problem of increasing viscosity, but can cross-link quickly during the hot pressing process, forming a network structure, and improving the water resistance of the adhesive; and furthermore, itaconic acid is added to promote the self-crosslinking reaction of the crosslinking monomer in the hot-pressing process, thus further improving the water resistance.
    Type: Application
    Filed: June 13, 2023
    Publication date: October 12, 2023
    Inventors: Li Cheng, Junnan Jin, Zhengbiao Gu, Zhaofeng Li, Yan Hong, Caiming Li, Xiaofeng Ban