Abstract: The present invention provides a white light LED package structure and a white light source system, which includes a substrate, an LED chip, and a wavelength conversion material layer. The peak emission wavelength of the LED chip is between 400 nm and 425 nm; the peak emission wavelength of the wavelength conversion material layer is between 440 nm and 700 nm, and the wavelength conversion material layer absorbs light emitted from the LED chip and emits a white light source; and the emission spectrum of the white light source is set as P(?), the emission spectrum of a blackbody radiation having the same color temperature as the white light source is S(?), P(?max) is the maximum light intensity within 380-780 nm, S(?max) is the maximum light intensity of the blackbody radiation within 380-780 nm, D(?) is a difference between the spectrum of the white light LED and the spectrum of the blackbody radiation, and within 510-610 nm, the white light source satisfies: D(?)=P(?)/P(?max)?S(?)/S(?max), ?0.

Abstract: The present invention provides a linear module, which includes a casing, and a linear transmission device (20). The casing has an internal cavity, in which the linear transmission device (20) is at least partially disposed, and an output opening (31) which extends along a movement direction of the linear transmission device (20) defined on the case. A sealing band (32) is arranged at the output opening (31). The linear module further includes a first rolling mechanism (50) which is moveable in synchronization with the linear transmission device (20) and is arranged on a side of the sealing band (32) which is away from the internal cavity. The first rolling mechanism (50) is in rolling contact with the sealing band (32). This linear module enables high cleanliness and has good sealing performance, high accuracy and high stability.

Abstract: A wafer holder and a wafer transfer apparatus, system and method are disclosed. The wafer holder is mounted onto the wafer transfer apparatus and includes a holder body and a sucker. The holder body defines a first opening, while the sucker includes a first skirt. The first skirt is located on one side of the holder body and connected to the first opening. A groove is formed at a joint between the first skirt and the first opening. The groove is located at an outer side of the first skirt, and is able to relief stresses produced at a base portion of the sucker during deformation of the first skirt.

Abstract: The present invention provides a linear module, which includes a casing, and a linear transmission device (20). The casing has an internal cavity, in which the linear transmission device (20) is at least partially disposed, and an output opening (31) which extends along a movement direction of the linear transmission device (20) defined on the case. A sealing band (32) is arranged at the output opening (31). The linear module further includes a first rolling mechanism (50) which is moveable in synchronization with the linear transmission device (20) and is arranged on a side of the sealing band (32) which is away from the internal cavity. The first rolling mechanism (50) is in rolling contact with the sealing band (32). This linear module enables high cleanliness and has good sealing performance, high accuracy and high stability.

Abstract: A wafer holder and a wafer transfer apparatus, system and method are disclosed. The wafer holder is mounted onto the wafer transfer apparatus and includes a holder body and a sucker. The holder body defines a first opening, while the sucker includes a first skirt. The first skirt is located on one side of the holder body and connected to the first opening. A groove is formed at a joint between the first skirt and the first opening. The groove is located at an outer side of the first skirt, and is able to relief stresses produced at a base portion of the sucker during deformation of the first skirt.