Abstract: Embodiments are provided herein for testing multichip module (MCM) thermal reliability. An embodiment method includes selecting a chip with higher thermal risk from a plurality of chips in the MCM, and measuring a plurality of predetermined temperature parameters associated with the selected chip. A thermal resistance is then calculated using the predetermined temperature parameters. The thermal resistance is used to determine a thermal performance of the MCM. The predetermined temperature parameters include a junction temperature of the selected chip and at least one of a case temperature above the selected chip, a board temperature below the selected chip, and an ambient air temperature.

Abstract: The present invention discloses an electronic device enclosure and an electronic device. The electronic device enclosure includes: a housing enclosing an exterior of an electronic component; and a baffle plate which is away from the housing by a preset distance and is disposed on an inner side of the housing, where at least one opening is disposed on each of the housing and the baffle plate, where positions of the opening of the baffle plate and the opening of the housing are mutually staggered in a perpendicular direction, and the opening of the housing faces a non-opening area of the baffle plate in the perpendicular direction.

Abstract: An apparatus for preventing deformation of a communication card includes a card holder configured to install a communication card; a temperature control component that is located on one side of the card holder and connected to a power supply configured to perform cooling or heating; a temperature sensor configured to collect temperature of the card holder; and the power supply configured to generate a supply current according to the temperature collected by the temperature sensor to supply power to the temperature control component, so that the temperature control component performs cooling or heating to maintain the temperature of the card holder within a preset temperature range, and the communication card is not deformed when the communication card is in the card holder and within the preset temperature range.

Abstract: A chip heat dissipation structure disposed on a printed circuit board (PCB), where the chip heat dissipation structure includes a chip card holder and at least one isolation groove; the chip card holder and the PCB are molded into one body; and the at least one isolation groove is disposed on the PCB and located around the chip card holder, and the at least one isolation groove is configured to isolate an area in which the chip card holder is located from another area on the PCB. The chip heat dissipation structure may be part of a terminal device.

Abstract: The present invention discloses an electronic device enclosure and an electronic device. The electronic device enclosure includes: a housing enclosing an exterior of an electronic component; and a baffle plate which is away from the housing by a preset distance and is disposed on an inner side of the housing, where at least one opening is disposed on each of the housing and the baffle plate, where positions of the opening of the baffle plate and the opening of the housing are mutually staggered in a perpendicular direction, and the opening of the housing faces a non-opening area of the baffle plate in the perpendicular direction.

Abstract: An apparatus for preventing deformation of a communication card includes a card holder configured to install a communication card; a temperature control component that is located on one side of the card holder and connected to a power supply configured to perform cooling or heating; a temperature sensor configured to collect temperature of the card holder; and the power supply configured to generate a supply current according to the temperature collected by the temperature sensor to supply power to the temperature control component, so that the temperature control component performs cooling or heating to maintain the temperature of the card holder within a preset temperature range, and the communication card is not deformed when the communication card is in the card holder and within the preset temperature range.

Abstract: Embodiments are provided herein for testing multichip module (MCM) thermal reliability. An embodiment method includes selecting a chip with higher thermal risk from a plurality of chips in the MCM, and measuring a plurality of predetermined temperature parameters associated with the selected chip. A thermal resistance is then calculated using the predetermined temperature parameters. The thermal resistance is used to determine a thermal performance of the MCM. The predetermined temperature parameters include a junction temperature of the selected chip and at least one of a case temperature above the selected chip, a board temperature below the selected chip, and an ambient air temperature.