Patents by Inventor Junqing (Jenny) Huang
Junqing (Jenny) Huang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10605744Abstract: Systems and methods for detecting defects on a wafer are provided. One method includes generating output for a wafer by scanning the wafer with an inspection system using first and second optical states of the inspection system. The first and second optical states are defined by different values for at least one optical parameter of the inspection system. The method also includes generating first image data for the wafer using the output generated using the first optical state and second image data for the wafer using the output generated using the second optical state. In addition, the method includes combining the first image data and the second image data corresponding to substantially the same locations on the wafer thereby creating additional image data for the wafer. The method further includes detecting defects on the wafer using the additional image data.Type: GrantFiled: January 8, 2018Date of Patent: March 31, 2020Assignee: KLA-Tencor Corp.Inventors: Lu Chen, Jason Kirkwood, Mohan Mahadevan, James A. Smith, Lisheng Gao, Junqing (Jenny) Huang, Tao Luo, Richard Wallingford
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Publication number: 20180202943Abstract: Systems and methods for detecting defects on a wafer are provided. One method includes generating output for a wafer by scanning the wafer with an inspection system using first and second optical states of the inspection system. The first and second optical states are defined by different values for at least one optical parameter of the inspection system. The method also includes generating first image data for the wafer using the output generated using the first optical state and second image data for the wafer using the output generated using the second optical state. In addition, the method includes combining the first image data and the second image data corresponding to substantially the same locations on the wafer thereby creating additional image data for the wafer. The method further includes detecting defects on the wafer using the additional image data.Type: ApplicationFiled: January 8, 2018Publication date: July 19, 2018Inventors: Lu Chen, Jason Kirkwood, Mohan Mahadevan, James A. Smith, Lisheng Gao, Junqing (Jenny) Huang, Tao Luo, Richard Wallingford
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Patent number: 9880107Abstract: Systems and methods for detecting defects on a wafer are provided. One method includes generating output for a wafer by scanning the wafer with an inspection system using first and second optical states of the inspection system. The first and second optical states are defined by different values for at least one optical parameter of the inspection system. The method also includes generating first image data for the wafer using the output generated using the first optical state and second image data for the wafer using the output generated using the second optical state. In addition, the method includes combining the first image data and the second image data corresponding to substantially the same locations on the wafer thereby creating additional image data for the wafer. The method further includes detecting defects on the wafer using the additional image data.Type: GrantFiled: May 22, 2013Date of Patent: January 30, 2018Assignee: KLA-Tencor Corp.Inventors: Lu Chen, Jason Kirkwood, Mohan Mahadevan, James A. Smith, Lisheng Gao, Junqing (Jenny) Huang, Tao Luo, Richard Wallingford
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Publication number: 20130250287Abstract: Systems and methods for detecting defects on a wafer are provided. One method includes generating output for a wafer by scanning the wafer with an inspection system using first and second optical states of the inspection system. The first and second optical states are defined by different values for at least one optical parameter of the inspection system. The method also includes generating first image data for the wafer using the output generated using the first optical state and second image data for the wafer using the output generated using the second optical state. In addition, the method includes combining the first image data and the second image data corresponding to substantially the same locations on the wafer thereby creating additional image data for the wafer. The method further includes detecting defects on the wafer using the additional image data.Type: ApplicationFiled: May 22, 2013Publication date: September 26, 2013Applicant: KLA-Tencor CorporationInventors: Lu Chen, Jason Kirkwood, Mohan Mahadevan, James A. Smith, Lisheng Gao, Junqing (Jenny) Huang, Tao Luo, Richard Wallingford
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Patent number: 8467047Abstract: Systems and methods for detecting defects on a wafer are provided. One method includes generating output for a wafer by scanning the wafer with an inspection system using first and second optical states of the inspection system. The first and second optical states are defined by different values for at least one optical parameter of the inspection system. The method also includes generating first image data for the wafer using the output generated using the first optical state and second image data for the wafer using the output generated using the second optical state. In addition, the method includes combining the first image data and the second image data corresponding to substantially the same locations on the wafer thereby creating additional image data for the wafer. The method further includes detecting defects on the wafer using the additional image data.Type: GrantFiled: July 3, 2012Date of Patent: June 18, 2013Assignee: KLA-Tencor Corp.Inventors: Lu Chen, Jason Kirkwood, Mohan Mahadevan, James A. Smith, Lisheng Gao, Junqing (Jenny) Huang, Tao Luo, Richard Wallingford
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Publication number: 20120268735Abstract: Systems and methods for detecting defects on a wafer are provided. One method includes generating output for a wafer by scanning the wafer with an inspection system using first and second optical states of the inspection system. The first and second optical states are defined by different values for at least one optical parameter of the inspection system. The method also includes generating first image data for the wafer using the output generated using the first optical state and second image data for the wafer using the output generated using the second optical state. In addition, the method includes combining the first image data and the second image data corresponding to substantially the same locations on the wafer thereby creating additional image data for the wafer. The method further includes detecting defects on the wafer using the additional image data.Type: ApplicationFiled: July 3, 2012Publication date: October 25, 2012Applicant: KLA-TENCOR CORPORATIONInventors: Lu Chen, Jason Kirkwood, Mohan Mahadevan, James A. Smith, Lisheng Gao, Junqing (Jenny) Huang, Tao Luo, Richard Wallingford
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Patent number: 8223327Abstract: Systems and methods for detecting defects on a wafer are provided. One method includes generating output for a wafer by scanning the wafer with an inspection system using first and second optical states of the inspection system. The first and second optical states are defined by different values for at least one optical parameter of the inspection system. The method also includes generating first image data for the wafer using the output generated using the first optical state and second image data for the wafer using the output generated using the second optical state. In addition, the method includes combining the first image data and the second image data corresponding to substantially the same locations on the wafer thereby creating additional image data for the wafer. The method further includes detecting defects on the wafer using the additional image data.Type: GrantFiled: January 26, 2009Date of Patent: July 17, 2012Assignee: KLA-Tencor Corp.Inventors: Lu Chen, Jason Kirkwood, Mohan Mahadevan, James A. Smith, Lisheng Gao, Junqing (Jenny) Huang, Tao Luo, Richard Wallingford
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Publication number: 20100188657Abstract: Systems and methods for detecting defects on a wafer are provided. One method includes generating output for a wafer by scanning the wafer with an inspection system using first and second optical states of the inspection system. The first and second optical states are defined by different values for at least one optical parameter of the inspection system. The method also includes generating first image data for the wafer using the output generated using the first optical state and second image data for the wafer using the output generated using the second optical state. In addition, the method includes combining the first image data and the second image data corresponding to substantially the same locations on the wafer thereby creating additional image data for the wafer. The method further includes detecting defects on the wafer using the additional image data.Type: ApplicationFiled: January 26, 2009Publication date: July 29, 2010Applicant: KLA-TENCOR CORPORATIONInventors: Lu Chen, Jason Kirkwood, Mohan Mahadevan, James A. Smith, Lisheng Gao, Junqing (Jenny) Huang, Tao Luo, Richard Wallingford