Abstract: An object of the invention is to obtain a preparation which shows enhanced effectiveness and safety compared to tacrolimus, has the concentration in blood maintained at a constant level without individual differences, whereby the control of the amount of administration depending on the blood kinetics (blood trough concentration) becomes unnecessary. The present invention relates to a polymeric derivative of tacrolimus, in which a polyethylene glycol segment and an alcoholic hydroxy group of tacrolimus are bonded to side-chain carboxy groups of a polyaspartic acid derivative.

Abstract: An object of the invention is to obtain a preparation which shows enhanced effectiveness and safety compared to tacrolimus, has the concentration in blood maintained at a constant level without individual differences, whereby the control of the amount of administration depending on the blood kinetics (blood trough concentration) becomes unnecessary. The present invention relates to a polymeric derivative of tacrolimus, in which a polyethylene glycol segment and an alcoholic hydroxy group of tacrolimus are bonded to side-chain carboxy groups of a polyaspartic acid derivative.

Abstract: A problem of the present invention is to obtain a preparation which shows markedly enhanced effectiveness and safety by exhibiting high accumulability at diseased areas and having the blood concentration maintained at a constant level without individual differences, and for which the control of the dosage depending on the blood kinetics (blood trough concentration) becomes unnecessary. The invention relates to a polymeric derivative of tacrolimus including a copolymer of a polyethylene glycol segment and a polymeric moiety, in which a carboxy group in a side chain of the copolymer is bonded to an alcoholic hydroxy group of tacrolimus.

Abstract: In the assembly of a semiconductor device, improvement in the reliability of flip chip bonding is aimed at. By forming a dummy terminal in the end portion of the row of a plurality of terminals for a flip chip in the package substrate, the flow of flux or solder can be suppressed with the dummy terminal, and a solder layer can be formed on the plurality of terminals for a flip chip. Thereby, the thickness of the solder layer formed on each terminal for a flip chip can fully be secured, without making solder adhere to the wire connection terminal closely formed to the terminal for a flip chip. As a result, improvement in the reliability of flip chip bonding can be aimed at.

Abstract: In the assembly of a semiconductor device, improvement in the reliability of flip chip bonding is aimed at. By forming a dummy terminal in the end portion of the row of a plurality of terminals for a flip chip in the package substrate, the flow of flux or solder can be suppressed with the dummy terminal, and a solder layer can be formed on the plurality of terminals for a flip chip. Thereby, the thickness of the solder layer formed on each terminal for a flip chip can fully be secured, without making solder adhere to the wire connection terminal closely formed to the terminal for a flip chip. As a result, improvement in the reliability of flip chip bonding can be aimed at.