Abstract: A method for making a pressure sensitive adhesive curable composition is performed at a temperature no greater than 35° C. The method includes the steps of 1) mixing starting materials including A) >0 to 40 weight parts of a polyorganosiloxane resin; B) 60 to <100 weight parts of a silanol-terminated polydiorganosiloxane C) >30% to <100% by weight, based on the combined weights of starting materials A, B, and C of an organic solvent, thereby forming a mixture; 2) adding to the mixture a starting material D) an amino-functional alkoxysilane; 3) adding, after step 2), a starting material E) a silyl phosphate compound, thereby preparing a pressure sensitive adhesive composition; and 4) adding to the pressure sensitive adhesive composition, a starting material comprising F) an organic peroxide compound, thereby forming the pressure sensitive adhesive curable composition.

Abstract: A curable organopolysiloxane composition comprising: (A) an organopolysiloxane having at least two alkenyl groups in each molecule; (B) an organohydrogenpolysiloxane in an amount sufficient to provide a value of 1.1:1 to 20:1 (SiH:alkenyl group) for the molar ratio of silicon-bonded hydrogen atoms in the organohydrogenpolysiloxane to the alkenyl groups in component (A), wherein component (B) consists of the following components (B1) and (B2) at a mass ratio of (B1)/(B2) in the range from 100/0 to 15/85: (B1) an organohydrogenpolysiloxane having at least three silicon-bonded hydrogen atoms in each molecule and a silicon-bonded hydrogen content [Si—H] mass % satisfying the following equation: 0<[Si—H] mass %<5/(DP)0.5 wherein the DP is in the range from 5 to 1000; (B2) an organohydrogenpolysiloxane having at least one silicon-bonded hydrogen atom in each molecule, which is different from the component (B1); and (C) a hydrosilation reaction catalyst in a catalytic amount.