Abstract: A printed circuit board, a method for determining an engagement state between the printed circuit board and a flexible printed circuit, and a display device are provided. The printed circuit board includes a substrate, a connector fixed on the substrate, and configured to be connected with the flexible printed circuit, and a determining circuit connected with the connector. The secondary pin is added to the connector, and can determine together with the determining circuit, added to the substrate, connected with the secondary pin, an engagement state between the first pins of the connector, and the second pins of the flexible printed circuit.

Abstract: The present disclosure provides a display device which includes a liquid crystal display panel and a backlight assembly. The backlight assembly includes a light diffusion component and a light emitting component optically coupled to the light diffusion component. The display device further includes a light guide component configured to direct ambient light to the light diffusion component.

Abstract: The embodiments of the disclosure provide a source drive IC, a display device and a drive method therefor. The source drive IC comprises: a control selection module, a solid color grayscale control module and a non-solid color grayscale control module. The control selection module may be configured to receive a timing control signal inputted by a timing controller, and determine according thereto whether a current drive image is a solid color grayscale image, in response to determining that the current drive image is a solid color grayscale image, send the timing control signal to the solid color grayscale control module, and in response to determining that the current drive image is a non-solid color grayscale image, send the timing control signal to the non-solid color grayscale control module. The non-solid color grayscale control module may, according to the received timing control signal, obtain multiple sets of data voltages.

Abstract: A common voltage compensation unit and compensation method, a driving circuit and a display panel are disclosed. In the common voltage compensation unit provided by the disclosure, the first compensation module may be used for outputting a first common voltage to the common electrode line in the pixel charging period of time, and the second compensation module may be used for outputting a second common voltage to the common electrode line in the pixel non-charging period of time.

Abstract: An array substrate, a driving method thereof and a display device are provided. The array substrate includes a base substrate, a pixel electrode located on the base substrate; a first gate line and a second gate line located on the base substrate at both sides of the pixel electrode, respectively, the pixel electrode being partially overlapped with the first gate line and the second gate line respectively to form a first storage capacitor and a second storage capacitor respectively; and a gate driver connected with the first gate line and the second gate line and configured to sequentially provide a gate signal to the first gate line and the second gate line and perform a waveform chamfering operation to the gate signal.

Abstract: An array substrate, a display panel and a display device are provided. In the array substrate, at least one first thin film transistor and at least one second thin film transistor are arranged in each sub-pixel element to be electrically connected with a pixel electrode, and gates of the plurality of the thin film transistors are connected with different gate lines, that is, the plurality of the thin film transistors in the same sub-pixel element are arranged in parallel, thus the sub-pixel element is charged by inputting a scan signal concurrently to the plurality of gate lines to turn on the plurality of thin film transistors concurrently, and the data line outputs a data voltage to the pixel electrode.

Abstract: The present disclosure provides a display device which includes a liquid crystal display panel and a backlight assembly. The backlight assembly includes a light diffusion component and a light emitting component optically coupled to the light diffusion component. The display device further includes a light guide component configured to direct ambient light to the light diffusion component.

Abstract: A buffering device, a method for manufacturing the buffering device, a backlight module, a display device and a method for manufacturing the display device are provided. The buffering device includes a buffering body and a hollowed-out buffering layer arranged on a surface of the buffering body. The hollowed-out buffering layer includes a plurality of hollowed-out portions and a plurality of non-hollowed-out portions, each of the plurality of hollowed-out portions comprises an adhesive layer having a thickness smaller than a thickness of each of the plurality of non-hollowed-out portions, regions of the surface of the buffering body are configured to arrange the plurality of hollowed-out portions, and the adhesive layer is arranged in the regions.

Abstract: A printed circuit board, a method for determining an engagement state between the printed circuit board and a flexible printed circuit, and a display device are provided. The printed circuit board includes a substrate, a connector fixed on the substrate, and configured to be connected with the flexible printed circuit, and a determining circuit connected with the connector. The secondary pin is added to the connector, and can determine together with the determining circuit, added to the substrate, connected with the secondary pin, an engagement state between the first pins of the connector, and the second pins of the flexible printed circuit.

Abstract: An electronic paper display screen, a method for driving the same, and an electronic paper display device are provided. The electronic paper display screen comprising: a first substrate and a second substrate opposite to each other; a plurality of insulating barrier walls dividing a space between the first substrate and the second substrate into a plurality of closed chambers; a plurality of first transparent electrodes, each of which is disposed on the first substrate and is located at a position corresponding to each of the closed chambers; a plurality of second electrodes, each of which is located in each of the closed chambers and is disposed on a sidewall of the insulating barrier walls; and a plurality of black charged particles which are disposed within each of the closed chambers and move under effect of an electric field.

Abstract: A common voltage compensation unit and compensation method, a driving circuit and a display panel are disclosed. In the common voltage compensation unit provided by the disclosure, the first compensation module may be used for outputting a first common voltage to the common electrode line in the pixel charging period of time, and the second compensation module may be used for outputting a second common voltage to the common electrode line in the pixel non-charging period of time.

Abstract: An array substrate, a driving method thereof and a display device are provided. The array substrate includes a base substrate, a pixel electrode located on the base substrate; a first gate line and a second gate line located on the base substrate at both sides of the pixel electrode, respectively, the pixel electrode being partially overlapped with the first gate line and the second gate line respectively to form a first storage capacitor and a second storage capacitor respectively; and a gate driver connected with the first gate line and the second gate line and configured to sequentially provide a gate signal to the first gate line and the second gate line and perform a waveform chamfering operation to the gate signal.

Abstract: The embodiments of the disclosure provide a source drive IC, a display device and a drive method therefor. The source drive IC comprises: a control selection module, a solid color grayscale control module and a non-solid color grayscale control module. The control selection module may be configured to receive a timing control signal inputted by a timing controller, and determine according thereto whether a current drive image is a solid color grayscale image, in response to determining that the current drive image is a solid color grayscale image, send the timing control signal to the solid color grayscale control module, and in response to determining that the current drive image is a non-solid color grayscale image, send the timing control signal to the non-solid color grayscale control module. The non-solid color grayscale control module may, according to the received timing control signal, obtain multiple sets of data voltages.

Abstract: Embodiments of the present invention disclose a low temperature poly-silicon thin film transistor and a method of fabricating the same, an array substrate, and a display device. The low temperature poly-silicon thin film transistor comprises an active layer, a source and a drain, wherein the active layer comprises a source contact region, a drain contact region, and a channel region located between the source contact region and the drain contact region, the source is provided above and connected to the source contact region, the drain being provided above and connected to the drain contact region, and thicknesses of the source contact region and the drain contact region are both larger than that of the channel region.

Abstract: The invention provides an anisotropic conductive adhesive film and an electronic device. The anisotropic conductive adhesive film comprises a base film and microcapsule structures, wherein the microcapsule structures are set on the base film, and each of the microcapsule structures comprises a metallic conductive particle, a normal-temperature curable macromolecular polymer coated on the outside of the metallic conductive particle and a microcapsule wall coated on the outside of the macromolecular polymer, and an adhesive glue is adhered to the external surface of the microcapsule wall.

Abstract: Embodiments of the present invention disclose a low temperature poly-silicon thin film transistor and a method of fabricating the same, an array substrate, and a display device. The low temperature poly-silicon thin film transistor comprises an active layer, a source and a drain, wherein the active layer comprises a source contact region, a drain contact region, and a channel region located between the source contact region and the drain contact region, the source is provided above and connected to the source contact region, the drain being provided above and connected to the drain contact region, and thicknesses of the source contact region and the drain contact region are both larger than that of the channel region.

Abstract: Provided are an IC chip and a display apparatus. The IC chip (109) comprises several conductive metal sheets spaced from each other on one side of the IC chip, and conductive bumps (111) are formed on the conductive metal sheets. According to the present disclosure, since conductive bumps (111) are arranged on the conductive metal sheet of the IC chip (109), it is possible to use a non-conductive bonding layer such as NCF instead of ACF to bond the IC chip (109) to the display panel, and thus no metal particles would accumulate. As a result, the problem of short circuit or too large resistance will not occur. In addition, it is possible to reduce the production cost of the display apparatus by using NCF instead of ACF, facilitating industrialized manufacturing.

Abstract: The invention provides an anisotropic conductive adhesive film and an electronic device. The anisotropic conductive adhesive film comprises a base film and microcapsule structures, wherein the microcapsule structures are set on the base film, and each of the microcapsule structures comprises a metallic conductive particle, a normal-temperature curable macromolecular polymer coated on the outside of the metallic conductive particle and a microcapsule wall coated on the outside of the macromolecular polymer, and an adhesive glue is adhered to the external surface of the microcapsule wall.