Patents by Inventor Junpei Fujiwara

Junpei Fujiwara has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11938931
    Abstract: A stop assist system for moving a moving body to a stop position and making the moving body stop at the stop position includes: an external environment recognizing unit that recognizes an external environment of the moving body; and a moving body control unit that executes a driving process to make the moving body travel to the stop position based on a recognition result of the external environment recognizing unit. The moving body control unit suspends the driving process when, while the moving body is traveling to the stop position, the moving body control unit determines, based on the recognition result, that there is an object within a range of a prescribed lateral threshold value on a lateral outside of the moving body and the object extends over a prescribed longitudinal threshold value or more along a travel direction within the range.
    Type: Grant
    Filed: February 18, 2022
    Date of Patent: March 26, 2024
    Assignee: HONDA MOTOR CO., LTD.
    Inventors: Junpei Noguchi, Gaku Shimamoto, Takuma Sekino, Tatsuro Fujiwara, Akiko Nakamura, Kazuya Kobayashi, Masafumi Sagara, Takeshi Sasajima
  • Patent number: 11904518
    Abstract: [Problem] The objective of the present invention is to provide a sheet expressing a good tactile sensation and a molded product thereof. [Solution] A sheet expressing a good tactile sensation and a molded product thereof are provided by configuring a thermoplastic resin sheet having a base layer and hairlike bodies arranged regularly on at least one surface thereof, wherein a continuous phase is formed without a structural boundary between the base layer and the hairlike bodies.
    Type: Grant
    Filed: July 20, 2017
    Date of Patent: February 20, 2024
    Assignee: Denka Company Limited
    Inventors: Junpei Fujiwara, Yasushi Hirokawa, Tomohiro Osawa
  • Patent number: 11701874
    Abstract: A layered sheet has a substrate layer and surface layers provided on both surfaces of the substrate layer, wherein the surface layers contain 50 to 90 mass % of component (A) defined below and 10 to 50 mass % of component (B) defined below relative to the overall mass of the surface layer; the substrate layer is composed of a vinyl aromatic hydrocarbon resin composition containing monomer units derived from conjugated dienes; and a percentage of the monomer units derived from the conjugated dienes in the substrate layer is 6 to 14 mass % relative to all monomer units in the vinyl aromatic hydrocarbon-based resin composition. Component (A) is a rubber-modified (meth)acrylic acid ester-vinyl aromatic hydrocarbon copolymer in which the percentage of a conjugated diene rubber component is 5 to 25 mass %. Component (B) is a polymeric antistatic agent.
    Type: Grant
    Filed: April 16, 2020
    Date of Patent: July 18, 2023
    Assignee: DENKA COMPANY LIMITED
    Inventors: Ryosuke Yanaka, Junpei Fujiwara
  • Patent number: 11623424
    Abstract: A sheet expressing a good tactile sensation and a molded product thereof. By configuring a resin sheet including hairlike bodies arranged regularly on at least one surface of an underlayer in which a continuous phase is formed without any structural boundary between the underlayer and the hairlike bodies, and the underlayer and the hairlike bodies have at least partially a crosslinked structure, a molded product expressing a good tactile sensation is obtained.
    Type: Grant
    Filed: September 5, 2018
    Date of Patent: April 11, 2023
    Assignee: DENKA COMPANY LIMITED
    Inventors: Junpei Fujiwara, Shogo Hoshino
  • Publication number: 20230084488
    Abstract: A layered sheet 10 includes a substrate layer 1, and surface layers 2 and 3 configured to be layered on at least one surface of the substrate layer 1. The substrate layer 1 contains a first thermoplastic resin and inorganic fillers. The surface layers 2 and 3 contain a second thermoplastic resin and a conductive material. A content of the inorganic fillers in the substrate layer 1 is 0.3 to 28 mass % based on a total amount of the substrate layer.
    Type: Application
    Filed: March 8, 2021
    Publication date: March 16, 2023
    Applicant: DENKA COMPANY LIMITED
    Inventors: Yuko FUKUDA, Junpei FUJIWARA, Ryosuke YANAKA
  • Publication number: 20220194067
    Abstract: A layered sheet has a substrate layer and surface layers provided on both surfaces of the substrate layer, wherein the surface layers contain 50 to 90 mass % of component (A) defined below and 10 to 50 mass % of component (B) defined below relative to the overall mass of the surface layer; the substrate layer is composed of a vinyl aromatic hydrocarbon resin composition containing monomer units derived from conjugated dienes; and a percentage of the monomer units derived from the conjugated dienes in the substrate layer is 6 to 14 mass % relative to all monomer units in the vinyl aromatic hydrocarbon-based resin composition. Component (A) is a rubber-modified (meth)acrylic acid ester-vinyl aromatic hydrocarbon copolymer in which the percentage of a conjugated diene rubber component is 5 to 25 mass %. Component (B) is a polymeric antistatic agent.
    Type: Application
    Filed: April 16, 2020
    Publication date: June 23, 2022
    Applicant: DENKA COMPANY LIMITED
    Inventors: Ryosuke YANAKA, Junpei FUJIWARA
  • Publication number: 20210130653
    Abstract: [Problem] The present invention is to provide: a film which is excellent in film moldability, is also excellent in heat resistance and transparency, and has a small shrinkage factor and a small heating weight loss ratio even under a high-temperature atmosphere; and a heat-resistant adhesive tape comprising the same. [Solution] A multilayer film having alternately laminated therein one or more layers of each of a substrate layer (A) comprising a sulfone-based resin having a glass transition temperature of 200° C. or more and an adhesive layer (B) comprising a thermoplastic resin having a glass transition temperature of 190° C. or more, and a multilayer film excellent in film moldability, heat resistance, and transparency is obtained due to at least one outermost layer of the multilayer film comprising the adhesive layer (B) and the arithmetic mean surface roughness Ra of a surface of at least one outermost layer of the multilayer film being greater than 0.1 ?m and less than 10.0 ?m.
    Type: Application
    Filed: April 2, 2018
    Publication date: May 6, 2021
    Applicant: DENKA COMPANY LIMITED
    Inventors: Junpei Fujiwara, Takayuki IWASAKI, Yasushi HIROKAWA
  • Publication number: 20200368956
    Abstract: A resin sheet having hairlike bodies arranged regularly on at least one surface of an underlayer can be manufactured by forming the bodies by: melt extruding, from a die with an extrusion molding method, a thermoplastic resin having, on a log-log graph having elongational viscosity ?(t) (unit: Pa·S) as measured at a strain rate of 0.5 (unit: S?1) and at a temperature at which elongation is possible as the vertical axis and elongation time t (unit: S) as the horizontal axis, a region in which the slope (log ?/log t) in the interval 0.1<t<1.0 is no greater than 0.5 and by the temperature range wherein the adhesive force in probe tack measurement is 0.05-0.25 N/mm2 at least partially overlapping with the temperature at which elongation is possible; and casting using a transfer roll on which a relief process has been performed and a touch roll.
    Type: Application
    Filed: January 23, 2019
    Publication date: November 26, 2020
    Applicant: DENKA COMPANY LIMITED
    Inventors: Keishi MAEDA, Junpei FUJIWARA
  • Publication number: 20200215787
    Abstract: A sheet expressing a good tactile sensation and a molded product thereof. By configuring a resin sheet including hairlike bodies arranged regularly on at least one surface of an underlayer in which a continuous phase is formed without any structural boundary between the underlayer and the hairlike bodies, and the underlayer and the hairlike bodies have at least partially a crosslinked structure, a molded product expressing a good tactile sensation is obtained.
    Type: Application
    Filed: September 5, 2018
    Publication date: July 9, 2020
    Applicant: DENKA COMPANY LIMITED
    Inventors: Junpei FUJIWARA, Shogo HOSHINO
  • Publication number: 20190283301
    Abstract: [Problem] The objective of the present invention is to provide a sheet expressing a good tactile sensation and a molded product thereof. [Solution] A sheet expressing a good tactile sensation and a molded product thereof are provided by configuring a thermoplastic resin sheet having a base layer and hairlike bodies arranged regularly on at least one surface thereof, wherein a continuous phase is formed without a structural boundary between the base layer and the hairlike bodies.
    Type: Application
    Filed: July 20, 2017
    Publication date: September 19, 2019
    Applicant: Denka Company Limited
    Inventors: Junpei FUJIWARA, Yasushi HIROKAWA, Tomohiro OSAWA
  • Patent number: 10202506
    Abstract: Disclosed is an electronic component packaging sheet including a surface conductive layer formed on the surface of at least one side of a substrate sheet. The substrate sheet includes (A) 80,000 to 220,000 Mw of a styrene-conjugated diene block copolymer; (B) 200,000 to 400,000 Mw of a polystyrene resin; and (C) 150,000 to 210,000 Mw of an impact resistant polystyrene resin. The surface conductive layer includes (D) an acrylic copolymer resin; and (E) a polythiophene type polymer, particularly a polythiophene type polymer/anionic polymer ion complex. The electronic component packaging sheet is a transparent conductive sheet having excellent thermoforming properties, good transparency after thermoforming, and sufficient electrostatic diffusion performance to maintain a low surface resistance value. The electronic component packaging sheet is particularly suited for the manufacture of embossed carrier tape.
    Type: Grant
    Filed: October 6, 2011
    Date of Patent: February 12, 2019
    Assignee: DENKA COMPANY LIMITED
    Inventors: Junpei Fujiwara, Tomohiro Osawa, Masatoshi Kawata
  • Patent number: 10137660
    Abstract: Provided is a water-repellent, thermoplastic resin sheet provided with a textured layer having a microtexture on one surface side, and a water repellent layer formed with an approximately constant thickness on the aforementioned one surface side of the textured layer, wherein at least the surface region on the one surface side of the textured layer is a cross-linked material which maintains the microtexture even after heated drawing, and the water-repellent layer is formed from an olefin copolymer resin containing hydrophobic oxide particles. Also provided is a molded article, such as a molded container, formed by thermoforming the thermoplastic resin sheet.
    Type: Grant
    Filed: July 18, 2013
    Date of Patent: November 27, 2018
    Assignee: Denka Company Limited
    Inventors: Junpei Fujiwara, Tomohiro Osawa, Shogo Hoshino, Toshio Nagano, Atsushi Takei
  • Patent number: 9908311
    Abstract: Provided is a water-repellent, thermoplastic resin sheet including a textured layer which is formed from a polyethylene resin composition comprising a water repellent agent and which has a microscopic texture on one surface side, wherein at least the surface region of the textured layer is a cross-linked material which maintains the microscopic texture even after heated drawing. Also provided is a molded article, such as a molded container, formed by thermoforming the thermoplastic resin sheet.
    Type: Grant
    Filed: July 18, 2013
    Date of Patent: March 6, 2018
    Assignee: DENKA COMPANY LIMITED
    Inventors: Junpei Fujiwara, Atsushi Takei, Tomohiro Osawa
  • Publication number: 20150314554
    Abstract: Provided is a water-repellent, thermoplastic resin sheet provided with a textured layer having a microtexture on one surface side, and a water repellent layer formed with an approximately constant thickness on the aforementioned one surface side of the textured layer, wherein at least the surface region on the one surface side of the textured layer is a cross-linked material which maintains the microtexture even after heated drawing, and the water-repellent layer is formed from an olefin copolymer resin containing hydrophobic oxide particles. Also provided is a molded article, such as a molded container, formed by thermoforming the thermoplastic resin sheet.
    Type: Application
    Filed: July 18, 2013
    Publication date: November 5, 2015
    Applicant: DENKI KAGAKU KOGYO KABUSHIKI KAISHA
    Inventors: Junpei FUJIWARA, Tomohiro OSAWA, Shogo HOSHINO, Toshio NAGANO, Atsushi TAKEI
  • Publication number: 20150306852
    Abstract: Provided is a water-repellent, thermoplastic resin sheet including a textured layer which is formed from a polyethylene resin composition comprising a water repellent agent and which has a microscopic texture on one surface side, wherein at least the surface region of the textured layer is a cross-linked material which maintains the microscopic texture even after heated drawing. Also provided is a molded article, such as a molded container, formed by thermoforming the thermoplastic resin sheet.
    Type: Application
    Filed: July 18, 2013
    Publication date: October 29, 2015
    Applicant: DENKI KAGAKU KOGYO KABUSHIKI KAISHA
    Inventors: Junpei FUJIWARA, Atsushi TAKEI, Tomohiro OSAWA
  • Patent number: 9028938
    Abstract: An electronic component packaging sheet formed of a styrene resin composition includes: (A) 29-65 mass parts of a styrene-conjugated diene block copolymer; (B) 51-15 mass parts of a polystyrene resin; and (C) 20-9 mass parts of an impact resistant polystyrene resin. Components (A)-(C) each have a weight average molecular weight (Mw) within a specified range.
    Type: Grant
    Filed: October 6, 2011
    Date of Patent: May 12, 2015
    Assignee: Denki Kagaku Kogyo Kabushiki Kaisha
    Inventors: Junpei Fujiwara, Masatoshi Kawata
  • Patent number: 9028939
    Abstract: The present invention discloses a laminated sheet for packaging electronic components comprising a front surface layer, a center core layer and a rear surface layer, wherein the front surface layer and the rear surface layer each contains a rubber-modified styrenic copolymer (A) having a graft ratio of grafted rubber of 30 to 50%, a grafted rubber particle diameter of 0.1 to 0.5 ?m and a butadiene content of 5 to 25% by weight, and polyetheresteramide (B), and the center core layer contains a rubber-modified styrenic copolymer (C) having a graft ratio of grafted rubber of 70 to 90%, a grafted rubber particle diameter of 0.4 to 1.0 ?m, and a butadiene content of 5 to 15% by weight, and 5 to 50% by weight of a recycled material of this laminated sheet.
    Type: Grant
    Filed: January 25, 2012
    Date of Patent: May 12, 2015
    Assignee: Denki Kagaku Kogyo Kabushiki Kaisha
    Inventors: Junpei Fujiwara, Masatoshi Kawata, Yasushi Miyamura
  • Patent number: 8999470
    Abstract: Disclosed is a surface conductive laminated sheet which comprises a base material layer containing an ABS resin as a main component, and a surface layer laminated on the surface of at least one side of the base material layer. In the laminated sheet, the ABS resin in the base material layer includes a composition made of 5-15 mass % of vinyl cyanide monomer, 45-65 mass % of diene-based rubber, and 50-20 mass % of aromatic vinyl monomer, and includes a graft rubber having a graft rate of 50-80%. The graft rubber has a mass average molecular weight (Mw) of a graft chain of 18,000-56,000, and/or has a volume average particle diameter of 0.3 to 2.0 ?m. By using the laminated sheet, it is possible to obtain an electronic part packaging container, such as carrier tape etc., which has extremely few punch burrs regardless of the type of forming apparatus when punched by means of a slit method or embossing.
    Type: Grant
    Filed: March 18, 2011
    Date of Patent: April 7, 2015
    Assignee: Denki Kagaku Kogyo Kabushiki Kaisha
    Inventors: Junpei Fujiwara, Masatoshi Kawata, Yasushi Miyamura
  • Publication number: 20130295307
    Abstract: The present invention discloses a laminated sheet for packaging electronic components comprising a front surface layer, a center core layer and a rear surface layer, wherein the front surface layer and the rear surface layer each contains a rubber-modified styrenic copolymer (A) having a graft ratio of grafted rubber of 30 to 50%, a grafted rubber particle diameter of 0.1 to 0.5 ?m and a butadiene content of 5 to 25% by weight, and polyetheresteramide (B), and the center core layer contains a rubber-modified styrenic copolymer (C) having a graft ratio of grafted rubber of 70 to 90%, a grafted rubber particle diameter of 0.4 to 1.0 ?m, and a butadiene content of 5 to 15% by weight, and 5 to 50% by weight of a recycled material of this laminated sheet.
    Type: Application
    Filed: January 25, 2012
    Publication date: November 7, 2013
    Applicant: DENKI KAGAKU KOGYO KABUSHIKI KAISHA
    Inventors: Junpei Fujiwara, Masatoshi Kawata, Yasushi Miyamura
  • Publication number: 20130209748
    Abstract: Disclosed is an electronic component packaging sheet including a surface conductive layer formed on the surface of at least one side of a substrate sheet. The substrate sheet includes 80,000 to 220,000 Mw of a styrene-conjugated diene block copolymer; 200,000 to 400,000 Mw of a polystyrene resin; and 150,000 to 210,000 Mw of an impact resistant polystyrene resin. The surface conductive layer includes an acrylic copolymer resin; and carbon nanotubes. The electronic component packaging sheet is a transparent conductive sheet having excellent thermoforming properties, good transparency after thermoforming, and sufficient electrostatic diffusion performance to maintain a low surface resistance value. The electronic component packaging sheet is particularly suited for the manufacture of embossed carrier tape.
    Type: Application
    Filed: October 6, 2011
    Publication date: August 15, 2013
    Applicant: DENKI KAGAKU KOGYO KABUSHIKI KAISHA
    Inventors: Junpei Fujiwara, Tomohiro Osawa, Masatoshi Kawata