Patents by Inventor Juntae Hwang

Juntae Hwang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Interconnection device for a printed circuit board, a method of manufacturing the same, and an interconnection assembly having the same
    Patent number: 7503811
    Abstract: The present invention relates to a method of manufacturing an interconnect device for a printed circuit board.
    Type: Grant
    Filed: November 1, 2007
    Date of Patent: March 17, 2009
    Assignees: Phicom Corporation
    Inventors: Dongweon Seo, Juntae Hwang
  • Interconnection device for a printed circuit board, a method of manufacturing the same, and an interconnection assembly having the same
    Patent number: 7452248
    Abstract: An interconnect assembly including a contact, a first guide film, a space transformer, a second guide film, and an interconnect device including a second contact section having an O-ring-like shape to be inserted into the contact hole by an interference fit, a support section having an engaging protrusion in a predetermined portion and connected to the second contact section in an integrated manner to be inserted into the inside of the first guide opening, a connecting section having an O-ring-like shape of which one side is opened and connected to the support section in an integrated manner thereby being placed between the first guide film and the second guide film, and a first contact section connected to the connecting section in an integrated manner for making contact with the second contact section through the second guide opening.
    Type: Grant
    Filed: November 1, 2007
    Date of Patent: November 18, 2008
    Assignees: Phicom Corporation
    Inventors: Dongweon Seo, Juntae Hwang
  • INTERCONNECTION DEVICE FOR A PRINTED CIRCUIT BOARD, A METHOD OF MANUFACTURING THE SAME, AND AN INTERCONNECTION ASSEMBLY HAVING THE SAME
    Publication number: 20080070438
    Abstract: The present invention relates to a method of manufacturing an interconnect device for a printed circuit board.
    Type: Application
    Filed: November 1, 2007
    Publication date: March 20, 2008
    Inventors: Dongweon Seo, Juntae Hwang
  • INTERCONNECTION DEVICE FOR A PRINTED CIRCUIT BOARD, A METHOD OF MANUFACTURING THE SAME, AND AN INTERCONNECTION ASSEMBLY HAVING THE SAME
    Publication number: 20080057745
    Abstract: The present invention relates to an interconnect device for a printed circuit board, a method of manufacturing the same and an interconnect assembly having the same.
    Type: Application
    Filed: November 1, 2007
    Publication date: March 6, 2008
    Inventors: Dongweon Seo, Juntae Hwang
  • Interconnection device for a printed circuit board, a method of manufacturing the same, and an interconnection assembly having the same
    Patent number: 7306493
    Abstract: The present invention relates to an interconnect device for a printed circuit board, a method of manufacturing the same and an inter-connect assembly having the same. According to one aspect of the present invention, the interconnect device for a printed circuit board comprises: a first contact section 10 having a bar-like shape for making contact with a second contact terminal 76 in a space transformer 52; a connecting section 12 having an O-ring-like shape of which one side is opened and connected to one end of the first contact section 10 in an integrated manner; a support section 14 having an engaging protrusion 14a in a predetermined portion and connected to one end of the connecting section 12 in an integrated manner; and a second contact section 16 having an O-ring-like shape and connected to one end of the support section 14, wherein the whole inter-connect device is made up of an identical resilient material.
    Type: Grant
    Filed: July 16, 2003
    Date of Patent: December 11, 2007
    Assignees: Phicom Corporation
    Inventors: Dongweon Seo, Juntae Hwang
  • Interconnection device for a printed circuit board, a method of manufacturing the same, and an interconnection assembly having the same
    Publication number: 20060166479
    Abstract: The present invention relates to an interconnect device for a printed circuit board, a method of manufacturing the same and an inter-connect assembly having the same. According to one aspect of the present invention, the interconnect device for a printed circuit board comprises: a first contact section 10 having a bar-like shape for making contact with a second contact terminal 76 in a space transformer 52; a connecting section 12 having an O-ring-like shape of which one side is opened and connected to one end of the first contact section 10 in an integrated manner; a support section 14 having an engaging protrusion 14a in a predetermined portion and connected to one end of the connecting section 12 in an integrated manner; and a second contact section 16 having an O-ring-like shape and connected to one end of the support section 14, wherein the whole inter-connect device is made up of an identical resilient material.
    Type: Application
    Filed: July 16, 2003
    Publication date: July 27, 2006
    Inventors: Dongweon Seo, Juntae Hwang