Abstract: Disclosed are a chip protective film, a method for manufacturing the same, and a chip, which relate to the technical field of electronic chip protective films. The chip protective film includes: a first protective layer, and a second protective layer attached to at least a portion of a surface of the first protective layer. The second protective layer includes by mass: 90%-97% acrylate compounds; 0.1-5% fluorine-containing compounds; and a second adjuvant. The chip protective film features strong adhesion, low friction coefficient, high hardness, and good scratch resistance, which effectively solves the technical problem in the prior art that chip protective films are not scratch resistant.

Abstract: The present disclosure provides a method for modifying a polyphenylene ether resin, a laminated film composite, a laminated film, and a substrate. The method for modifying a polyphenylene ether resin using an indene oligomer to reduce the molecular weight of the polyphenylene ether to obtain an indene oligomer-modified polyphenylene ether resin. The modified polyphenylene ether with a smaller molecular weight has a lower softening point and melting point, a better interfacial adhesion, and can be better adhered to a substrate of an integrated circuit. Meanwhile, because it has a lower dielectric constant and dielectric loss, the dielectric constant and dielectric loss of the substrate can be reduced, thereby solving the technical problem of electric leakage and heat generation caused when the existing polyphenylene ether resin is applied to an integrated circuit when the feature size of the integrated circuit is reduced.

Abstract: The present application discloses a die sealant for chip packaging and a packaging structure, wherein epoxy resin adopted in the die sealant has flexible units such as polyether. In combination with the compounding of components such as a curing agent and a diluent, good flexibility and strength are achieved, and warpage is effectively reduced, wherein the warpage can be reduced to 0 mm, the modulus can reach up to 8 GPa or above, good silicon adhesion is achieved, and a silicon wafer can be effectively protected from bending cracks caused by warpage. Moreover, by adding a p-tert-butylphenol epoxy resin diluent, impacts of a monofunctional aliphatic diluent on a curing system can be further reduced effectively, and the flexibility and modulus of the die sealant can be further improved.

Abstract: The present application discloses a composition, an adhesive film including the composition and a chip packaging structure. The composition includes epoxy resin, a surfactant, a curing agent and filler, wherein the surfactant is selected from a modified hexafluoropropylene compound. The surfactant in the composition is the modified hexafluoropropylene compound, the modified hexafluoropropylene compound is lower in surface energy, good in water resistance and oil resistance and capable of effectively lowering the surface tension of the composition, and therefore, when being used for preparing the adhesive film, the composition is higher in coating wettability. In, addition, the composition has stronger chemical cleaning resistance, and in a process that a residual solder flux obtained in a soldering process of a chip is cleaned, a chip protection film prepared from the composition has stronger cleaning resistance to an alkaline solution so as not to be easy to fall off.

Abstract: Disclosed are a chip protective film, a method for manufacturing the same, and a chip, which relate to the technical field of electronic chip protective films. The chip protective film includes: a first protective layer, and a second protective layer attached to at least a portion of a surface of the first protective layer. The second protective layer includes by mass: 90%-97% acrylate compounds; 0.1-5% fluorine-containing compounds; and a second adjuvant. The chip protective film features strong adhesion, low friction coefficient, high hardness, and good scratch resistance, which effectively solves the technical problem in the prior art that chip protective films are not scratch resistant.

Abstract: The present application discloses a composition, an adhesive film including the composition and a chip packaging structure. The composition includes epoxy resin, a surfactant, a curing agent and filler, wherein the surfactant is selected from a modified hexafluoropropylene compound. The surfactant in the composition is the modified hexafluoropropylene compound, the modified hexafluoropropylene compound is lower in surface energy, good in water resistance and oil resistance and capable of effectively lowering the surface tension of the composition, and therefore, when being used for preparing the adhesive film, the composition is higher in coating wettability. In addition, the composition has stronger chemical cleaning resistance, and in a process that a residual solder flux obtained in a soldering process of a chip is cleaned, a chip protection film prepared from the composition has stronger cleaning resistance to an alkaline solution so as not to be easy to fall off.

Abstract: The present application discloses an underfill for chip packaging, including 19-25% of epoxy resin, 55-60% of filler, 15-25% of curing agent and 0.5-0.8% of accelerator in mass percentage, wherein the curing agent includes a polycondensate of paraxylene and dihydroxynaphthalene and a polycondensate of paraxylene and naphthol. Both of the polycondensate of paraxylene and dihydroxynaphthalene and the polycondensate of paraxylene and naphthol are selected to be used in the underfill for chip packaging in the present application, so that the underfill has stronger adhesiveness after being cured. In addition, the present application further provides a chip packaging structure using the underfill.

Abstract: Embodiments of the present application disclose an adhesive, a die attach film and a preparation method therefor, and relate to the technical field of chip packaging. The adhesive includes epoxy resin, phenoxy resin, an indene oligomer, filler and a curing agent; and 20-60 parts of the epoxy resin, 20-30 parts of the phenoxy resin, 5-10 parts of the indene oligomer, 15-30 parts of the filler and 1-5 parts of the curing agent are provided in parts by mass. The present application further provides the die attach film and the preparation method therefor. In the adhesive provided by the present application, the epoxy resin, the phenoxy resin and the indene oligomer are used as curable substrates to improve a thermal stress obtained after the adhesive is cured, so that the die attach film prepared therefrom is not easy to warp in a temperature change process.

Abstract: A high-glossiness epoxy molding compound (EMC) film for protecting a chip and a preparation method thereof are disclosed. The high-glossiness EMC film for protecting a chip includes: 40 to 100 parts by mass of an epoxy resin; 2 to 5 parts by mass of glass epoxy; 45 to 55 parts by mass of fused silica; and 1 to 5 parts by mass of a curing system, where the fused silica has a particle size D50 of 0.15 ?m to 0.6 ?m. The glossiness of the protective film of the present disclosure is significantly improved, such that the clarity of characters inscribed by a laser under a bright field of a microscope can be further improved, which allows a device to effectively recognize the characters.

Abstract: Embodiments of the present application disclose an adhesive, a die attach film and a preparation method therefor, and relate to the technical field of chip packaging. The adhesive includes epoxy resin, phenoxy resin, an indene oligomer, filler and a curing agent; and 20-60 parts of the epoxy resin, 20-30 parts of the phenoxy resin, 5-10 parts of the indene oligomer, 15-30 parts of the filler and 1-5 parts of the curing agent are provided in parts by mass. The present application further provides the die attach film and the preparation method therefor. In the adhesive provided by the present application, the epoxy resin, the phenoxy resin and the indene oligomer are used as curable substrates to improve a thermal stress obtained after the adhesive is cured, so that the die attach film prepared therefrom is not easy to warp in a temperature change process.

Abstract: The present application discloses an underfill for chip packaging, including 19-25% of epoxy resin, 55-60% of filler, 15-25% of curing agent and 0.5-0.8% of accelerator in mass percentage, wherein the curing agent includes a polycondensate of paraxylene and dihydroxynaphthalene and a polycondensate of paraxylene and naphthol. Both of the polycondensate of paraxylene and dihydroxynaphthalene and the polycondensate of paraxylene and naphthol are selected to be used in the underfill for chip packaging in the present application, so that the underfill has stronger adhesiveness after being cured. In addition, the present application further provides a chip packaging structure using the underfill.

Abstract: A liquid molding compound for protecting five edges of a semiconductor chip and a preparation method thereof are disclosed. The liquid molding compound includes 15 to 40 parts by mass of an epoxy resin, 15 to 35 parts by mass of a curing agent, 0.1 to 3 parts by mass of a curing accelerator, 4 to 15 parts by mass of a toughening agent, 75 to 150 parts by mass of an inorganic filler, and 0.1 to 5 parts by mass of a coupling agent. The epoxy resin is one or more selected from the group consisting of a bisphenol A epoxy resin, a bisphenol F epoxy resin, and a biphenyl epoxy resin. The toughening agent is an adduct of an epoxy resin and a carboxyl-terminated liquid butyronitrile rubber, and the curing agent is a phenol-formaldehyde resin. The molding compound has a low coefficient of thermal expansion (CTE).

Abstract: A liquid molding compound for protecting five edges of a semiconductor chip and a preparation method thereof are disclosed. The liquid molding compound includes 15 to 40 parts by mass of an epoxy resin, 15 to 35 parts by mass of a curing agent, 0.1 to 3 parts by mass of a curing accelerator, 4 to 15 parts by mass of a toughening agent, 75 to 150 parts by mass of an inorganic filler, and 0.1 to 5 parts by mass of a coupling agent. The epoxy resin is one or more selected from the group consisting of a bisphenol A epoxy resin, a bisphenol F epoxy resin, and a biphenyl epoxy resin. The toughening agent is an adduct of an epoxy resin and a carboxyl-terminated liquid butyronitrile rubber, and the curing agent is a phenol-formaldehyde resin. The molding compound has a low coefficient of thermal expansion (CTE).

Abstract: A circuit build-up film for wafer-level packaging (WLP) includes 40 to 60 parts by mass of a first epoxy resin, 15 to 30 parts by mass of a second epoxy resin, 25 to 50 parts by mass of a curing agent, 0.1 to 5 parts by mass of a curing accelerator, 5 to 20 parts by mass of an additive, 320 to 650 parts by mass of an inorganic filler, and 0.01 to 5 parts by mass of a silane coupling agent (SCA), where the additive is obtained by subjecting an epoxy resin to a reaction with a polyhydroxyl-terminated dendritic crosslinking agent. The build-up film shows prominent fluidity during heating and curing, and can completely fill gaps among wafers. A packaging process using the build-up film is simple. Regardless of the number of wafers, packaging can be completed through one procedure with the build-up film.