Patents by Inventor Juntaro Seki

Juntaro Seki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7658538
    Abstract: A method for evaluating a solder joint portion by means of which a part and a substrate are joined to each other includes a preparation process for preparing the substrate including the solder joint portion, a thermal shock process for applying thermal shock to the solder joint portion multiple times, and an evaluation process for obtaining a change of a crystal grain size in the solder joint portion caused by the application of the thermal shock so as to evaluate a lifespan of the solder joint portion based on the change of the crystal grain size obtained.
    Type: Grant
    Filed: March 27, 2008
    Date of Patent: February 9, 2010
    Assignee: Aisin Seiki Kabushiki Kaisha
    Inventors: Hirofumi Koike, Akikazu Matsumoto, Wataru Yagi, Takefumi Isogai, Yoshiharu Hirose, Hiroaki Kadoura, Juntaro Seki, Hisaaki Takao
  • Publication number: 20080240201
    Abstract: A method for evaluating a solder joint portion by means of which a part and a substrate are joined to each other includes a preparation process for preparing the substrate including the solder joint portion, a thermal shock process for applying thermal shock to the solder joint portion multiple times, and an evaluation process for obtaining a change of a crystal grain size in the solder joint portion caused by the application of the thermal shock so as to evaluate a lifespan of the solder joint portion based on the change of the crystal grain size obtained.
    Type: Application
    Filed: March 27, 2008
    Publication date: October 2, 2008
    Applicant: AISIN SEIKI KABUSHIKI KAISHA
    Inventors: Hirofumi KOIKE, Akikazu MATSUMOTO, Wataru YAGI, Takefumi ISOGAI, Yoshiharu HIROSE, Hiroaki KADOURA, Juntaro SEKI, Hisaaki TAKAO