Patents by Inventor Junqing Huang
Junqing Huang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11783470Abstract: With the disclosed systems and methods for DRAM and 3D NAND inspection, an image of the wafer is received based on the output for an inspection tool. Geometric measurements of a design of a plurality of memory devices on the wafer are received. A care area with higher inspection sensitivity is determined based on the geometric measurements.Type: GrantFiled: April 18, 2022Date of Patent: October 10, 2023Assignee: KLA CORPORATIONInventors: Junqing Huang, Hucheng Lee, Sangbong Park, Xiaochun Li
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Publication number: 20220245791Abstract: With the disclosed systems and methods for DRAM and 3D NAND inspection, an image of the wafer is received based on the output for an inspection tool. Geometric measurements of a design of a plurality of memory devices on the wafer are received. A care area with higher inspection sensitivity is determined based on the geometric measurements.Type: ApplicationFiled: April 18, 2022Publication date: August 4, 2022Inventors: Junqing Huang, Hucheng Lee, Sangbong Park, Xiaochun Li
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Publication number: 20220125058Abstract: The present invention provides an application of Atractylodes lanceolata essential oil, which is used for the prevention and treatment of Pseudopestalotiopsis camelliae sinensis. The Atractylodes lanceolata essential oil of the present invention has a good inhibitory effect on Pseudopestalotiopsis camelliae sinensis, and can be developed and used as a new type of plant-derived fungicide.Type: ApplicationFiled: September 8, 2021Publication date: April 28, 2022Inventors: Yingjuan CHEN, Yuhe WAN, Huarong TONG, Junqing HUANG, Zheng ZHANG
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Patent number: 11308606Abstract: With the disclosed systems and methods for DRAM and 3D NAND inspection, an image of the wafer is received based on the output for an inspection tool. Geometric measurements of a design of a plurality of memory devices on the wafer are received. A care area with higher inspection sensitivity is determined based on the geometric measurements.Type: GrantFiled: August 16, 2019Date of Patent: April 19, 2022Assignee: KLA CORPORATIONInventors: Junqing Huang, Hucheng Lee, Sangbong Park, Xiaochun Li
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Patent number: 11270430Abstract: Systems and methods increase the signal to noise ratio of optical inspection of wafers to obtain higher inspection sensitivity. The computed reference image can minimize a norm of the difference of the test image and the computed reference image. A difference image between the test image and a computed reference image is determined. The computed reference image includes a linear combination of a second set of images.Type: GrantFiled: May 4, 2018Date of Patent: March 8, 2022Assignee: KLA-TENCOR CORPORATIONInventors: Abdurrahman Sezginer, Xiaochun Li, Pavan Kumar, Junqing Huang, Lisheng Gao, Grace H. Chen, Yalin Xiong, Hawren Fang
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Publication number: 20210049755Abstract: With the disclosed systems and methods for DRAM and 3D NAND inspection, an image of the wafer is received based on the output for an inspection tool. Geometric measurements of a design of a plurality of memory devices on the wafer are received. A care area with higher inspection sensitivity is determined based on the geometric measurements.Type: ApplicationFiled: August 16, 2019Publication date: February 18, 2021Inventors: Junqing Huang, Hucheng Lee, Sangbong Park, Xiaochun Li
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Patent number: 10923317Abstract: Methods and systems for detecting defects in a logic region on a wafer are provided. One method includes acquiring information for different types of design-based care areas in a logic region of a wafer. The method also includes designating the different types of the design-based care areas as different types of sub-regions and, for a localized area within the logic region, assigning two or more instances of the sub-regions located in the localized area to a super-region. In addition, the method includes generating one scatter plot for all of the two or more instances of the sub-regions assigned to the super-region. The one scatter plot is generated with different segmentation values for the output corresponding to the different types of the sub-regions. The method further includes detecting defects in the sub-regions based on the one scatter plot.Type: GrantFiled: August 18, 2019Date of Patent: February 16, 2021Assignee: KLA Corp.Inventors: Junqing Huang, Paul Russell, Hucheng Lee, Kenong Wu
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Patent number: 10600177Abstract: Methods and systems are disclosed that provide nuisance reduction in images, such as semiconductor images that include one or more metal lines. A potential defect is correlated against pixel grey level intensity charts for two perpendicular axes. A position of the potential defect relative to a pattern, such as a metal line, is determined along the two axes. The potential defect can be classified as a defect of interest or nuisance event.Type: GrantFiled: December 29, 2017Date of Patent: March 24, 2020Assignee: KLA-Tencor CorporationInventors: Bjorn Brauer, Junqing Huang, Lisheng Gao
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Patent number: 10599944Abstract: The disclosure is directed to providing visual feedback for inspection algorithms and difference filters used to process test and reference images from an inspection system. A user interface may be configured for displaying information and accepting user commands. A computing system communicatively coupled to the user interface may be configured to receive at least one set of test and reference images collected by the inspection system. The computing system may be further configured to provide at least one visual representation of the test and reference images via the user interface to show effects of an inspection algorithm and/or difference filter.Type: GrantFiled: November 27, 2012Date of Patent: March 24, 2020Assignee: KLA-Tencor CorporationInventors: Hucheng Lee, Junqing Huang, Lisheng Gao
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Publication number: 20200090904Abstract: Methods and systems for detecting defects in a logic region on a wafer are provided. One method includes acquiring information for different types of design-based care areas in a logic region of a wafer. The method also includes designating the different types of the design-based care areas as different types of sub-regions and, for a localized area within the logic region, assigning two or more instances of the sub-regions located in the localized area to a super-region. In addition, the method includes generating one scatter plot for all of the two or more instances of the sub-regions assigned to the super-region. The one scatter plot is generated with different segmentation values for the output corresponding to the different types of the sub-regions. The method further includes detecting defects in the sub-regions based on the one scatter plot.Type: ApplicationFiled: August 18, 2019Publication date: March 19, 2020Inventors: Junqing Huang, Paul Russell, Hucheng Lee, Kenong Wu
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Patent number: 10395359Abstract: Methods and systems for detecting defects on a wafer using adaptive local thresholding and color filtering are provided. One method includes determining local statistics of pixels in output for a wafer generated using an inspection system, determining which of the pixels are outliers based on the local statistics, and comparing the outliers to the pixels surrounding the outliers to identify the outliers that do not belong to a cluster of outliers as defect candidates. The method also includes determining a value for a difference in color between the pixels of the defect candidates and the pixels surrounding the defect candidates. The method further includes identifying the defect candidates that have a value for the difference in color greater than or equal to a predetermined value as nuisance defects and the defect candidates that have a value for the difference in color less than the predetermined value as real defects.Type: GrantFiled: June 15, 2017Date of Patent: August 27, 2019Assignee: KLA-Tencor Corp.Inventors: Junqing Huang, Hucheng Lee, Kenong Wu, Lisheng Gao
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Patent number: 10339262Abstract: A method includes identifying a first set of a first care area with a first sensitivity threshold, the first care area associated with a first design of interest within a block of repeating cells in design data; identifying an additional set of an additional care area with an additional sensitivity threshold, the additional care area associated with an additional design of interest within the block of repeating cells in design data; identifying one or more defects within the first set of the first care areas in one or more images of a selected region of a sample based on the first sensitivity threshold; and identifying one or more defects within the additional set of the additional care areas in the one or more images of the selected region of the sample based on the additional sensitivity threshold.Type: GrantFiled: November 15, 2016Date of Patent: July 2, 2019Assignee: KLA-Tencor CorporationInventors: Junqing Huang, Soren Konecky, Hucheng Lee, Kenong Wu, Lisheng Gao
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Publication number: 20190050974Abstract: Methods and systems are disclosed that provide nuisance reduction in images, such as semiconductor images that include one or more metal lines. A potential defect is correlated against pixel grey level intensity charts for two perpendicular axes. A position of the potential defect relative to a pattern, such as a metal line, is determined along the two axes. The potential defect can be classified as a defect of interest or nuisance event.Type: ApplicationFiled: December 29, 2017Publication date: February 14, 2019Inventors: Bjorn Brauer, Junqing Huang, Lisheng Gao
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Publication number: 20180342051Abstract: Systems and methods increase the signal to noise ratio of optical inspection of wafers to obtain higher inspection sensitivity. The computed reference image can minimize a norm of the difference of the test image and the computed reference image. A difference image between the test image and a computed reference image is determined. The computed reference image includes a linear combination of a second set of images.Type: ApplicationFiled: May 4, 2018Publication date: November 29, 2018Inventors: Abdurrahman Sezginer, Xiaochun Li, Pavan Kumar, Junqing Huang, Lisheng Gao, Grace H. Chen, Yalin Xiong, Hawren Fang
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Publication number: 20170286589Abstract: A method includes identifying a first set of a first care area with a first sensitivity threshold, the first care area associated with a first design of interest within a block of repeating cells in design data; identifying an additional set of an additional care area with an additional sensitivity threshold, the additional care area associated with an additional design of interest within the block of repeating cells in design data; identifying one or more defects within the first set of the first care areas in one or more images of a selected region of a sample based on the first sensitivity threshold; and identifying one or more defects within the additional set of the additional care areas in the one or more images of the selected region of the sample based on the additional sensitivity threshold.Type: ApplicationFiled: November 15, 2016Publication date: October 5, 2017Inventors: Junqing Huang, Soren Konecky, Hucheng Lee, Kenong Wu, Lisheng Gao
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Publication number: 20170287128Abstract: Methods and systems for detecting defects on a wafer using adaptive local thresholding and color filtering are provided. One method includes determining local statistics of pixels in output for a wafer generated using an inspection system, determining which of the pixels are outliers based on the local statistics, and comparing the outliers to the pixels surrounding the outliers to identify the outliers that do not belong to a cluster of outliers as defect candidates, The method also includes determining a value for a difference in color between the pixels of the defect candidates and the pixels surrounding the defect candidates.Type: ApplicationFiled: June 15, 2017Publication date: October 5, 2017Inventors: Junqing Huang, Hucheng Lee, Kenong Wu, Lisheng Gao
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Patent number: 9704234Abstract: Methods and systems for detecting defects on a wafer using adaptive local thresholding and color filtering are provided. One method includes determining local statistics of pixels in output for a wafer generated using an inspection system, determining which of the pixels are outliers based on the local statistics, and comparing the outliers to the pixels surrounding the outliers to identify the outliers that do not belong to a cluster of outliers as defect candidates. The method also includes determining a value for a difference in color between the pixels of the defect candidates and the pixels surrounding the defect candidates. The method further includes identifying the defect candidates that have a value for the difference in color greater than or equal to a predetermined value as nuisance defects and the defect candidates that have a value for the difference in color less than the predetermined value as real defects.Type: GrantFiled: August 1, 2014Date of Patent: July 11, 2017Assignee: KLA-Tencor Corp.Inventors: Junqing Huang, Hucheng Lee, Kenong Wu, Lisheng Gao
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Patent number: 9619876Abstract: Methods and systems for detecting defects on a wafer are provided. One method includes determining difference values for pixels in first output for a wafer generated using a first optics mode of an inspection system and determining other values for pixels in second output for the wafer generated using a second optics mode of the inspection system. The first and second optics modes are different from each other. The method also includes generating a two-dimensional scatter plot of the difference values and the other values for the pixels in the first and second output corresponding to substantially the same locations on the wafer. The method further includes detecting defects on the wafer based on the two-dimensional scatter plot.Type: GrantFiled: March 12, 2013Date of Patent: April 11, 2017Assignee: KLA-Tencor Corp.Inventors: Junqing Huang, Lisheng Gao
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Patent number: 9442077Abstract: Methods and systems for filtering scratches from wafer inspection results are provided. One method includes generating a defect candidate map that includes image data for potential defect candidates as a function of position on the wafer and removing noise from the defect candidate map to generate a filtered defect candidate map. The method also includes determining one or more characteristics of the potential defect candidates based on portions of the filtered defect candidate map corresponding to the potential defect candidates. In addition, the method includes determining if each of the potential defect candidates are scratches based on the one or more characteristics determined for each of the potential defect candidates and separating the potential defect candidates determined to be the scratches from other defects in inspection results for the wafer.Type: GrantFiled: August 25, 2014Date of Patent: September 13, 2016Assignee: KLA-Tencor Corp.Inventors: Junqing Huang, Huan Jin, Grace Hsiu-Ling Chen, Lisheng Gao
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Patent number: 9224660Abstract: Systems and methods for determining one or more parameters of a wafer inspection process are provided. One method includes aligning optical image(s) of an alignment target to their corresponding electron beam images generated by an electron beam defect review system. The method also includes determining different local coordinate transformations for different subsets of alignment targets based on results of the aligning. In addition, the method includes determining positions of defects in wafer inspection system coordinates based on coordinates of the defects determined by the electron beam defect review system and the different local coordinate transformations corresponding to different groups of the defects into which the defects have been separated. The method further includes determining one or more parameters for an inspection process for the wafer based on defect images acquired at the determined positions by a wafer inspection system.Type: GrantFiled: August 27, 2014Date of Patent: December 29, 2015Assignee: KLA-Tencor Corp.Inventors: Ashok V. Kulkarni, Lisheng Gao, Junqing Huang