Patents by Inventor Junqun ZHANG

Junqun ZHANG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Nozzle for connecting or disconnecting solder joints between head bonding pads in a hard disk drive, and laser soldering or reflowing tool with the same
    Patent number: 10040140
    Abstract: A nozzle for connecting or disconnecting solder joints between head bonding pads of in a hard disk drive, includes a nozzle body including a tip, the tip disposed at a distal end of the nozzle body and configured to deliver or reflow a solder ball in proximity to head bonding pads; and a central duct disposed along a central axis of the nozzle body and configured to convey the solder ball to or from the tip. The tip includes a front face facing to a trailing edge of a slider, a back face facing to a top surface of a suspension supporting the slider, and two side faces adjacent to the front face and back face respectively, and at least one interference-free structure is provided at two adjacent faces of the tip at least, thereby no interference happens between the tip and elements adjacent to the slider during the operation.
    Type: Grant
    Filed: December 29, 2014
    Date of Patent: August 7, 2018
    Assignee: SAE MAGNETICS (H.K.) LTD.
    Inventors: Chiwai Lo, Shenkuang Chou, Yiusing Ho, Kayip Wong, Xiangyuan Tan, Junqun Zhang
  • NOZZLE FOR CONNECTING OR DISCONNECTING SOLDER JOINTS BETWEEN HEAD BONDING PADS IN A HARD DISK DRIVE, AND LASER SOLDERING OR REFLOWING TOOL WITH THE SAME
    Publication number: 20160184915
    Abstract: A nozzle for connecting or disconnecting solder joints between head bonding pads of in a hard disk drive, includes a nozzle body including a tip, the tip disposed at a distal end of the nozzle body and configured to deliver or reflow a solder ball in proximity to head bonding pads; and a central duct disposed along a central axis of the nozzle body and configured to convey the solder ball to or from the tip. The tip includes a front face facing to a trailing edge of a slider, a back face facing to a top surface of a suspension supporting the slider, and two side faces adjacent to the front face and back face respectively, and at least one interference-free structure is provided at two adjacent faces of the tip at least, thereby no interference happens between the tip and elements adjacent to the slider during the operation.
    Type: Application
    Filed: December 29, 2014
    Publication date: June 30, 2016
    Inventors: Chiwai LO, Shenkuang CHOU, Yiusing HO, Kayip WONG, Xiangyuan TAN, Junqun ZHANG