Patents by Inventor Junqi Tang

Junqi Tang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240084137
    Abstract: Resin composition, resin adhesive film, and application thereof. The resin composition comprises the following components in parts by weight: 80-120 parts an epoxy resin, 1-20 parts a carbodiimide compound, 30-130 parts a phenolic resin, 20-250 parts a modified polymer, and 50-500 parts silicon dioxide; where the modified polymer is selected from a polyethersulfone or a polyamide-imide resin. By means of selection and compounding of components, the present resin composition has a uniquely advantageous film forming property, effectively solves the problem of a semi-cured resin adhesive film being prone to cracking or fracture, has outstanding heat resistance, a high glass transition temperature, a high modulus, good strength and toughness, and can to form a high strength stable bond with a metal film, has uniquely advantageous reliability, can amply satisfy printed circuit board and chip packaging performance requirements, and is suitable in a variety of chip packaging processes.
    Type: Application
    Filed: March 19, 2021
    Publication date: March 14, 2024
    Inventors: Dongliang LIU, Qing WANG, Junqi TANG, Jinchao DONG
  • Publication number: 20240064910
    Abstract: A laminate coated with asymmetric metal foils, and a printed circuit board including same. The laminate comprises one or at least two stacked low-modulus prepregs, and a metal foil, coated on one side of the one or at least two stacked low-modulus prepregs, or metal foils having different thicknesses coated on two sides of the one or at least two stacked low-modulus prepregs. The modulus of elasticity of the low-modulus prepreg is 22 GPa or less after the low-modulus prepreg is cured. A low-modulus prepreg having a modulus of elasticity of 22 GPa or less after curing is selected as an insulating material for a laminate coated with asymmetric metal foils, such that the resultant laminate and a printed circuit board manufactured therefrom have a relatively low A-state warpage and a warpage which is obtained after reflow soldering processing, thereby ensuring the reliability of the printed circuit board.
    Type: Application
    Filed: January 8, 2021
    Publication date: February 22, 2024
    Inventors: Junqi TANG, Zhiguang LI
  • Publication number: 20220227942
    Abstract: A resin composition, comprising: a modified maleimide resin (A), an active ester resin (B), and an epoxy resin (C); the modified maleimide resin (A) is obtained by means of reacting a maleimide compound (M) having at least two maleimide groups/molecules with an amine compound (N1) having at least one primary amine group/molecule and an amine compound (N2) having at least two primary amine groups/molecules, and the molecular weight distribution is: molecules having a molecular weight between 1000 and 4500 account for 25-60% the total number of molecules.
    Type: Application
    Filed: May 31, 2019
    Publication date: July 21, 2022
    Inventors: Hongjie LI, Junqi TANG
  • Publication number: 20220056260
    Abstract: An epoxy resin composition, and a prepreg, a laminate, and a metal foil-clad laminate manufactured using same. The epoxy resin composition comprises epoxy resin (A), phenolic curing agent (B), high molecular weight resin (C), and an optional inorganic filler (D), the high molecular weight resin (C) having the structure shown in formula (1), formula (2), formula (3), and formula (4), the weight-average molecular weight being between 100,000 and 200,000, and the content of the epoxy resin (A) containing a naphthalene ring skeleton and the phenolic curing agent (B) containing a naphthalene ring skeleton being 0%. The present epoxy resin composition, and the prepreg, the laminate, and the metal foil-clad laminate manufactured using same have good heat resistance, low modulus, and a low coefficient of thermal expansion.
    Type: Application
    Filed: December 29, 2018
    Publication date: February 24, 2022
    Inventors: Junqi TANG, Zhiguang LI
  • Publication number: 20160115313
    Abstract: The present invention relates to a cyanate resin composition, and a prepreg, a laminate, a metal foil clad laminate and a printed circuit board prepared by using same. The cyanate resin composition comprises a cyanate resin (A) and an epoxy resin (B) with a structure of formula (I). The cyanate resin composition of the present invention, and the prepreg, the laminate and the metal foil clad laminate prepared by using the cyanate resin composition have good moisture resistance, heat resistance, flame retardancy and reliability, and are suitable for being used as a substrate material for manufacturing a high-density printed circuit board.
    Type: Application
    Filed: May 30, 2013
    Publication date: April 28, 2016
    Inventors: Junqi TANG, Yongjing XU
  • Publication number: 20160108230
    Abstract: The present invention relates to a cyanate resin composition, and a prepreg, a laminate, a metal foil clad laminate and a printed circuit board prepared by using same. The cyanate resin composition comprises a cyanate resin (A), an epoxy resin (B) with a structure of formula (I) and a maleimide compound (C). The cyanate resin composition of the present invention, and the prepreg, the laminate and the metal foil clad laminate prepared by using the cyanate resin composition have good moisture resistance, heat resistance, flame retardancy and reliability, and are suitable for being used as a substrate material for manufacturing a high-density printed circuit board.
    Type: Application
    Filed: May 30, 2013
    Publication date: April 21, 2016
    Inventors: Junqi TANG, Yongjing XU
  • Publication number: 20120164463
    Abstract: The present invention provides a cyanate ester resin composition, and a prepreg and a laminated made from the cyanate ester resin composition. The cyanate ester resin composition includes a cyanate ester resin containing the structure expressed by the following structure formula (1): wherein, R1, R2 and R3 are hydrogen atom, alkyl or aralkyl; and n is an integer between 1 and 50. The cyanate ester resin composition of the present invention has excellent processability, thermal resistance and humidity resistance, and low water absorption, etc. The prepreg, the laminate, and the metal foil clad laminate made from the cyanate ester resin composition have excellent processability, thermal resistance and humidity resistance, and low water absorption, etc., thereby adapted for making substrate material of high density PCB, and have a very high industrial application value.
    Type: Application
    Filed: December 22, 2011
    Publication date: June 28, 2012
    Applicant: GUANGDONG SHENGYI SCI.TECH CO., LTD
    Inventors: Junqi Tang, Xianping Zeng
  • Publication number: 20120164464
    Abstract: The present invention provides a cyanate ester resin composition, and a prepreg and a laminated made from the cyanate ester resin composition. The cyanate ester resin composition includes a cyanate ester resin containing the structure expressed by the following structure formula (1): wherein, R1, R2 and R3 are hydrogen atom, alkyl or aralkyl; and n is an integer between 1 and 50. The cyanate ester resin composition of the present invention has excellent thermal resistance, low water absorption, and good elastic modulus, etc. The prepreg, the laminate, and the metal foil clad laminate made from the cyanate ester resin composition have excellent thermal resistance, mechanical property and humidity resistance, and low water absorption, etc., thereby adapted for making substrate material of high density PCB, and have a very high industrial application value.
    Type: Application
    Filed: December 22, 2011
    Publication date: June 28, 2012
    Applicant: GUANGDONG SHENGYI SCI.TECH CO., LTD
    Inventors: JUNQI TANG, XIANPING ZENG