Patents by Inventor Junro LEE

Junro LEE has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250390655
    Abstract: In a method of verifying a semiconductor device, input data defining the semiconductor device including a plurality of blocks is received. A first simulation environment is generated for a top module and at least one target block of the plurality of blocks in the top module. The first simulation environment includes power wiring information and additional power-related information. The top module represents an entire structure of the semiconductor device. A second simulation environment is generated for non-target blocks of the plurality of blocks other than the at least one target block. The second simulation environment is different from the first simulation environment. A verification operation is performed on the semiconductor device based on a hybrid simulation environment in which the first simulation environment and the second simulation environment are combined.
    Type: Application
    Filed: August 20, 2025
    Publication date: December 25, 2025
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventor: Junro Lee
  • Patent number: 12417330
    Abstract: In a method of verifying a semiconductor device, input data defining the semiconductor device including a plurality of blocks is received. A first simulation environment is generated for a top module and at least one target block of the plurality of blocks in the top module. The first simulation environment includes power wiring information and additional power-related information. The top module represents an entire structure of the semiconductor device. A second simulation environment is generated for non-target blocks of the plurality of blocks other than the at least one target block. The second simulation environment is different from the first simulation environment. A verification operation is performed on the semiconductor device based on a hybrid simulation environment in which the first simulation environment and the second simulation environment are combined.
    Type: Grant
    Filed: June 28, 2022
    Date of Patent: September 16, 2025
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventor: Junro Lee
  • Publication number: 20230106989
    Abstract: In a method of verifying a semiconductor device, input data defining the semiconductor device including a plurality of blocks is received. A first simulation environment is generated for a top module and at least one target block of the plurality of blocks in the top module. The first simulation environment includes power wiring information and additional power-related information. The top module represents an entire structure of the semiconductor device. A second simulation environment is generated for non-target blocks of the plurality of blocks other than the at least one target block. The second simulation environment is different from the first simulation environment. A verification operation is performed on the semiconductor device based on a hybrid simulation environment in which the first simulation environment and the second simulation environment are combined.
    Type: Application
    Filed: June 28, 2022
    Publication date: April 6, 2023
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventor: Junro LEE