Abstract: A vehicle driving assistance system includes a vehicle side communication system and a base point side communication system. The base point side communication system includes: a receiving part which receives the vehicle information and the video image information; a drive route operation part which searches for a drive route of the vehicle; an object discrimination part which recognizes an object existing on the drive route; a collision judgment part which judges about whether there is a risk of collision with the object; an information determination part which selects video image information for transmitting, according to the type of collision; a transmitting part which transmits the video image information to the vehicle, having the vehicle side communication system. The vehicle driving assistance system is configured so that the video image information from a vehicle can be transmitted according to the situation of driving assistance.

Abstract: A vehicle driving assistance system includes a vehicle side communication system and a base point side communication system. The base point side communication system includes: a receiving part which receives the vehicle information and the video image information; a drive route operation part which searches for a drive route of the vehicle; an object discrimination part which recognizes an object existing on the drive route; a collision judgment part which judges about whether there is a risk of collision with the object; an information determination part which selects video image information for transmitting, according to the type of collision; a transmitting part which transmits the video image information to the vehicle, having the vehicle side communication system. The vehicle driving assistance system is configured so that the video image information from a vehicle can be transmitted according to the situation of driving assistance.

Abstract: A semiconductor package includes a first insulating substrate, a second insulating substrate, and a plurality of semiconductor chip units placed between the first and second insulating substrates. The first insulating substrate has wiring placed on one surface thereof and has first electrically conductive balls which are used as external connection terminals and second electrically conductive balls which radiate heat. The first and second electrically conductive balls are on the other surface thereof. The second insulating substrate is placed opposite to the one surface of the first insulating substrate. Each semiconductor chip unit has a semiconductor chip; a circuit board which has the semiconductor chip mounted thereon and wiring electrically connected to terminals of the semiconductor chip; and a third insulating substrate which is placed on the circuit board and which has a chip cavity for housing the semiconductor chip.

Abstract: A semiconductor package includes a first insulating substrate, a second insulating substrate, and a plurality of semiconductor chip units placed between the first and second insulating substrates. The first insulating substrate has wiring placed on one surface thereof and has first electrically conductive balls which are used as external connection terminals and second electrically conductive balls which radiate heat. The first and second electrically conductive balls are on the other surface thereof. The second insulating substrate is placed opposite to the one surface of the first insulating substrate. Each semiconductor chip unit has a semiconductor chip; a circuit board which has the semiconductor chip mounted thereon and wiring electrically connected to terminals of the semiconductor chip; and a third insulating substrate which is placed on the circuit board and which has a chip cavity for housing the semiconductor chip.