Abstract: This acidic electrolytic copper plating solution contains a soluble copper salt, an azole compound which has 2 or 3 nitrogen atoms in a five-membered ring and serves as a copper ion electrodeposition inhibitor, an acid, and water, in which a copper concentration is 0.1 mol/L or more, an azole compound concentration is 10 mmol/L or more and 50 mmol/L or less, and a chloride ion concentration is 10 ppm or less.

Abstract: This bonding sheet (10, 20) with a preform layer (13) is a bonding sheet (10, 20) for bonding a substrate (16) and an electronic component (17), the bonding sheet (10, 20) includes a copper sheet (11) and a porous preform layer (13) including copper particles (12) provided on one surface or both surfaces of the copper sheet (11), in which surfaces of the copper particles (12) are coated with copper nanoparticles (12a) having an average particle diameter smaller than an average particle diameter of the copper particles (12), the average particle diameter of the copper nanoparticles (12a) calculated from a BET value is 9.59 nm or more and 850 nm or less, and an average porosity of the preform layer (13) is 11% or more and 78% or less.

Abstract: A method of producing a shaped product for a thermoelectric conversion element is provided. The method comprises: mixing a coarse mixture that contains metal nanoparticle-supporting carbon nanotubes, a resin component, and a solvent by dispersion treatment that brings about a cavitation effect or a crushing effect, to obtain a composition for a thermoelectric conversion element; and removing the solvent from the composition for a thermoelectric conversion element.

Abstract: A composition for a thermoelectric conversion element that enables a thermoelectric conversion element to fully exhibit excellent thermoelectric conversion characteristics is provided. A composition for a thermoelectric conversion element comprises: metal nanoparticle-supporting carbon nanotubes, a resin component; and a solvent.