Abstract: A movable battery replacing platform includes a travel-driving portion used for driving the movable battery replacing platform to move on the ground; a lifting portion mounted on the travel-driving portion, for lifting a battery during the replacement of the battery; and a battery mounting portion mounted on the top of the lifting portion, for placing a battery to be replaced or a replaced battery. The battery mounting porting is provided with a battery replacing device. The device can use an unlocking device to unlock a battery locked on the bottom of an electric vehicle, automatically aligning an unlocking point of a battery locking mechanism and realizing automatic unlocking in the movement. The angle of an upper board relative to the battery unlocking position can be adjusted by a movement actuating device, so that the unlocking point of the battery can automatically fit where the movable battery replacing platform remains still.

Abstract: Disclosed is an unlocking device, battery replacing platform and movable battery replacing platform. The unlocking device comprises: a guide rail; a movable seat mounted on the guide rail; an unlocking ejector rod vertically mounted on the movable seat; and a driving member to drive the movable seat to move horizontally along a plane of the guide rail, the driving member is a driving push rod; the movable seat mounted on the guide rail includes a fixing cylinder fixed vertically mounted direct on the movable seat, and the unlocking ejector rod is movably mounted inside of the fixing cylinder, and a second spring is provided in the fixing cylinder, the second spring is configured to apply an upward thrust to the unlocking ejector rod. The unlocking ejector rod can be controlled to move on the predetermined rail, and the battery locking mechanism on the electric vehicle can be automatically unlocked.

Abstract: A semiconductor refrigeration chip and a method for manufacturing same are provided. The method includes: providing a semiconductor refrigeration assembly, where the semiconductor refrigeration assembly includes a first insulating and heat-conducting layer and a second insulating and heat-conducting layer provided opposite to each other and a semiconductor layer arranged between the first insulating and heat-conducting layer and the second insulating and heat-conducting layer, a side of the semiconductor refrigeration assembly provided with the first insulating and heat-conducting layer is a cold end, and a side of the semiconductor refrigeration assembly provided with the second insulating and heat-conducting layer is a hot end; and forming a packaging structure, and causing the packaging structure to cover a side wall of the semiconductor refrigeration assembly and define a first groove with the first insulating and heat-conducting layer, to obtain the semiconductor refrigeration chip.