Abstract: Embodiments disclosed herein include package substrates with glass stiffeners. In an embodiment, the package substrate comprises a first layer, where the first layer comprises glass. In an embodiment, the package substrate comprises a second layer over the first layer, where the second layer is a buildup film. In an embodiment, the package substrate further comprises an electrically conductive interconnect structure through the first layer and the second layer.

Abstract: An electronic device can include an interposer, a first porous polymer layer, and one or more die. The interposer can include a metallic through via extending from a first surface of the interposer to a second surface of the interposer. The first polymer layer can be adjacent to the first surface of the interposer. The one or more dies can be coupled to the first porous polymer layer and connected to the metallic through via.

Abstract: A hybrid function LED auxiliary lamp is provided. The auxiliary lamp comprises a housing and a lighting assembly disposed within the housing. The lighting assembly includes a plurality of LED light sources mounted on a printed circuit board. An optical manifold comprising a plurality of reflective cavities is mounted on the printed circuit board. Each reflective cavity defines a respective corresponding focal point. The LED light sources are aligned with respect to the optical manifold such that a center of each respective LED light source corresponds to a respective focal point of a reflective cavity.

Abstract: A hybrid function LED auxiliary lamp is provided. The auxiliary lamp comprises a housing and a lighting assembly disposed within the housing. The lighting assembly includes a plurality of LED light sources mounted on a printed circuit board. An optical manifold comprising a plurality of reflective cavities is mounted on the printed circuit board. Each reflective cavity defines a respective corresponding focal point. The LED light sources are aligned with respect to the optical manifold such that a center of each respective LED light source corresponds to a respective focal point of a reflective cavity.

Abstract: In one embodiment, a substrate includes a glass core layer defining a plurality of holes between a first side of the glass core layer and a second side of the glass core layer opposite the first side and a conductive metal inside the holes of the glass core layer. The conductive metal electrically couples the first side of the glass core layer and the second side of the glass core layer. The substrate also includes a dielectric material between the conductive metal and the inside surfaces of the holes of the glass core layer.

Abstract: In one embodiment, a substrate includes a glass core layer defining a plurality of holes between a first side of the glass core layer and a second side of the glass core layer opposite the first side and a conductive metal inside the holes of the glass core layer. The conductive metal electrically couples the first side of the glass core layer and the second side of the glass core layer. The substrate also includes a dielectric material between the conductive metal and the inside surfaces of the holes of the glass core layer.

Abstract: Embodiments described herein may be related to apparatuses, processes, and techniques directed an optical waveguide formed in a glass layer. The optical waveguide may be formed by creating a first trench extending from a surface of the glass layer, and then creating a second trench extending from the bottom of the first trench, then subsequently filling the trenches with a core material which may then be topped with a cladding material. Other embodiments may be described and/or claimed.

Abstract: Embodiments described herein may be related to apparatuses, processes, and techniques directed to a double-sided glass substrate, to which a PIC is hybrid bonded to a first side of the glass substrate. A die is coupled with the second side of the glass substrate opposite the first side, the PIC and the die are electrically coupled with electrically conductive through glass vias that extend from the first side of the glass substrate to the second side of the glass substrate. Other embodiments may be described and/or claimed.

Abstract: An apparatus is described. The apparatus includes a semiconductor chip package substrate having alternating metal and dielectric layers. First and second ones of the dielectric layers that are directly above and directly below a first of the metal layers that is patterned to have supply and/or reference voltage structures have respectively higher dielectric constant (Dk) and higher dissipation factor (Df) than third and fourth ones of the dielectric layers that are directly above and directly below a second of the metal layers that is patterned to have signal wires that are to transport signals having a pulse width of 1 ns or less.

Abstract: Composite IC die package including IC die on both a first and second side of an interposer. The backside of first IC die are attached, for example through a direct bond, to a first side of the interposer. Redistribution layer (RDL) metal features are then fabricated, for example with semi-additive processes (SAP), to form interconnects to the frontside of the first die that terminate at first-level interconnect (FLI) interfaces. The frontside of second IC are attached, for example through a direct bond, to a second side of the interposer. Through vias in the interposer couple the second IC die to the first IC die and/or the FLI interfaces. Through vias of the interposer may be coupled to pillars on the first side of the interposer with the first IC die positioned between the pillars, facilitating power delivery to the second IC die.

Abstract: An electronic substrate may be formed having at least one dielectric layer that is heterogeneous. The heterogeneous dielectric layer may comprise three separately formed materials that decouple the critical regions within a dielectric layer and allow for the optimization of desired interfacial properties, while minimizing the impact to the bulk requirements of the electronic substrate.

Abstract: Systems and methods disclosed provide a device that effectively replaces the aPTT test. Chemical sensors are employed that bind to heparin and produce an acoustic signal. The acoustic signal is then used to monitor anti-coagulation therapy, instead of drawing blood, as in the aPTT test. Other quantities of interest can also be measured and monitored.

Abstract: The present invention includes upconversion materials such as lanthanide-sensitized oxides that are useful for converting low-energy photons into high-energy photons. Because silicon-based solar cells have an intrinsic optical band-gap of 1.1 eV, low-energy photons having a wavelength longer than 1100 nm, e.g., infrared photons, cannot be absorbed by the solar cell and used for photovoltaic energy conversion. Only those photons that have an energy equal to or greater than the solar cell's band gap, e.g., visible photons, can be absorbed and used for photovoltaic energy conversion. The oxides described herein transform photons having an energy less than the energy of a solar cell's band gap into photons having an energy equal to or greater than the energy of the band gap. When these oxides are incorporated into a solar cell, they provide more photons for photovoltaic energy conversion than otherwise would be available in their absence.

Abstract: The present invention includes upconversion materials such as lanthanide-sensitized oxides that are useful for converting low-energy photons into high-energy photons. Because silicon-based solar cells have an intrinsic optical band-gap of 1.1 eV, low-energy photons having a wavelength longer than 1100 nm, e g., infrared photons, cannot be absorbed by the solar cell and used for photovoltaic energy conversion. Only those photons that have an energy equal to or greater than the solar cell's band gap, e.g., visible photons, can be absorbed and used for photovoltaic energy conversion. The oxides described herein transform photons having an energy less than the energy of a solar cell's band gap into photons having an energy equal to or greater than the energy of the band gap. When these oxides are incorporated into a solar cell, they provide more photons for photovoltaic energy conversion than otherwise would be available in their absence.

Abstract: The present invention provides a compound having the chemical formula of R.sub.2 MB.sub.10 O.sub.19, wherein R is one or more elements selected from the group consisting of rare-earth elements or Y; M is selected from the group consisting of Ca, Sr, Ba, a single crystal of the compound, a producing method and uses thereof. The compound is congruently melting, which is suitable for producing large size single crystal of R.sub.2 MB.sub.10 O.sub.19 with melt methods, especially pulling method, at a low cost. The crystal resulted therefrom has the same NLO effect as LBO with superior mechanical properties, and it is antideliquenscent. The crystal of the present invention can be used for the frequency-conversion of blue-green wavelength lasers.