Patents by Inventor JUN-XI LIU

JUN-XI LIU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Apparatus for disassembling electronic component from circuit board
    Patent number: 10849260
    Abstract: An apparatus for disassembling an electronic component from a circuit board includes a base, a controller, a positioning assembly, and a heating and suction assembly. The controller is fixed to the base. The positioning assembly is arranged on the base and coupled to the controller. The positioning assembly is configured to be controlled by the controller to position the circuit board at a first predetermined position. The heating and suction assembly is movably arranged on the base and coupled to the controller. The heating and suction assembly is moved to a second predetermined position to heat the electronic component and moved to a third predetermined position to attract and hold the heated electronic component by suction, whereby the electronic component is disassembled from the circuit board.
    Type: Grant
    Filed: June 5, 2018
    Date of Patent: November 24, 2020
    Assignees: Fu Tai Hua Industry (Shenzhen) Co., Ltd., HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: Jin-Song Zheng, Jing-Bin Liang, Hai-Gui Huang, Jun-Xi Liu, Ming-Jun Yi, Er-Hui Guo, Zhou Chen, Xi-Qiang Hu
  • APPARATUS FOR DISASSEMBLING ELECTRONIC COMPONENT FROM CIRCUIT BOARD
    Publication number: 20180288912
    Abstract: An apparatus for disassembling an electronic component from a circuit board includes a base, a controller, a positioning assembly, and a heating and suction assembly. The controller is fixed to the base. The positioning assembly is arranged on the base and coupled to the controller. The positioning assembly is configured to be controlled by the controller to position the circuit board at a first predetermined position. The heating and suction assembly is movably arranged on the base and coupled to the controller. The heating and suction assembly is moved to a second predetermined position to heat the electronic component and moved to a third predetermined position to attract and hold the heated electronic component by suction, whereby the electronic component is disassembled from the circuit board.
    Type: Application
    Filed: June 5, 2018
    Publication date: October 4, 2018
    Inventors: JIN-SONG ZHENG, JING-BIN LIANG, HAI-GUI HUANG, JUN-XI LIU, MING-JUN YI, ER-HUI GUO, ZHOU CHEN, XI-QIANG HU
  • Apparatus for disassembling electronic component from circuit board
    Patent number: 10021820
    Abstract: An apparatus for disassembling an electronic component from a circuit board includes a base, a controller, a positioning assembly, and a heating and suction assembly. The controller is fixed to the base. The positioning assembly is arranged on the base and coupled to the controller. The positioning assembly is configured to be controlled by the controller to position the circuit board at a first predetermined position. The heating and suction assembly is movably arranged on the base and coupled to the controller. The heating and suction assembly is moved to a second predetermined position to heat the electronic component and moved to a third predetermined position to attract and hold the heated electronic component by suction, whereby the electronic component is disassembled from the circuit board.
    Type: Grant
    Filed: September 8, 2015
    Date of Patent: July 10, 2018
    Assignees: Fu Tai Hua Industry (Shenzhen) Co., Ltd., HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: Jin-Song Zheng, Jing-Bin Liang, Hai-Gui Huang, Jun-Xi Liu, Ming-Jun Yi, Er-Hui Guo, Zhou Chen, Xi-Qiang Hu
  • APPARATUS FOR DISASSEMBLING ELECTRONIC COMPONENT FROM CIRCUIT BOARD
    Publication number: 20160353622
    Abstract: An apparatus for disassembling an electronic component from a circuit board includes a base, a controller, a positioning assembly, and a heating and suction assembly. The controller is fixed to the base. The positioning assembly is arranged on the base and coupled to the controller. The positioning assembly is configured to be controlled by the controller to position the circuit board at a first predetermined position. The heating and suction assembly is movably arranged on the base and coupled to the controller. The heating and suction assembly is moved to a second predetermined position to heat the electronic component and moved to a third predetermined position to attract and hold the heated electronic component by suction, whereby the electronic component is disassembled from the circuit board.
    Type: Application
    Filed: September 8, 2015
    Publication date: December 1, 2016
    Inventors: JIN-SONG ZHENG, JING-BIN LIANG, HAI-GUI HUANG, JUN-XI LIU, MING-JUN YI, ER-HUI GUO, ZHOU CHEN, XI-QIANG HU