Abstract: Representative embodiments provide an InAlN/GaN MISHFET having a predetermined breakdown voltage, calibrated to a permittivity-thickness parameter and selectable before or during transistor fabrication, which can be greater than 700 V for a normally-off InAlN/GaN MISHFET. Representative embodiments include a first dielectric layer coupled to a gate and to an InAlN barrier layer, a second dielectric layer, and an optional third dielectric layer. The first dielectric layer comprises a first dielectric material having a first predetermined thickness and a first relative permittivity.

Abstract: Representative embodiments provide an InAlN/GaN MISHFET having a predetermined breakdown voltage, calibrated to a permittivity-thickness parameter and selectable before or during transistor fabrication, which can be greater than 700 V for a normally-off InAlN/GaN MISHFET. Representative embodiments include a first dielectric layer coupled to a gate and to an InAlN barrier layer, a second dielectric layer, and an optional third dielectric layer. The first dielectric layer comprises a first dielectric material having a first predetermined thickness and a first relative permittivity.

Abstract: In one example, we describe a new high performance AlGaN/GaN metal-insulator-semiconductor heterostructure field-effect transistor (MISHFET), which was fabricated using HfO2 as the surface passivation and gate insulator. The gate and drain leakage currents are drastically reduced to tens of nA, before breakdown. Without field plates, for 10 ?m of gate-drain spacing, the off-state breakdown voltage is 1035V with a specific on-resistance of 0.9 m?-cm2. In addition, there is no current slump observed from the pulse measurements. This is the best performance reported on GaN-based, fast power-switching devices on sapphire, up to now, which efficiently combines excellent device forward, reverse, and switching characteristics. Other variations, features, and examples are also mentioned here.

Abstract: In one example, we describe a new high performance AlGaN/GaN metal-insulator-semiconductor heterostructure field-effect transistor (MISHFET), which was fabricated using HfO2 as the surface passivation and gate insulator. The gate and drain leakage currents are drastically reduced to tens of nA, before breakdown. Without field plates, for 10 ?m of gate-drain spacing, the off-state breakdown voltage is 1035V with a specific on-resistance of 0.9 m?-cm2. In addition, there is no current slump observed from the pulse measurements. This is the best performance reported on GaN-based, fast power-switching devices on sapphire, up to now, which efficiently combines excellent device forward, reverse, and switching characteristics. Other variations, features, and examples are also mentioned here.