Patents by Inventor Jun-Wei Chung

Jun-Wei Chung has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Apparatus and Method for Die Bonding
    Publication number: 20130122610
    Abstract: A die bonding apparatus and a die bonding method are provided, which are capable of simultaneously bonding a plurality of dies from a first placement area onto a substrate disposed on a second placement area. The die bonding apparatus includes a die sucking device which is movably located above the first placement area and a second placement area. The die sucking device includes a plurality of nozzles. The nozzles can suck the dies disposed on the first placement area, and then simultaneously bond the dies onto the substrate.
    Type: Application
    Filed: May 1, 2012
    Publication date: May 16, 2013
    Applicant: WALSIN LIHWA CORPORATION
    Inventors: Jun-Wei Chung, Wei-Cheng Lou, Jung-Kun Wu, Chung-I Chiang