Patents by Inventor Junping WAN

Junping WAN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12513377
    Abstract: An electronic device is provided, the electronic device includes a primary device assembly and an extension assembly. The primary device assembly includes a first housing and a primary body circuit, the first housing has a first accommodation cavity, and the primary body circuit is disposed in the first accommodation cavity. The extension assembly includes a second housing and an extension circuit. The second housing has a second accommodation cavity, the extension circuit is disposed in the second accommodation cavity, and the extension circuit is signal-connected to the primary body circuit, to extend or enhance functionality of the primary device assembly.
    Type: Grant
    Filed: March 29, 2023
    Date of Patent: December 30, 2025
    Assignee: HUAWEI TECHNOLOGIES CO., LTD.
    Inventors: Danhua Lv, Kaijun Qian, Muhao Zhang, Junping Wan, Huangchao Zhu
  • Publication number: 20250098122
    Abstract: Embodiments of this application provide a heat dissipation structure, a vehicle-mounted device, and a terminal device, which are used in the field of heat dissipation technologies. The heat dissipation structure includes a heat sink; a circuit board including at least one chip mounting region and at least one first position located outside the chip mounting region; at least one fixed connection structure located in the at least one first position and fastens the circuit board to the heat sink; and at least one elastic connection structure configured to provide an elastic force toward the heat sink for the chip mounting region.
    Type: Application
    Filed: November 27, 2024
    Publication date: March 20, 2025
    Inventors: Peihua CUI, Wangjia CHEN, Junping WAN, Kaimin LI
  • Patent number: 12119629
    Abstract: A junction box and an electronic device assembly system relate to the field of infrastructure technologies. The junction box includes an accommodation chamber configured to accommodate a wire and a sealing cap configured to seal the wire. An upper cover of the accommodation chamber is provided with a first through-hole for wiring, a base of the accommodation chamber is provided with a second through-hole for wiring, and a side wall of the accommodation chamber is provided with one or more operation windows. The upper cover of the accommodation chamber is provided with a first installation position for installing to a pole, and the base of the accommodation chamber is provided with a second installation position for installing to an electronic device. The sealing cap includes a third through-hole for wiring and a fourth through-hole for wiring.
    Type: Grant
    Filed: January 21, 2022
    Date of Patent: October 15, 2024
    Assignee: HUAWEI TECHNOLOGIES CO., LTD.
    Inventor: Junping Wan
  • Publication number: 20230240027
    Abstract: An electronic device is provided, the electronic device includes a primary device assembly and an extension assembly. The primary device assembly includes a first housing and a primary body circuit, the first housing has a first accommodation cavity, and the primary body circuit is disposed in the first accommodation cavity. The extension assembly includes a second housing and an extension circuit. The second housing has a second accommodation cavity, the extension circuit is disposed in the second accommodation cavity, and the extension circuit is signal-connected to the primary body circuit, to extend or enhance functionality of the primary device assembly.
    Type: Application
    Filed: March 29, 2023
    Publication date: July 27, 2023
    Inventors: Danhua LV, Kaijun QIAN, Muhao ZHANG, Junping WAN, Huangchao ZHU
  • Publication number: 20220149606
    Abstract: A junction box and an electronic device assembly system relate to the field of infrastructure technologies. The junction box includes an accommodation chamber (1) configured to accommodate a wire and a sealing cap (2) configured to seal the wire. An upper cover (11) of the accommodation chamber (1) is provided with a first through-hole (111) for wiring, a base (12) of the accommodation chamber (1) is provided with a second through-hole (121) for wiring, and a side wall (13) of the accommodation chamber (1) is provided with one or more operation windows (131). The upper cover (11) of the accommodation chamber (1) is provided with a first installation position for installing to a pole, and the base (12) of the accommodation chamber (1) is provided with a second installation position for installing to an electronic device.
    Type: Application
    Filed: January 21, 2022
    Publication date: May 12, 2022
    Inventor: Junping WAN