Patents by Inventor Junxin Wei

Junxin Wei has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Pulse current-assisted roll bonding method for magnesium/titanium composite plate with large thickness ratio
    Patent number: 12370774
    Abstract: A pulse current-assisted roll bonding method for a magnesium/titanium composite plate with a large thickness ratio is provided. The specific steps are as follows: 1, pre-treating a slab; 2, applying a pulse current; 3, rolling and bonding; and 4, post-treating the slab. The magnesium/titanium composite plate with the large thickness ratio is obtained.
    Type: Grant
    Filed: December 27, 2024
    Date of Patent: July 29, 2025
    Assignee: TAIYUAN UNIVERSITY OF TECHNOLOGY
    Inventors: Jianchao Han, Junxin Wei, Wei Zhang, Shuaishuai Zhang, Hui Niu, Litao Gou, Yi Jia, Zhongkai Ren, Yuanming Liu, Tao Wang
  • PULSE CURRENT-ASSISTED ROLL BONDING METHOD FOR MAGNESIUM/TITANIUM COMPOSITE PLATE WITH LARGE THICKNESS RATIO
    Publication number: 20250222679
    Abstract: A pulse current-assisted roll bonding method for a magnesium/titanium composite plate with a large thickness ratio is provided. The specific steps are as follows: 1, pre-treating a slab; 2, applying a pulse current; 3, rolling and bonding; and 4, post-treating the slab. The magnesium/titanium composite plate with the large thickness ratio is obtained.
    Type: Application
    Filed: December 27, 2024
    Publication date: July 10, 2025
    Inventors: Jianchao HAN, Junxin WEI, Wei ZHANG, Shuaishuai ZHANG, Hui NIU, Litao GOU, Yi JIA, Zhongkai REN, Yuanming LIU, Tao WANG
  • MAGNESIUM/TITANIUM COMPOSITE PLATE WITH LARGE THICKNESS RATIOS AND GRADIENT HETEROTHERMAL ROLLING BONDING METHOD
    Publication number: 20250041961
    Abstract: A magnesium/titanium composite plate with large thickness ratios and a gradient heterothermal rolling bonding method are provided by the present disclosure, relating to the technical field of rolling bonding plates. The method includes following steps: assembling blanks according to a sequence of titanium strip, transition layer foil and magnesium alloy plate to obtain a composite blank; carrying out induction heating treatment on one side of the titanium strip of the composite blank, then rolling, and carrying out heat treatment on a composite plate blank after rolling to obtain the magnesium/titanium composite plate with large thickness ratios; and a thickness ratio of the magnesium alloy plate to the titanium strip is greater than or equal to 20:1.
    Type: Application
    Filed: March 21, 2024
    Publication date: February 6, 2025
    Inventors: Jianchao HAN, Junxin WEI, Shuaishuai ZHANG, Zhenhao YUAN, Yizhi ZHANG, Ran LI, Xinxin LIU, Yi JIA, Tao WANG
  • Magnesium/titanium composite plate with large thickness ratios and gradient heterothermal rolling bonding method
    Patent number: 12214440
    Abstract: A magnesium/titanium composite plate with large thickness ratios and a gradient heterothermal rolling bonding method are provided by the present disclosure, relating to the technical field of rolling bonding plates. The method includes following steps: assembling blanks according to a sequence of titanium strip, transition layer foil and magnesium alloy plate to obtain a composite blank; carrying out induction heating treatment on one side of the titanium strip of the composite blank, then rolling, and carrying out heat treatment on a composite plate blank after rolling to obtain the magnesium/titanium composite plate with large thickness ratios; and a thickness ratio of the magnesium alloy plate to the titanium strip is greater than or equal to 20:1.
    Type: Grant
    Filed: March 21, 2024
    Date of Patent: February 4, 2025
    Assignee: TAIYUAN UNIVERSITY OF TECHNOLOGY
    Inventors: Jianchao Han, Junxin Wei, Shuaishuai Zhang, Zhenhao Yuan, Yizhi Zhang, Ran Li, Xinxin Liu, Yi Jia, Tao Wang