Patents by Inventor Juntaro Mikami

Juntaro Mikami has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of manufacturing a lead frame with a nickel coating
    Patent number: 8114713
    Abstract: A lead frame includes a base material having a front surface for mounting of a semiconductor chip and a back surface for connection with an external board, and an Ni layer having a thick section and thin section. The thick section is formed on the back surface of the base material, whereas the thin section is formed on all or a part of the front surface of the base material. It is preferable that the thick section has a thickness ranging from 2.5 to 5 ?m, and the thin section is 0.5-2 ?m thinner than the thick section. The lead frame can be manufactured with improved productivity by forming an Ni layer on both front and back surfaces of the base material, and then etching only the Ni layer formed on the front surface of the base material.
    Type: Grant
    Filed: December 20, 2010
    Date of Patent: February 14, 2012
    Assignee: Sumitomo Metal Mining Co., Ltd.
    Inventor: Juntaro Mikami
  • Lead frame and method of manufacturing the same
    Patent number: 7944030
    Abstract: A lead frame includes a base material having a front surface for mounting of a semiconductor chip and a back surface for connection with an external board, and an Ni layer having a thick section and thin section. The thick section is formed on the back surface of the base material, whereas the thin section is formed on all or a part of the front surface of the base material. It is preferable that the thick section has a thickness ranging from 2.5 to 5 ?m, and the thin section is 0.5-2 ?m thinner than the thick section. The lead frame can be manufactured with improved productivity by forming an Ni layer on both front and back surfaces of the base material, and then etching only the Ni layer formed on the front surface of the base material.
    Type: Grant
    Filed: September 22, 2009
    Date of Patent: May 17, 2011
    Assignee: Sumitomo Metal Mining Co., Ltd.
    Inventor: Juntaro Mikami
  • Lead frame and method of manufacturing the same
    Publication number: 20110092028
    Abstract: A lead frame includes a base material having a front surface for mounting of a semiconductor chip and a back surface for connection with an external board, and an Ni layer having a thick section and thin section. The thick section is formed on the back surface of the base material, whereas the thin section is formed on all or a part of the front surface of the base material. It is preferable that the thick section has a thickness ranging from 2.5 to 5 ?m, and the thin section is 0.5-2 ?m thinner than the thick section. The lead frame can be manufactured with improved productivity by forming an Ni layer on both front and back surfaces of the base material, and then etching only the Ni layer formed on the front surface of the base material.
    Type: Application
    Filed: December 20, 2010
    Publication date: April 21, 2011
    Applicant: SUMITOMO METAL MINING CO., LTD.
    Inventor: Juntaro Mikami
  • Lead frame and method of manufacturing the same
    Publication number: 20100078785
    Abstract: A lead frame includes a base material having a front surface for mounting of a semiconductor chip and a back surface for connection with an external board, and an Ni layer having a thick section and thin section. The thick section is formed on the back surface of the base material, whereas the thin section is formed on all or a part of the front surface of the base material. It is preferable that the thick section has a thickness ranging from 2.5 to 5 ?m, and the thin section is 0.5-2 ?m thinner than the thick section. The lead frame can be manufactured with improved productivity by forming an Ni layer on both front and back surfaces of the base material, and then etching only the Ni layer formed on the front surface of the base material.
    Type: Application
    Filed: September 22, 2009
    Publication date: April 1, 2010
    Applicant: SUMITOMO METAL MINING CO., LTD.
    Inventor: Juntaro Mikami